Engineering Leaders Masters Series Fall 2007 Engineering Leaders Masters Series Master of Science with Major in Packaging of Electronics and Optical Devices

Fall Presentation Outline SMU School of Engineering Mechanical Engineering Department Graduate Degree Programs  MS and PhD in Mechanical Engineering Professional Degree Programs  MS with a Major in Manufacturing Systems Management  MS with a Major in Packaging of Electronics and Optical Devices Details of Professional Degree Program MS with a Major in Packaging of Electronics and Optical Devices Professional Certificate in Electronic Packaging Fundamentals

Engineering Leaders Masters Series Fall 2007 School of Engineering Engineering Leaders Masters Series

Fall “At SMU, we are educating today’s engineers to be tomorrow’s engineering leaders.” ~Geoffrey Orsak, Dean SMU School of Engineering

Fall Five Engineering Departments Mechanical Engineering (ME) Computer Science and Engineering (CSE) Electrical Engineering (EE) Engineering Management, Information and Systems (EMIS) Environmental and Civil Engineering (ENCE)

Fall Student Population Undergraduate students ~ 800 Graduate Students ~ 1,005 (~43 Ph.D. students)

Fall School Of Engineering First University to offer Distance Learning program with n TAGER Satellite Network n VHS Delivery n DVD delivery n Streaming Video downloads n WebEx and Blackboard n 100% Coverage of all graduate courses nSMU is the only university that offers a complete program in Packaging of Electronics and Optical Devices via Distance Learning

Engineering Leaders Masters Series Fall 2007 Engineering Leader’s Masters Series

Fall Engineering Leader’s Masters Series Continuous Learning n Undergraduate n Certificate n Graduate n Beyond Lecture Series n Evening and daytime events n Current and topical n Experts from Industry Networking opportunities

Fall Delivery Methods Packaging of Electronics and Optical Devices On CampusOn Campus  Traditional classrooms Distance LearningDistance Learning  DVD delivery  Streaming video downloads

Fall On Campus Instruction Standard M/W, M/W/F or T/TH classes Day and evening formats Standard Fall / Spring / Summer Semesters Taught by full-time and adjunct Faculty

Fall Distance Learning Streaming Video Downloads n Flexible scheduling Lectures are current n Usually posted to the SMU server within a few hours of delivery Exams are proctored Industry students are welcome to attend on campus if convenient

Engineering Leaders Masters Series Fall 2007 Mechanical Engineering Department

Fall ME at SMU is a Research- oriented, student-centered department. The department promotes world class research with absolute commitment to excellence in teaching. Mechanical Engineering Department (ME)

Fall Mechanical Engineering Faculty 12 Full time faculty 7 Emeritus faculty 7 Emeritus faculty 8 Adjunct faculty 8 Adjunct faculty 3 Staff members 3 Staff members 3 Post-Doctoral Research Associates 3 Post-Doctoral Research Associates Yildirim Hurmuzlu Chair Radovan KovacevicPeter RaadJose Lage Wei TongCharles LovasPaul KruegerDavid Willis Gemunu HappawanaDona MularkeyElena BorzovaDonald Price

Fall Mechanical Engineering Degree Programs Mechanical Engineering (ME) BS, MS, Ph.D. M.S. with Major in Packaging of Electronics and Optical Devices (PEOD) MS, Professional Certificates M.S. with Major in Manufacturing Systems Management (MSM) MS, Professional Certificates

Fall SMU Packaging of Electronics and Optical Devices Presented from an Industry Perspective Donald Price, Ph.D., P.E. Director December 15, 2006

Fall Why Packaging of Electronics and Optical Devices ? nIn today’s environment, an engineer working in the electronics industry must constantly develop more advanced capabilities in the design and packaging of electronic systems. nThese systems are becoming more complex, with ever-increasing requirements for higher reliability and lower-cost manufacturability. nTo compete, you will need an understanding of the: n Effect of mechanical vibrations on components and systems, n Behavior of electronic components n Fundamentals of optoelectronics and microelectromechanical systems (MEMS) n Failure modes and mechanisms of electronic components n Current thermal management techniques n Electronic materials and their material properties n Basics of experimental measurements n Computational techniques used in both mechanical and thermal design n Fundamentals of electronic manufacturing technology.

Fall Why Packaging of Electronics and Optical Devices ? nBeing trained in these disciplines, you will find yourself in high demand, as advanced electronic and optical devices reach even further into our everyday lives. nYou will learn how this program will resolve all of the issues, which currently are limiting progress in your career.

Fall Why Southern Methodist University ? nThe MS program in Packaging of Electronics and Optical Devices at SMU is one of only a few programs in the world designed to provide you, the practicing engineer, with the depth and breadth of skills in the diverse disciplines, which you need to succeed in this ever more demanding field nNo time for on-campus coursework? No problem. Traveling for your employer! No problem. nThis program is unique, in that it delivers courses via Distance Learning, enabling you to balance your advanced degree studies with your work priorities. nYou are able to easily communicate with your SMU professors via telephone, fax, and . Lecture notes and course materials are placed on the web site in advance of classroom lectures.

