Dong Hyuk Woo Nak Hee Seong Hsien-Hsin S. Lee

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Presentation transcript:

Dong Hyuk Woo Nak Hee Seong Hsien-Hsin S. Lee Heterogeneous Die Stacking of SRAM Row Cache and 3-D DRAM: An Empirical Design Evaluation Dong Hyuk Woo Nak Hee Seong Hsien-Hsin S. Lee Electrical and Computer Engineering Georgia Tech Intel Labs The 54th IEEE International Midwest Symposium on Circuits and Systems

Modern DRAM Design Challenges Scaling challenge Less capacity Higher leakage Increasing manufacturing cost Energy efficiency pressure Smart phone / tablet Cloud / Exa-scale computing

Future Solutions Heterogeneous stacking [Kawano et al., IEDM 2006] Dedicating a logic layer for I/O circuit Better performance, lower energy consumption Homogeneous stacking [Kang et al., JSSC 2010] Increasing density without scaling the device

New Opportunity for Processor Architects SPACE AVAILABLE (404) 894-9483

SRAM Row Cache?

Motivation An Optimized 3D-Stacked Memory Architecture by Exploiting Excessive, High-Density TSV Bandwidth by D. H. Woo, N. H. Seong, D. L. Lewis and H.-H. S. Lee in IEEE International Symposium on High-Performance Computer Architecture (HPCA-16), 2010.

Row Buffer Conflicts in a Multi-core Address Stream 0x0000 0000 0x0000 0040 Conventional 3D DRAM 0x1000 0000 0x1000 0040 0x0000 0080 0x0000 00c0 Row Buffer Hit rate ~ 50% One entry / bank 3 row misses 3 row hits One cache line

Eliminating Redundant Array Lookup Address Stream 0x0000 0000 0x0000 0040 Heterogeneous SRAM row cache + 3D DRAM 0x1000 0000 0x1000 0040 0x0000 0080 0x0000 00c0 Row cache Hits 2 row misses 4 cache hits One row cache line Row Cache

SRAM Row Cache Stacking Large set-associative SRAM row cache Eliminating redundant DRAM look-ups caused by conflict misses in row buffers High bandwidth, low energy communication through TSVs

Conventional DRAM Bank Structure 2-D transfer is still energy hungry! Large area overhead of TSV TSVs One bank per die Not drawn to scale

Folded, Scalable DRAM Bank Structure Short transfer of large data (a row) Long transfer of small data (a cache line) 64x64TSVs 64x16TSVs One half-row = 4Kb (64x64)

Final Design: SRAM Row Cache + 3-D DRAM One SRAM cache bank per DRAM bank

Performance: Overall Speedup Performance: Row Hit Rate Performance Results Performance: Overall Speedup Performance: Row Hit Rate

Energy: Relative DRAM Lookup Energy Energy Results Energy: Relative DRAM Lookup Energy

Energy Breakdown

Conclusion 3-D stacking  new light for architects SRAM row cache for 3-D DRAM Folded DRAM bank design Optimize 2-D Traffic Significant energy savings

That’s All, Folks! Georgia Tech ECE MARS Lab http://arch.ece.gatech.edu

BACKUP FOILS

Simulation Results