Expansion Joint Active Monitoring. Team Members Joe Savino Mechanical Engineer Adam Remick Electrical Engineer Andrew Hintermeier Mechanical Engineer.

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Presentation transcript:

Expansion Joint Active Monitoring

Team Members Joe Savino Mechanical Engineer Adam Remick Electrical Engineer Andrew Hintermeier Mechanical Engineer

Risk Analysis IDRisk ItemEffectCause LikelihoodSeverityImportance Action to Minimize Risk 1Battery LifeDAQ Dies before Expected Too much Power Consumption/Not Enough Batteries 224Add Extra Batteries to Ensure Lifespan 2Memory StorageLoses Most Recent Readings Too Large of a Sample Size/Not Enough Memory 122Add Ability to Add Extra uSD Cards/Increase Size of SD Card 3Programming TimeUnfinished ProjectComplexity/Scope of the Project 212Using the Arduino Micro- controller to ease programming difficulties 4Decrease in Max PSI on EJ Reduced EJ SpecsSensor Mounting224Early Testing/Insert Design/Flange Mounting 5Sensor failureFailure to Read New Data Misunderstood Spec Sheet 122Re-read Data Sheet and Call Suppliers with Questions 6Mounting FailureInterference with EJ/Failure to Read Data Bending/Poor Dimension Selection 122Early Testing of Design 7Electronics Box Failure Electronics RuinedUnexpected External Factors 122Full Understanding of Environmental Conditions

Full Assembly

Mounting Mounting Plates Threaded inserts Infrared Sensor String Potentiometer

Preliminary Test Plan for Inserts Follow Garlock’s tests for this EJ style Temperature Test 500 Thermal Cycles Displacement/Pressure Test 3000 Mechanical Cycles 1000 Pressure Cycles Burst Pressure Test Compare to Unmodified EJ

Axial Displacement Infrared String Potentiometer Ultrasonic

Specs Infared String Potentiometer Accuracy:+/ in Price: $305 Vin: 15-30V Vout: 0-10V Ping Sonar Range: 0.02m – 3m Price: $30 Vin: 5V and 3.3V Vout : 5V Accuracy: +/ in Price: $247 Vin: 9V Vout: V

Temperature Insert mounted Probe Price: $38 Vin: Ground Vout: 0-20mV Flange Probe Price: $38 Vin: Ground Vout: 0-20mV

Pressure Regular sensor with heat dissipation stem Price: $350 Vin: 7.5V-30V Vout: 0-5V

Microprocessor Arduino Due Arm Processor 3.3V Logic 3.3V and 5V Regulator on Board 54 Digital I/O’s 12 Analog Inputs (Can have up to 12 sensor inputs) 4 UARTS 84MHz Clock Speed $50 Goals: Input Sensor Data Store sensor Data on SD Card Control a LCD Display Control LED ‘Out of Range’ Lights

Adafruit Micro-SD Card Reader Uses 1 UART Port and 2 Extra I/O Ports Made to Work with Arduino Board $15

LCD Display 4 Lines of 20 Characters Each +5 V input from Arduino Due Uses 11 Digital I/O Pins Will display the max temperature, max displacement and max pressure $25

LED Output Pass fail system: If the EJ has experienced out of range data, LED’s turn on and stay on until uC is reset One for each sensor Uses One I/O port per LED

Block Diagram Micro Pressure Sensor Temperature Sensor Displacement Sensor Pressure LED Temperature LED Displacement LED LCD Display Micro-SD Card D0-D7 Enable R/W D-Out D-In Data Vcc Data Vcc Data Vcc Clk

Bill of Materials ItemQuantityPrice (Total) Arduino Due Test Board1$50.00 LCD Display1$25.00 Micro-SD Card Reader1$15.00 Transistors3$5.00 LED's3$5.00 uSD Card (32GB)1$22.00 Breadboard1$5.00 Random ElectronicsX$10.00 String Potetiometer1$ Ultrasound Ping1$30.00 Thermocouple2$76.00 Pressure transducer1$ " bar stock1 Ft$5.00 1/8"x6" steel plate2 Ft$ /16" - 1/8" adapter2$8.00 1/8" to 1/4" adapter1$4.00 1/8" SS Piping18"$20.00 Misc Harwarex$40.00 Total =$944.00

Schedule TRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRS Detailed Design/Gate Review Order sensors Create insert for testing Have insert tested at Garlock Redesigned Inserts Retest Inserts Create code for DAQ Finalize drawings Determine where/how to create parts Testing Create Code for Data Analysis Create Code or Display

Questions?

Instructions/Example Code SD Card: board-card-tutorial/wiring board-card-tutorial/wiring Analog Input to SD Card Displaying to a LCD Display

Schedule Week 1Week 2Week 3Week 4Week 5Week 6Week 7Week 8Week 9 Week 10 Week 11 Week 12 Week 13 Week 14 Week 15 TRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRSTRS Create Problem Definition Create Customer Needs Create Engineering Specs Create Interview Questions Interview Customer/Garlock Visit Create Functional Decomposition Concept Development Create Pugh Charts Risk Assesment Benchmarking Sensor Research Basic ANSYS Model Engineering Analysis (1st Order) Engineering Analysis (2nd Order) Sensor Selection Test Plans Created Custom Parts Designed Order Sensors Presentations Problem Definition Presentation System Design Review Subsystem Design Review Fourth Presentation DDR Presentation

Back Up Slide

Engineering Analysis Simulated an EJ under compression and tension in ANSYS Workbench Displacement of ±1 inch Used to determine where stress concentrations will be Helps to determine sensor placement

Compression

Tension

Engineering Analysis Avoid areas in the middle of EJ and areas right below or above flanges Embed sensors in between these areas Minimize risk of EJ leaking after sensors are embedded

Engineering Analysis-Insert

Temperature Isolation of Pressure sensor May not be able to find a pressure sensor that can withstand the temperature EJ does Can use a tube protruding from EJ to dissipate heat A stainless steel tube would need to extend at least 6 in out for our applications

Connection Diagram to LED Screen