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The work of GEM foil at CIAE
Li Ye, Xiaomei Li Science and Technology on Nuclear Data Laboratory China Institute of Atomic Energy weihai
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outline Patr 1: Motivation Part 2: The structure of GEM foil
Part 3:Gem foil researches at CIAE Part 4: THGEM detector and test at IHEP Part 5: Next step
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Part 1:Motivation
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Enhanced capabilities
JLab 12GeV Upgrade New Hall Add arc Enhanced capabilities in existing Halls Add 5 cryomodules 20 cryomodules
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SoLID spectrometer Transversity PVDIS longitudinal
CIAE,USTC,TSinghua,Peking,HUST,Shandong,Lanzhou,Huangshan,and so on 5
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CIAE,USTC,TSinghua,Peking,HUST,Shandong,Lanzhou,Huangshan,and so on
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Part 2: The Structure of GEM Foil
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GEM (Gas Electron Multiplier) Structure
Avalanche Gaseous Detector Core part: GEM Foil Sealed by the window and the substrate to form a pressure-tight gaseous chamber Ar+CO2 Structure of detector with single GEM foil
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GEM (Gas Electron Multiplier) Structure
Ar+CO2 Magnify carbon dioxide Structure of detector with triple GEM foils
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GEM Foil Structure A sandwich structure
5-10μm copper foils on the surfaces of Kapton foils
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GEM Foil Structure A dipole field will form when a voltage is applied on the two sides of the foil, gathering the field lines between the drift electrode and read-out electrode into holes. Avalanche happens in holes Field shape of a GEM foil Kapton foils have excellent mechanical, physical and chemical properties. They will not melt, burn, and they are flexible.
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Process Flow Diagram of GEM Manufacture
1. Copper-plating on the two sides of Kapton foils. a Clad the 5-10μm copper foils on the surfaces of Kapton foils by hot-pressing. b Make 5-10μm copper foils on the surfaces of Kapton foils by vacuum deposition technique. 2.Photoresist coating. Pull the Kapton foil out of 303 negative photoresist, the thickness can be controlled by the pulling-out speed. 3.Lithography The patterns on the mask can be transferred to the photoresist layer, then wash it with developing solution. 4.Copper foil etching Washing the foil with 30% iron trichloride(FeCl3)solution, then the pattern on the photoresist layer can be transferred to the copper foil layer, the depth of etching can be controlled by controlling the etching time. 5. Kapton foil etching The most important step of the whole process flow diagram. processes
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From Foils to Detectors
GEM foil is flexible, it must be fixed by a frame, then it can be mounted on detectors. Processes of Fixation Fix by a fiberglass substrate Dry in 40°C circumstances Epoxy Dry and solidify A standard GEM foil
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Read out Electrodes collecting avalanche electrons have crucial effects on spatial resolution, time resolution and detection efficiency. Principle of Read Out Parallel Strips and Pads Array Thin Film Transistor, TFT. CMOS. CCD.
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Part 3:GEM Foil Researches at CIAE
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Agreement with CERN Prof. Xiaomei LI has visited CERN PCB factory and GEM group in Feb We got two GEM foil samples and two mask plates from CERN. CERN PCB factory has agreed that they would transfer the GEM foil production technology to CIAE for free for the research of high energy physics. Now we are doing the paper work. So we can say that the technique route has no problem 16
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GEM Foil from CERN 10cm*10cm GEM foil sample
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GEM Mask Plate from CERN
10cm*10cm mask plate
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GEM Foil Researches at CIAE
1. Kapton foil covered with copper has got from the manufacturer in china. 2. Photoresist coating and masking Cooperate with the factory, we can make 70μm diameter 5cm* 5cm mask plate 3. Copper etching ---some problems. It will be solved after getting the technology transfer from CERN. 4. Kapton etching CIAE has over 20 years nuclear pore foil production and kapton etching experience. 5. Clean room for GEM construction GEM Foil Researches at CIAE
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Mask Plate Made in China
5cm*5cm mask plate
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Nuclear Pore Foil Production at CIAE
HI-13 accelerator particles are accelerated by HI-13 then pass through the kapton foil,kapton etching,20um,control the hole size by etching time
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Cleanroom our 1K level cleanroom for etching,framing,cleaning and
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PART 4: Thick-GEM (THGEM) detector
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Introduction of Thick-GEM (THGEM) detector
A. Breskin, M. Cortesi, R. Alon, J. Miyamoto & R. Chechik Weizmann institute of science, Rehovot, Israel EHole ETran EInd EDrift radiation e-s Readout anode
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Difference Between GEM and THGEM Foils
Typical parameters: 50mm Kapton metal coated Ø70mm holes mm pitch Manufactured by standard PCB techniques of precise drilling in G-10 (and other materials) and Cu etching.
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Some Results of THGEM from Breskin
single electrons Single THGEM Gain Double THGEMs gain THGEM - Gain vs rim size Double-THGEM 6 keV x-rays VHOLE [Volt] 104 pitch = 1 mm; diameter = 0.5 mm; rim=40; 60; 80; 100; 120 mm Recent Advances in Thick-GEM(THGEM) Detectors -Feb A. Breskin
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THGEM Foil Made in China
THGEM from Breskin Drills with milling cutter mm rims THGEM from IHEP No such technology manufactories Copper etching
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Thick-GEM Test at IHEP 0.2mm diameter THGEM according to CIAE requirement
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Test of 0.2mm Diameter THGEM
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we lost some gain,but we save lots of money! cheap(~200 doller/m2)
Thick-GEM Test Result sdf we lost some gain,but we save lots of money! cheap(~200 doller/m2) breakdown won't damage the THGEM foil or electronics
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Thick-GEM Test Result Energy resolution is about20%
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Thick-GEM Test Result stable in 24 hours stability
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Compare with GEM detector
GEM THGEM some technical difficulties most PCB factories can make high cleanliness requirements you can put in your pocket easily damaged durable expensive cheap high detection efficiency lower spatial resolution 70μ estimate limit value is 300μm
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Part 5:Next step Copper etching Make read-out strips
RPC manufacture(see Shouyang HU’s talk) Use APV25 electronic test GEM spatial resolutions Make and test GEM and THGEM detectors using the foils made in China
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Thank you !
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