CERN Rui de OliveiraTS-DEM Rui de Oliveira TS-DEM Large size detectors practical limits based on present knowledge.

Slides:



Advertisements
Similar presentations
Results of a R&D Micromegas Bulk Results of a R&D S. Aune a, M. Boyer a, A. Delbart a, R. De Oliveira b, A. Giganon a, Y. Giomataris a A CEA / DAPNIA,
Advertisements

Presentation Group : 2012 v1 Resistive Bulk prototyping at Cirea 15 June CERN Michel Billant 1.
Recent achievements and projects in Large MPGDs Rui de Oliveira 21/01/2009 RD51 WG1 workshop.
1 MUON TRACKER FOR CBM experiment Murthy S. Ganti, VEC Centre Detector Choice.
1 Short update Itzhak Tserruya HBD meeting BNL, April 11, 2006.
13/04/2011Rui De Oliveira1 Resistors in Cern PCB worshop.
S. Nagarajan, Veeraprasad, G.S. Murthy Electronics Corporation of India Limited (ECIL) Hyderabad, INDIA.
Operational prototype work at CERN Status report MM Gen. Meeting, 06/11/2013 J. Wotschack1.
Micro Pattern Gas Detector Technologies and Applications The work of the RD51 Collaboration Marco Villa (CERN), Andrew White (University of Texas at Arlington)
Read-out boards Rui de Oliveira 16/02/2009 RD51 WG1 workshop Geneva.
TE/MPE/EM/PMT activity Rui de Oliveira on behalf of PCB workshop team 29/11/20121.
Industrial Production of MPGDs Rui de Oliveira Workshop on neutron detection with MPGD CERN October
Atsuhiko Ochi Kobe University / MAMMA collaboration 24/04/2013 RD51 mini week, WG6.
Atsuhiko Ochi Kobe University 28 August 2012 ATLAS muon chambers R&D on micromegas meeting.
CERN PCB workshop activities
Fabrication techniques and industrialization of MPGDs.
1 Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS Production of THGEM at ELTOS S.p.A. Company profile Production procedures.
The work of GEM foil at CIAE
CERN PCB workshop CPW Rui de Oliveira on behalf of PCB workshop team 29/11/20121.
20/04/2012Rui De Oliveira1 20/04/2012. Rui De Oliveira2 30 cm x 30 cm example.
GainEnergy resolution DIRECTION DES SCIENCES DE LA MATIERE LABORATOIRE DE RECHERCHE SUR LES LOIS FONDAMENTALES DE L’UNIVERS CENTRE DE SACLAY Contact :
Situation with industry Rui de Oliveira RD51 CERN October
09/06/2009Rui De Oliveira1 Large MPGD production status.
CERN Rui de OliveiraTS-DEM TS-DEM Development of Electronic Modules Rui de Oliveira CERN CERN hybrid production experience (or how to stay out of trouble)
Situation with industry
Technological Aspects and Developments of New Detector structures
CERN Rui de OliveiraTS-DEM Rui de Oliveira TS-DEM Large size detectors CERN TS-DEM-PMT Capabilities.
15/07/2010Rui De Oliveira1 Update on large size GEM manufacturing Rui de Oliveira.
CERN workshop upgrade Aida fund Transfer to industry Rui De Oliveira 4/13/20111Rui De Oliveira.
EST-DEM R. De Oliveira 20 Dec., ‘04 Production of Gaseous Detector Elements  History of Gas Detectors in Workshop  Fabrication of GEM Detectors  Fabrication.
CERN Workshop upgrade Rui De Oliveira KOBE WG6 WG6 9/1/20111Rui De Oliveira.
CERN workshop upgrade Aida WP 9.2 Rui De Oliveira.
Large area detectors Aida WP 9.2 RD51 WG6
GEM foil and Simulation work at CIAE Xiaomei Li Shouyang Hu, Jing Zhou, Chao Shan, Siyu Jian and Shuhua Zhou Science and Technology Science and Technology.
Charge Transfer Properties Through Graphene Layers (Production & QA of Graphene Samples) P. Thuiner 1,2, R. Hall-Wilton 3, R. B. Jackman 4, H. Müller 1,
