1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE CABLES FOR THE CABLES.

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Presentation transcript:

1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE CABLES FOR THE CABLES FOR THE CBM STS THE CBM STS FROM UKRAINE FROM UKRAINE June 1 - 4, 2009 Sortavala, Karelia, Russia Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine Session # 2: R&D of essential parts of the CBM STS

2 SSD MODULES schematic view Sortavala, June, 2009 Schematic view of the arrangement for the sensor, analog cables and daisy-chain cables. Double-deck analog cable Daisy-chain cable Double-deck analog cable Two analog cables (for each side of sensor) with constant 116 µm pitch are laminated together with a lateral shift of 58 µm (effectively as a cable with 58 µm pitch).

3 ANALOG CABLE basic characteristics Sortavala, June, 2009 Material: foiled dielectric FDI-A-24 thickness: of Al layer  um of polyimide layer  10 um Sensor bonding area Hybrid bonding area (pitch-adapter)  116 um; Pitch of trace  116 um;  um; Width of trace  um; 512 (+bias) Quantity of traces 512 (+bias) Expected resistance Rtr  (0.5 ÷ 0.7) Ohm/cm; Expected capacitance Ctr  (0.3 ÷ 0.32) pF/cm. Length: from 100 up to 550 mm

4 ANALOG CABLE first pre-prototype Sortavala, June, 2009 A first iteration of analog cable has been designed and produced at our institute

5 DAISY-CHAIN CABLE basic characteristics Sortavala, June, 2009 Material: foiled dielectric FDI-A-20 thickness: of Al layer  um of polyimide layer  10 um  58 um; Pitch of trace  58 um;  um; Width of trace  um; 1024 (+bias) Quantity of traces 1024 (+bias) Expected resistance Rtr  (0.9 ÷ 1.4) Ohm/cm; Expected capacitance Ctr  (0.34 ÷ 0.40) pF/cm.

6 DAISY-CHAIN CABLE first pre-prototype Sortavala, June, 2009 A first iteration of daisy-chain cable has been designed and produced at our institute

7 SENSOR TOPOLOGY sensor CBM03 Sortavala, June, 2009 The recommendations to topology of a sensor with allowance of capabilities for further assembly of flexible cables were developed N-side P-side Pitch of bond pads in two rows – 58 um Pads dimension – 60 x 180 um

8 KIND OF CONNECTIONS of daisy-chain cables to sensor Sortavala, June, 2009 TAB-bonding (Pitch  58 um) Sensor bonding area

9 KIND OF CONNECTIONS of analog cables to sensor Sortavala, June, Ultrasonic bonding of Flexible cables to Sensor: 520 bonds (on both sides) 2. Bonds protection (Glue EpoTec T7110) Type of wedges (Gaiser Tool ) for single-point TAB bonding: GT B Pool strength: 6-8 gram Bonding of Cable to Sensor The first researches of bonding of analog cables to a sensor were executed at assembly of the Demonstrator 0-b The flexible cables (material - FDI-A-24) with a pitch of traces 100 um were used

10 AUTOMATIC BONDER EM Sortavala, June, 2009 Composition of EM-4370: 1. Ultrasonic generator 2. Bonding equipment 3. Table for electrical equipment 4. Optical head 5. Lighter 6. Monitor 7. Keyboard + manipulator “mouse” Main parameters of EM-4370 automatic wire bonder – Al wire size: 18-50um; – bonding area: X Axis: 100 mm Y Axis: 200 mm Z Axis: 1.2 mm –placing of bonding objects in bonding position on X,Y, Z axis: moving of positioning table – total bond placement accuracy: 3.0 um – bond force: g – bond time: msec – bond power: 0 - 4W – amount of wires per program: more then 1000 – amount of chips per module: no more then 10 – ultrasonic frequency: 66kHz – power configuration: 230V, 50Hz – power consumption: 0.8kW – dimensions (W/D/H): 1200mmХ750mmХ1450mm – weight: no more then 400kg

11 Sortavala, June, 2009 KIND OF CONNECTIONS of analog cables to FEB Analog cable Output: Pitch 50.7 um (two rows at 101.4um) Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 116 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB- bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads. TAB-bonding (Pitch 116um) Wire-bonding (Pitch 50.7um) Input: Pitch  116um Pitch-adapter Sensor Analog cable Front-End Board

12 POSSIBLE DESIGN OF A TWO-LAYER CHIP - CABLE FOR THE CHIP N-XYTER Sortavala, June, 2009 With the purpose of simplification of a FEB design at use of the n-XYTER chip - it is possible to apply a two-layer chip-cable Example of such cable

13 POSSIBLE DESIGN OF A TREE-LAYER FLEXIBLE BOARD FOR FEB Sortavala, June, 2009 For mechanical Demonstrator 1-c the dummy FEB with use of multi-layer aluminum-polyimide board can be made Alumina base (rigid heat-sink) Pitch-adapter Bottom Flexible layer Top Flexible layer Double-layer chip-cable with chip Screen Flexible layer

14 CONCLUSIONS Sortavala, June, 2009  Now under development are design of daisy-chain cables and analog cables with allowance of new sensor topology.  The following tasks: - manufacture of the cables prototypes; - research of sequences and regimes of cable assembly.

15 June, 2009 Thank you for your attention