1. Design and Technology of DEPFET Active Pixel Sensors for Future e+e- Linear Collider Experiments G. Lutz a, L. Andricek a, P. Fischer b, K. Heinzinger c, P. Lechner c, I.Peric d, M. Reiche e, R.H. Richter a, G. Schaller a, M. Schnecke a, F. Schopper a, H. Soltau c, L. Strüder a, J. Treis a, M. Trimpl d, J. Ulrici d, N. Wermes d a)MPI Halbleiterlabor Munich, Germany b)University of Mannheim, Germany c)PNSensor gGmbH Munich, Germany d)University of Bonn, Germany e)MPI für Mikrostrukturphysik Halle, Germany

2. Content Introduction DEPFET principle and properties DEPFET pixel detectors Pixel detector prototypes (for LC and X-ray astronomy) Module concept Steering and readout chip Matrix Test results Power consumption Conclusion

3. Introduction Requirements for Linear colliders (example: TESLA) –Precise vertexing with low momentum tracks requires: High granularity pixel detectors Low multiple scattering  thin detectors, avoidance of cooling of sensor  low power consumption Limitation of occupancy  sufficiently high readout speed DEPFET pixel detectors are able to fulfill these requirements –Due to particular function principle –Developed and built in own laboratory of the MPI –Electronics and system developed in close collaboration with Universities Bonn and Mannheim

4. DEPFET principle and properties Function principle –Field effect transistor on top of fully depleted bulk –All charge generated in fully depleted bulk; assembles underneath the transistor channel; steers the transistor current –Clearing by positive pulse on clear electrode –Combined function of sensor and amplifier DEPFET structure and device symbol

5. DEPFET principle and properties Properties –low capacitance ► low noise –Signal charge remains undisturbed by readout ► repeated readout –Complete clearing of signal charge ► no reset noise –Full sensitivity over whole bulk ► large signal for m.i.p.; X-ray sens. –Thin radiation entrance window on backside ► X-ray sensitivity –Charge collection also in turned off mode ► low power consumption –Measurement at place of generation ► no charge transfer (loss) ► Operation over very large temperature range ► no cooling needed DEPFET structure and device symbol

6. DEPFET Operation: Energy Resolution Setup:  source follower read out  commercial pre-amp  shaping time 6 μs Result at Room Temperature:  131 eV @ 5.9 keV  2.2 el. r.m.s. Circular DEPFET out of Prototype DEPFET pixel fabrication run at MPI

7. DEPFET Pixel Detector Operation Mode Large area covered with DEPFETS Individual transistors or rows of transistors Can be selected for readout All other transistors are turned off Those are still able to collect signal charge Very low power consumption

8. DEPFET pixel detector prototypes Two projects on same wafer, two different geometries: XEUS (future X-ray observatory): Circular (enclosed) geometry Source readout Linear collider: Rectangular geometry Drain readout

9. DEPFET Technology at HLL extended: Double poly / double metal process cut perpendicular to channel (with clear) Summary of technology properties 1. Test diodes (fully depleted 450 μm) V dep = 30..40 V and 130..150 V I leak = 100..200 pA/cm 2 V fb = -1 V 2. ILD Quality (Breakdown Voltage) Poly I to Si:V B > 100 V Poly II to Si:V B > 100 V Metal I to Si:V B > 200 V Poly I to Poly II:V B > 20 V p channel implant n+ clear clear gate poly I n internal gate metal I metal II gate poly II deep p implant

10. Pixel prototype production (6“ wafer) for XEUS and LC (TESLA) Many test arrays - Circular and linear DEPFETS up to 128 x 128 pixels minimum pixel size about 30 x 30 µm² - variety of special test structures Aim: Select design options for an optimized array operation (no charge loss, high gain, low noise, good clear operation) On base of these results => production of full size sensors Structures requiring only one metalization layer Production up to first metal layer finished Test results agree very well with device simulations

11. The LC sensor matrix  rectangular double pixels (common source)  Depletion type p-channel MOSFETs  linear transistors (small pixels) double pixel cell 33 x 47 µm 2 in DEPFET-Matrix drain gate reset 16x128 DEPFET-Matrix

12. DEPFET measurements on rectangular test transistors (W = 120µm L = 5µm) Output characteristics: Correct transistor behavior Transfer characteristics: Device can be completely switched off Transistor parameters agree with simulation

13. Module concept Thin (50µm) DEPFET pixel detector supported by silicon stiffening frame Row selection electronics on long side of frame (Analog) readout electronics at short end Thin detector technology already developed tested with diodes so far to be describe by L. Andricek on Wednesday

14. Readout row selection chip AMS 0.8µm HV high speed high voltage range (20V) 64 rows=2x64 channels daisy chainable Switcher II: DEPFET Matrix Read Out: ASICs Development at the Universities Bonn and Mannheim 4.6 mm 4.8 mm CURO II: 4.5 mm Fast RO chip for DEPFETs TSMC 0.25µm, 5 metal 128 channels „CUrrent ReadOut“ fast current based memory cells hit identification + zero suppression Correlated double sampling within 40ns