Atsuhiko Ochi Kobe University
THGEM-process Rui De Oliveira RD51 22/11/2011 WG6 WG6 22/11/20111Rui De Oliveira.
Working Group 1 WG1 Geometry and Interactions Technological Aspects and Developments of New Detector structures.
Low Mass Rui de Oliveira (CERN) July
RD51 Collaboration: Development of Micro-Pattern Gaseous Detectors technologies Matteo Alfonsi (CERN) on behalf of RD51 Collaboration Current Trends in.
Resistive protections Rui de Oliveira 09/12/15
Plans for MPGD Radiation hardness tests for full detectors and components Matteo Alfonsi,Gabriele Croci, Elena Rocco, Serge Duarte Pinto, Leszek Ropelewski.
Working Group 1 Technological Aspects and Developments of New Detector structures WG1 Geometry and Interactions.
30/09/2010Rui De Oliveira1.  GEM Single mask process  Micromegas  Bulk  Classical  resistive 30/09/2010Rui De Oliveira2.
The Development of the Fabrication Process of Low Mass circuits Rui de Oliveira TS-DEM.
GEM Foil Development at ECIL
CERN Workshop upgrade status Rui De Oliveira RD51 22/11/2011 WG6 WG6 9/1/20111Rui De Oliveira.
Zaragoza, 5 Julyl Construction of and experience with a 2.4 x 1 m² micromegas chambers Givi Sekhniaidze On behalf of the Micromegas community.
R&D ON RESISTIVE TECHNOLOGY FOR MICROMEGAS BUKL STEPHAN AUNE 03/06/2015. S.Aune.
Academia meets Industry: RPC and TGC Vienna University of Technology March 25 th 2014 By R. Santonico.
1 Fulvio TESSAROTTO THGEM discussion, 02/11/2009 THGEM production at ELTOS Production of THGEM at ELTOS S.p.A. Company profile Production procedures Small.
 Large GEM  CMS RE1-1  Kloe  Ns2 ( No stretch No stress)  Large Micromegas  Atlas MAMA project  Large THGEM  Double phase pure argon project 
1 Fulvio TESSAROTTO CERN, 13/11/ COMPASS THGEM meeting Construction of the large size Hybrid Prototype The bulk Micromegas technology Examples of.
Suggestions for a MPGD Workshop in Frascati Rui de Oliveira 1.
Low Mass Alice Pixel Bus Rui de Oliveira TE/MPE/EM 6/9/20161Rui de Oliveira Alice worshop.
GEM, Resistive M-Bulk, ThGEM detector production. Rui De Oliveira, Cosimo Cantini, Antonio Teixeira, Olivier Pizzirusso, Julien Burnens Annecy 26/04/2012.
Large size MPGD production: -GEM update -read out board infos Rui De Oliveira CERN 28/04/2009.
MPGD TECHNOLOGIES AND PRODUCTION GEMMicromegas Resistive MSGC (NEW!) Rui De Oliveira 7/12/20111Rui De Oliveira.
GEM, Micromegas detector production. detector’s dynamic range detector’s dynamic range Rui De Oliveira Catania 24/11/ /11/20111Rui De Oliveira.
1 RD51 Kolimpari June 2009 Stéphan AUNE, BULK lab at Saclay.
A High Eta Forward Muon Trigger & Tracking detector for CMS A High Eta Forward Muon Trigger & Tracking detector for CMS Archana Sharma For CMS High Eta.
First results from tests of gaseous detectors assembled from resistive meshes P. Martinengo 1, E. Nappi 2, R. Oliveira 1, V. Peskov 1, F. Pietropaola 3,
-Stephan AUNE- RD51 BARI. Saclay MPGD workshop R&D 09/10/20101 Saclay workshop R&D for new Bulk structure.
Rui De Oliveira Vienna March 2014 Industrialisation of Micromegas detector for ATLAS Muon spectrometer upgrade 1.
Large volume GEM production Rui De Oliveira TE/MPE/EM
Rev:A ( check-->19 pages document)
GEM and MicroMegas R&D Xiaomei Li Science and Technology
Single GEM Measurement
Updates on the Micromegas + GEM prototype
An improved design of R-MSGC
Presentation transcript:

CERN Rui de OliveiraTS-DEM Rui de Oliveira TS-DEM Large size detectors practical limits based on present knowledge

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

CERN Rui de OliveiraTS-DEM Process status Standard bi-conical LDI exposure –Misregistration top to bottom Standard bi-conical large glass mask –Large mask bowing problem Electrochemical single cone –10 micron level defects on the metals Chemical single cone –Best results up to now

CERN Rui de OliveiraTS-DEM Raw material Single side copper patterning Chemical polyimide etching Chemical copper reduction Chemical conical single mask

CERN Rui de OliveiraTS-DEM Quality at the micron level is still better with standard GEM We are working hard to improve this parameter 70um 55um 50um

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

CERN Rui de OliveiraTS-DEM 650mm Raw material Roll size 500 mm x 100 meter 50 μm polyimide + 5 μm copper polyimide copper Base material

CERN Rui de OliveiraTS-DEM Raw material Resist 600 mm x 100 meter Roll to roll process Resist lamination

CERN Rui de OliveiraTS-DEM Raw material Mask Resist Film: up to 2m x 0.6m step by step exposure Roll to roll possibility UV exposure

CERN Rui de OliveiraTS-DEM Raw material Resist 600 mm x 100 meter Roll to roll process Development by spray

CERN Rui de OliveiraTS-DEM Single side copper patterning Roll to roll process 600 mm x 100 meter Copper etching

CERN Rui de OliveiraTS-DEM Chemical Polyimide etching Roll to roll process 600 mm x 100 meter Polyimide etching

CERN Rui de OliveiraTS-DEM Chemical copper reduction Roll to roll process 600 mm x 100 meter Microetching

CERN Rui de OliveiraTS-DEM GEM Practical limitations 450 mm x 100 meter active area 300 μm dead zone between sectors inside one film 2 mm dead zone between two film exposures

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

CERN Rui de OliveiraTS-DEM Read-out board Laminated Photoimageable coverlay Frame Stretched mesh on frame Laminated Photoimageable coverlay Exposure Development + cure Micromegas Bulk

CERN Rui de OliveiraTS-DEM Hot roll Mesh Frame RubberPCB Coverlay

CERN Rui de OliveiraTS-DEM 0.8mm 0.6mm Read-out board Detail on the sector partitioning Spacer pillar (coverlay) Mesh Mechanical milling 0.6 mm tool diameter 2.4mm dead region

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

Mesh 2500 x 1000 Laminator 1200 x … Exposure 2000 x 1000 Development 1200 x … Milling 2000 x 1000 Oven 2000 x 1000 Detector 2000 x 1000 Practical limitations Bulk Micromegas

CERN Rui de OliveiraTS-DEM Mesh stretching Mesh 2000 x 1000Tension: from 10Ncm to 15Ncm Glue depositOver mesh cutting

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

Raw material CNC drilling Electrodes etching Small rim if needed Copper THGEM production description

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

CERN Rui de OliveiraTS-DEM Raw material: 2000mm x 1000mm Drilling area: 2000mm x 600mm (1000mm?) –Drilling speed : 3 to 4 holes per second –Tool life: drills with 2 sharpenings Small rim etching : 2000mm x 1000mm Electrode patterning: 2000mm x 600mm Possible Detector size: 2000mm x 600mm -28 h drilling time for 1mm pitch with 4 heads drilling machine -111h drilling time for 0.5mm pitch " " " " " Practical limits ThGEMs

CERN Rui de OliveiraTS-DEM Contents Large size GEM –Process status –Practical limits chemical conical single mask Large size Bulk Micromegas –Production description –Practical limits ThGEM –Production description –Practical limits Large volume price consideration

CERN Rui de OliveiraTS-DEM Large volume effect Volume Price/area GEM Micromegas THGEM Depends on initial investments

CERN Rui de OliveiraTS-DEM Conclusions Practical limits with investment GEM: 100 meter x 450mm Bulk Micromegas: 2 meter x 1 meter ThGEM: 2 meter x 0.6 meter (1 meter?)