PLUG IN TO THE WIRELESS WORLD WISMO2D Shielding Parts Technology: metal sheet stamping and folding Frame : internal walls to isolate different RF areas.

Slides:



Advertisements
Similar presentations
High Density Mezzanine Connector System (1.00mm)
Advertisements

Contents Capability-PCB Capability-FPC and RFPC
Manufacturing Processes for a 4 Layer Multi-layer PCB Section through PCB Via hole SMD Pad The following presentation covers the main processes during.
BTEC First Engineering
ASE Flip-Chip Build-up Substrate Design Rules
Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.
Today’s Objectives: Soldering Soldering is non-trivial, especially surface mount components Soldering is non-trivial, especially surface mount components.
Flat-Panel Grid Antenna R Struzak. This antenna offers ~18 dBi gain, VSWR
Corporate Presentation Introduction OurPCB Tech Limited was found in 2005, it provides professional PCB&PCBA service for over than 1500 customers around.
Passive Components: Capacitors & Resistors
Connectors 13/03/2013Collaboration meeting CERN - CSEM1.
Heat Sink Selection Thermal Management of Electronics
Demands for Producing IPC Class 3! Lars-Olof Wallin IPC European Representative Seminar MITT University
Machine Tools And Devices For Special Technologies Printed circuit manufacturing Slovak University of Technology Faculty of Material Science and Technology.
VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.
WP7&8 Progress Report ITS Plenary meeting, 23 April 2014 LG, PK, VM, JR Objectives 2014 and current status.
Single PET-module Design Update 1 TRIMAGE Meeting Munich, Dec. 12,2014 WP 3 Design and optimization of PET-system Andreas Seebacher, raytest.
1/20 Passive components and circuits - CCP Lecture 13.
Trade Skills Basics of Sheet Metal. 2 Sheet Metal History Sheet metal dates back to ancient days where many workers toiled for many hours to hammer.
Base metal prep.
MICE RFCC Module Update Allan DeMello Lawrence Berkeley National Laboratory MAP Winter Collaboration Meeting at JLab, Virginia February 28, 2011.
H. Felice - P. Ferracin – D. Cheng 09/19/2013 Update on structure CAD model.
H. Felice - P. Ferracin – D. Cheng 09/11/2013 Update on structure CAD model.
INTER-LAKES BASES PRODUCTS. MODEL B-75 MACHINE BASE B-75 Model with panels and doors.
Chiho Wang ATLAS TRT Duke University CERN, Feb Fuse Box Status Chiho Wang Duke University.
ICARUS Cold Vessels Thermal insulation Project progress report.
AM test sample. outside 20 mm inside 19 mm wallthickness 1 mm height features 4 mm.
IPod analyses Paul, Ethan, Niels. Casing: Plastic cover Dual injection molding ▫White cover ▫Transparant layer on top of this Advantages ▫Lower part cost.
Jack Fowler Spain Workshop 2003 Faraday Shielding for Barrel TRT Jack Fowler Duke University Spain Workshop
Types of Metal.
IPC Conductor Width and Thickness The width and thickness of conductors on the finished printed board shall be determined on the basis of the.
MICE RFCC Module Update Allan DeMello Lawrence Berkeley National Laboratory MICE CM29 at RAL, UK February 17, 2011.
Area Volume Measures a given space Length and Width 2-D 3-D Length times width L x W Length times width time height L x W x H Measures the space of a flat.
TYPES OF MICROMETERS. Precision Measuring Tools Five categories of tools based on the dimension being measured – Outside – Inside – Depth – Thread – Height.
IPC In-Circuit Test Fixtures In-circuit test fixtures are commonly called bed-of-nails fixtures. A bed-of- nails fixture is a device with.
How to make a PCB.
Problem Statement/Constraints Design Options Design selection Design layout Analysis Fabrication Testing Results Recommendation Concluding Remarks.
By: Steph Magill.  Electroplating- The process of coating an electrically conducting surface with a thin layer (seldom more than in [0.025 mm]
PCB Design Overview Lecture 11
Extrusion Process.
Chiho Wang ATLAS TRT Krakow Workshop Duke University May, HV Plate Design & Assembly Chiho Wang Duke University.
RAS MiniBendCenter. L min =50 mm L max =600 mm B min =40 mm B max =600 mm B L H S (mild steel) Technical Specification s max = 3 mm H max = 127 mm.
IPC Standard Surface Mount Requirements Automatic assembly considerations for surface mounted components are driven by pick-and- place machines.
MICE RF Coupler Modifications Update 4/30/2015 Allan DeMello.
TUTORIAL 1 7/3/2016.
Andrei Nomerotski 1 Flex Status & AID A.Nomerotski, 18 June 2010.
First Wall Panel - Overview
Presented by: Joshua Bush Michael Goetz Michel McCluskey
Teknologi Dan Rekayasa
1)STEEL TYPE(JIS , ASTM, EURONORM, KS) AL-KILLED STEEL,
Fasteners and Cold Metal
Introduction , Variations & Use
ob-fpc: Flexible printed circuits for the alice tracker
ROX sensor packaging and mounting scheme for use on dilution STM sample plates Ben MacLeod Jan
Process map NVA VA VA VA VA NVA VA NVA NVA NVA NVA NVA VA NVA NVA NVA
WELDING REPRESENTATION
HCAL Modules -First Ideas
Electronics Manufacturing Processes
(Rhymes with Doddering)
Nano Module SMT Guideline
What determines impedance ?
Flex Status A.Nomerotski, 4 May 2010.
LPKF Laser Direct Structuring System
NPS mechanical design 11/13/2018 Jlab meeting
WELDING PROCESSES Prepared By: Dr.C.VASANTHAKUMAR PROFESSOR
By Gerry Crenshaw WD4BIS
Types of Metal.
Neutron guide Shielding Concept
SAS-3: Microwave laminates for connector test cards
Presentation transcript:

