Global Design Effort 1 Polarized electron source update Axel Brachmann, John Sheppard, Feng Zhou, Takashi Maruyama, -SLAC- Matt Poelker -Jlab- LCWS/ILC.

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Presentation transcript:

Global Design Effort 1 Polarized electron source update Axel Brachmann, John Sheppard, Feng Zhou, Takashi Maruyama, -SLAC- Matt Poelker -Jlab- LCWS/ILC Meeting, Beijing, Mar. 29, 2010

Laser System Slow progress at SLAC due to limited resources (both manpower and M&S) Plan is still to complete laser system and generate a polarized electron beam Intention is to draw resources from other laser groups at SLAC Investment in new pump laser still optional Meeting at Jlab on 04/20 to discuss integration of laser system and gun developed by Matt Poelker at Jlab Global Design Effort 2

Laser System SBIR with KM Labs Expecting completion of the project in ~ 4 months. Also trouble with pump lasers for Regen Amplifier Reduced scope of the project: –Max repetition rate 1.5 MHz instead of 3 MHz Lessons learned from project: –Use 2x50W MOPA doubled Nd lasers or fiber-based green lasers to get ~ 100W of pump power –These option became available only recently Global Design Effort 3

DC Gun R&D at Jlab Most important issue  Reduce field emission from electrodes Tests of a variety of materials and polishing techniques [1] –Stainless Steel Diamond paste polishing Electro-polishing –Single Crystal Niobium Buffer Chemical Polish Diamond Paste Polish [1] Work of Ken Surles-Law, Jefferson Lab Global Design Effort 4

Electro-polished Steel Global Design Effort 5 EP(1) 500X DP 500X EP (2) 1300X DP 1200X Results similar to diamond- paste polishing: limiting gradient 5MV/m Considerable time saving Perhaps better results if we start with smoother surface

Single Crystal Niobium Global Design Effort 6 Replace conventional ceramic insulator with “Inverted” insulator: no SF6 and no HV breakdown outside chamber Conventional geometry: cathode electrode mounted on metal support structure Capable of operation at higher voltage and gradient Buffer chemical polish (BCP) much easier than diamond-paste-polish

High Temperature Bake to reduce outgassing rate Global Design Effort 7 As much “thin-wall” material as possible 316LN (L= low carbon, N= nitrogen added for hard knife edges) Manufactured and electropolished by NorCal 400C bakeout for 9 days, under vacuum Pumped by oil-free turbo, then added ion pump, while monitoring “effluent” with RGA At 9 th day, vacuum still improving by ~15% per 24 hours RGA shows H2, methane, CO and HCl (from electropolishing) Rate of Rise method, with spinning rotor gauge, outgassing rate TL/scm 2, one order of magnitude improvement Vented and remeasured good rate, on test chamber Now working to de-gas internal components…

Inverted Gun assembly Global Design Effort 8

CEBAF Gun operation Global Design Effort 9 Inverted Gun installed at CEBAF, operational since July 23, 2009 Extractor gauge 2x Torr (raw value) Happy at 100kV, conditioned to 110kV, briefly went to 125kV Opportunity at CEBAF for operation > 100kV Lifetime ~ 70C at 150uA ave. current Aggressive commissioning of 2 nd InvGun at Test Cave. Under vacuum - with Nb electrode. Ready for beam….

Lessons Learned We learned at CEBAF that it is extremely important to manage ALL of the extracted beam –Anodized edge: beam from outside 5 mm active area can hit beampipe walls, degrade vacuum, reduce operating lifetime ILC/CLIC requires large laser beam to reduce current density and overcome space and surface charge problems Need a cathode/anode design that ensures uniform emittance across beam profile. A beam that can be easily managed/transported, with *ZERO* beam loss. Global Design Effort 10

Photocathode R&D Doping Profile Optimization: –Measure QE/polarization/surface charge limit as a function of doping level on the surface (5e18, 1e19, 2e19, and 5e19): –5e18 has lower QE but QE of other cases are similar –Polarization does not strongly depend on the doping level on the surface. –Measure surface charge limit still pending Global Design Effort 11

Doping Profile Optimization Global Design Effort 12 GaAs/GaAsP

Internal Bias Effect and DBR Measurement of the internal bias effect on QE, polarization, and surface charge limit (wafers are delivered: single layer gradient doped AlGaAs) Global Design Effort 13 Distributed Bragg Reflector (DBR) development (SBIR pending) Constant doping Gradient doping Acceleration