15. Status readout electronics Not yet designed for low power consumption in waiting period between pulse trains Not yet optimally matched to desired pixel geometry Row selection chip RAM & sequencer tested up to 80 MHz Analog performance ok to 30 MHz Drives signals in range 0 to 20V Power consumption at 50MHz: ~ 400mW / chip with active channel ~ 10mW / chip for others CURO readout chip Digital part, the hit-finder and the current-comparator-block both work with desired speed of 50MHz Analog part (memory cell): speed: 25MHz accuracy: 0.1 % noise : < 30 electrons Power consumption 2 mW/channel

16. Readout of complete DEPFETmatrix So far only available for XEUS project Different conditions: Source readout 8-fold double correlated sampling Slow readout: 13µs/row 55 Fe source spectrum in logarithmic scale FWHM of Mn-Ka (5.9keV): 155.1 eV ENC: 11.5 e-

17. Vertex Detector for Linear Collider sensitive area 1 st layer module: 100x13 mm 2, 2 nd -5 th layer : 125x22 mm 2  ∑120 modules TESLA TDR: TESLA TDR Design close to IP, r = 15 mm (1st layer) pixel size: 20-30 μm ~0.1% X 0 per layer overall: ~ 1GPixel 5 barrels – stand alone tracking

18. Module Power consumption during pulse train Thin Detector region (layer 2-5) –Sensor: two active rows 1640x5Vx100µA= 820mW –Switcher: 1 active channel 300mW 4999 passive channels 2500x0.15mW= 375mW –Total in thin detector region during pulse train 1.5W End hybrid region –CURO R/O chip : 820x2 channels x 2mW= 3.3W Readout channels=2xnb.of columns Layer 1:2x512=1024 Layer 2-5: 2x820=1640 Switcher channels=nb.of double rows Layer 1 : 4000/2=2000 Layer 2-5 : 5000/2=2500

19. Vertex detector power consumption During beam train –In thin detector region 120x 1.5W=180W –In cooled end region 120x 3.3W=400W With electronics power turned off in between trains (TESLA) reduction by factor ~ 1/200 –In thin detector region 180W/200 = 0.9W –In cooled end region 400W/200 = 2.0W

20. Conclusions DEPFET Pixel detectors use radically different function principle from other pixel detectors Properties are very well suited for LC applications High S/N ratio at large speed and low power consumption can be obtained for thin detectors Detector fabrication is done in own laboratory Development program is well advanced

22. Performance of Prototype R/O Chip analog part (memory cell): speed: 25MHz accuracy: 0.1 % noise : < 30 electrons digital part: the hit-finder and the current-comparator-block both work with desired speed (50MHz) 0.1% accuracy reached

23. New Readout concept: CURO  front end: automatic pedestal subtraction (double correlated sampling)  analog currents buffered in FIFO  Hit-Logic performs 0 suppression and multiplexes hits to ADC (ADC only digitizes hits !) CURO : CUrrent Read Out

24. 128 channels – CURO II Features:  TSMC 0.25µm, 5metal  Full blown RO Chip with 128 channels  fast correlated double sampling  produced 11/2003  costs: 30k$ CURO II: 4.5 mm Currently under test

25. new steering chip AMS 0.8µm HV versatile sequencing chip (internal sequencer  flexible pattern) high speed + high voltage range (20V) drives 64 DEPFET-rows (can be daisy chained) Switcher II: [I.Peric (Bonn) / P.Fischer (Mannheim)] 4.6 mm 4.8 mm

26. Current based Readout Storage phase: input and sample-switch closed :  gate-capacitance of nmos charged I STORE Transfer phase: output switch closed : (done immediately after sampling)  I STORE is flowing out Sampling phase: input and sample-switch opened :  voltage at capacitance „unchanged“  current unchanged I = I In + I Bias How to store a current ??

27. CURO - Architecture  front end: automatic pedestal subtraction (double correlated sampling) - easy with currents -  analog currents buffered in FIFO  Hit-Logic performs 0 suppression and multiplexes hits to ADC (ADC only digitizes hits !) CURO : CUrrent Read Out

28. Estimated Material Budget (1 st layer): Pixel area: 100x13 mm 2, 50 μm : 0.05% X 0 steer. chips: 100x2 mm 2, 50 μm : 0.008% X 0 (massive) Frame :100x4 mm 2, 300 μm : 0.09% X 0 TESLA Vertex Detector: Material Budget perforated frame: 0.05 % X 0 total: 0.11 % X 0 reduce frame material!!!  "support grid"

29. DEPFET Operation: Amplification  generated electrons are collected in "internal gate" and modulate the transistor current  Signal charge removed via clear contact 2D dynamic simulation of a MOSFET hit response to a generation of 1600 e-h pairs + - - - -- - - - + + + mip prod. 2003: ~0.4 nA/e -

30. DEPFET Operation: Charge Removal  generated electrons are collected in „internal gate“ and modulate the transistor current  Signal charge removed via "Clear" contact - - - - - - - - measurement cycle: sample-clear-sample complete "Clear"  no reset noise! clear voltage (V) Source current (μA) complete "Clear" achieved with Vclear >11 V (confirmed by noise measurements)

31. Background at TESLA High magnetic field to „reduce“ background But still: Rate high ( 80 hits / mm bunchtrain ) One frame per Train: Occupancy 20% !!!!! Simulation : [C.Büssser, DESY]