1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics InfoDay, Brussels, 11 October 2010 FP7 ICT Work Programme

2 Smart Components - their Applications Automotive Industrial and Medical Military, Civil Aerospace, Security Consumer Communications Data Processing

3 Introduction European vision of the More Moore and More than Moore domains More than Moore: Diversification Moore’s Law: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Beyond CMOS Analog/RFPassivesHV Power Sensors Actuators Biochips Information Processing Digital content System-on-Chip (SoC) Interacting with people and environment Non-digital content SoC & System-in- Package (SiP) Combining SoC and SiP: Higher Value Systems To reach and support the SoC/SiP trend, Beyond CMOS technologies need to meet the criteria of integratability and sistemability

4 ICT Work Programme Nanoelectronics Objective 3.1: Very Advanced Nanoelectronics Components Beyond CMOS technology Circuit-technology solutions Nano-manufacturing and Joint Equipment Assessment Coordination and Support Actions Call 8 60M€ Objective 3.2: Smart components and smart systems integration Smart components Smart (miniaturized) systems Micro-Nano Bio Systems (MNBS) Coordination and Support Actions Call 7 (MNBS – call 8 (39M€)) 41M€

5 Obj. 3.2: Smart Components and Systems Converging trends –Components increase in performance and functionality –Systems increase in integration and miniaturisation Smartness requires –Multifunctionality, –System level thinking –Interdisciplinarity –Heterogeneous Integration

6 Smart Integration (1) Smart components derived from advanced core nanoelectronics technologies to achieve new levels of extreme performance and functionality Smart systems integrate heterogeneous devices and functionalities (sensing, actuating, processing, energy scavenging, communication) by applying inter-disciplinary knowledge Together, they provide ‘smart’ hardware platforms, an essential element of future generations of products, infrastructures and services

7 Smart Integration (2) Using/Developing Wide material combinations and different substrates (as Si, SiC, III-V) New architectures, devices, processes and packaging technologies Modelling and design tools Fabless and flexible/modular mfg approaches Yield, reliability, test, validation methods

8 Future Smart Components and Smart Systems :  Smart components (SoC, SiP) with high performance (analogue, high frequency, integrated passives); high voltage/power, special conditions (high temperature, high reliability, long lifetime)  Miniaturized and integrated smart systems, including nanoscale sensing systems  Autonomously operating, power efficient and networked smart systems  Robust systems, adaptive to environment and lifetime requirements. Smart Components & Smart Systems Integration Call 738M€STREPs, IPs

9 Coordination and Support Actions:  Coordination of EU and national programmes  Cooperation of the value-chain actors, from research to industrialisation  Industrial take-up actions  Roadmaps linking applications and technologies  International cooperation Smart Components & Smart Systems Integration Call 73M€CSA

10 Objective 3.2: Smart Components & Smart Systems Integration Expected Impact: 1.Improve business relations between relevant actors in the supply chain, including interactions with R&D organisations and users. 2.Strengthen the competitiveness position of European smart components and systems industry; increase its knowledge base 3.Gain market share in high-end electronics application market 4.Contribute to smart solutions for environment protection

11 Example: ATHENIS (FP7 ICT, call 1, STREP) Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC The opportunity ! Low cost heterogeneous integration

12 ATHENIS Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC OBJECTIVES Develop a low cost platform integrating HVCMOS & Nanomech eNVM to satisfy the following automotive requirements: » High temperatures (≥ 200C) » High ESD levels (≥ 8kV) » High voltages (5V to ≥120V) » full reverse polarity capability up to 120V » High currents (≥10A) » ≥ 20 years operating lifetime Verify and test for an alternator-like demonstrator (lower production cost for alternators by including Nanomech eNVM)

13 ATHENIS Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC ATHENIS Results at the end of the 2 nd year : HVCMOS devices that withstand high temperatures and ESD levels. eNVM technology, demonstrating a promising behaviour, both in terms of data retention and dynamic R/W performances against operating temperature. predictive TCAD for the HV-CMOS modules, thus providing the background for the development of a robust automotive technology. A first physical automotive system prototype, where the basic rough functionalities were provided, has been presented.

14 Thank you European research on the web: Information Society and Media: g Contact: European research on the web: Information Society and Media: g Contact: ATHENIS on the web: ATHENIS on the web:

15 Objective 3.2: Smart Components & Smart Systems Integration Relevant Initiatives EPoSS European Platform on Smart Systems Integration ENIAC Joint Technology Initiative on Nanoelectronics

16 Objective 3.2: Smart Components & Smart Systems Integration Contacts Smart Components: Georg Kelm - Smart Systems Integration: Javier Bonal –

17 Objective 3.2: Smart Components & Smart Systems Integration Funding call 7 (28/9/2010 – 18/01/2011) Future Smart Components and Smart Systems 38 M€ - IPs & STREPs Coordination and Support Actions 3 M€ - CSAs Funding call 8 (7/ ) Micro-Nano Bio Systems (MNBS) 39 M€ - IPs & STREPs

18 Objective 3.2 The new objective “Smart Components and Systems Integration” –removes the formal separation between smart components and systems –energy efficiency, system design-technology interactions, 3D, novel architectures