PLUG IN TO THE WIRELESS WORLD WISMO2D Shielding Parts Technology: metal sheet stamping and folding Frame : internal walls to isolate different RF areas with a folding edge to enhance rigidity and flatness (0.13mm) Cover : possibility to repair inside components by opening Cover assembly on a frame: locking by bumping on frame and opening in cover SMD functionality: high wetting without any worries on solder rising up (design update) Metal thickness Frame: 0.3 mm Cover: 0.2mm

PLUG IN TO THE WIRELESS WORLD WISMO2D Mechanical Specification 1 frame 1 cover

PLUG IN TO THE WIRELESS WORLD WISMO shielding frame design the frame design gives some constraints for components placement Example of typical frame on a PCB board Dimensions in millimeters 0.75mm between frame and board edge Lip width of the frame: 1.5mm without any components under 6x6mm surface for Pick & Place area Height of frame: 2 mm Height under lip 1.7mm

PLUG IN TO THE WIRELESS WORLD Shielding Definition Frame castellation with a thickness of 0.13mm. (0.13mm because it’s inch ‘s multiple); minimum value is 0.1mm 1,5mm 0,5mm 2 mm depending on Componnent height Aim of slot: Have a better planarity and like this less problem in production Better cooling of component in use Better Thermic evacuation while going to owen

PLUG IN TO THE WIRELESS WORLD Shielding Definition  1,5 In case of cover directly soldered on SMT( no frame), we need to add at least two holes on the cover. This hole has to measure less than 2,5 mm( in order to guaranty good RF performance: wave length issue). We used a diameter of 1,5mm as reference. Aim of theses holes Better cooling of component in use Better Thermal evacuation while going to owen

PLUG IN TO THE WIRELESS WORLD WISMO SMD shielding foot print Frame with castellation 0,5 mm min 0,8 mm min 2,5 mm min PCB edge Frame castellation Copper pad 1,5 mm min

PLUG IN TO THE WIRELESS WORLD WISMO SMD shielding foot print Raw Material Issue: On the sample provided by Soutec, the material is tin plate steel. Our shieldings are in Nickel Silver definition We had a bad experience on tin plate steel in the past( our first project): Rust and Suntan Issue Nickel Silver is better: - for soldering - for moisture issue