Fall Why Southern Methodist University ? nThe lectures are digitally recorded and are available for streaming video downloads from the SMU web site to your computer over the internet. nWith this form of course delivery, the program is ideally suited for engineers throughout the United States and for military personnel, whether stationed in the US or abroad. nSMU offers qualified military personnel and government employees discounted tuition.

Fall SMU’s Vision and Mission Statement nSMU has revised the course content and technical approach of the M.S. degree program in Packaging of Electronic and Optical Devices nThe content of the program now features electronic packaging education being presented from an industry perspective in order to provide complete instruction in the design, development, and manufacture of electronic components and systems. nSMU believes that the electronics industry in this area requires engineers with multidisciplinary skills in the fields of electronic materials science, mechanical design, and thermal management.

Fall Vision and Mission Statement (cont) nSMU seeks to develop students uniquely able to contribute to the growth of the electronics and avionics in the Dallas-Ft. Worth area and around the world. nWe believe that the electronics industry seeks to hire engineers with a cross- disciplinary educational background, possessing skills and capabilities in mechanical modeling, mechanical design, and thermal design, as well as an understanding of electronic materials and material properties. nTo this end, we believe that the program, as now structured, meets that need

Fall Degree Requirements, Admission Requirements Admission Process

Fall In addition to meeting the School of Engineering degree requirements for a Master of Science degree, applicants are required to satisfy the following additional requirements:  Satisfactory completion of a required core curriculum consisting of the four courses (12 hrs)  Satisfactory completion of the required six (6) electives selected from a list of eight (8) electronic packaging courses (18 hrs) Degree Requirements

Fall Admission Requirements In addition to meeting the School of Engineering admission requirements for a Master of Science degree, applicants are required to satisfy the following additional requirements: Bachelor of Science in one of the engineering disciplines, or in a closely related scientific field

Fall Admission Process Procedures and forms are located at What you will need n Completed application form n Two recommendation forms (one from a manager or supervisor) n Current resume n All official undergraduate and graduate transcripts n $75 application fee

Fall Curriculum Packaging of Electronics and Optical Devices  Core Courses - 12 hrs n ME 7334 – Fundamentals of Electronic Packaging n ME 7242 – Introduction to Thermal Management of Electronics n ME 7343 – Electronic Packaging Materials: Processes, Properties, and Testing n ME 7358 – Vibration Analysis of Electronic Systems

Fall Curriculum Packaging of Electronics and Optical Devices  Electronic Packaging Electives [select six (6) of eight (8) courses] - 18 hrs  ME 7314 – Introduction to Microelectromechanical Systems and Devices  ME 7335 – Convective Cooling of Electronics  ME 7344 – Conductive Cooling of Electronics  ME 7346 – Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems  ME 7348 – Thermal, Fluid, and Mechanical Measurements in Electronic Systems  ME 7360 – Electronic Product Design and Reliability  ME 7367 – Electronic Manufacturing Technology  ME 7359 – Analysis and Design of Optoelectronic Packages

Fall Schedule of Course Offerings Core Courses

Fall Schedule of Course Offerings Packaging Elective Courses (select 6 of 8)

Fall Training Programs Professional Certificates

Fall Training Programs Professional Certificates in Packaging of Electronics and Optical Devices Manufacturing Management Fundamentals Short Courses Cutting-edge topics for IT professionals

Fall Professional Certificate in Electronic Packaging Fundamentals A Graduate Certificate is earned upon the successful completion of three (3) courses selected from the following list of four (4) core courses: ME 7334 – Fundamentals of Electronic Packaging ME 7242 – Introduction to Thermal Management of Electronics ME 7343 – Electronic Packaging Materials: Processes, Properties, and Testing ME 7358 – Vibration Analysis of Electronic Systems

Fall Admission Requirements Professional Certificate in Electronic Packaging Fundamentals nStudents must have an undergraduate degree in science or engineering or five (5) years of directly relevant professional experience nStudents who complete the requirements for the professional certificate, and meet the admission requirements, can apply for admission as a degree-seeking student in the graduate degree program in Packaging of Electronics and Optical Devices nFor those students accepted into the graduate degree program, the courses taken to complete the professional certificate will count toward the graduate degree requirements

Fall Completion Requirements Professional Certificate in Electronic Packaging Fundamentals nThe professional certificate will be awarded upon completion of three (3) of the four (4) core courses with a grade of B or better in each of the three courses nThe three courses for the professional certificate must be completed within three (3) years from admission to the program

Fall Statement Regarding Thesis Requirement MS Degree with Major in Packaging of Electronics and Optical Devices

Fall Thesis Not Required for MS Degree For the MS degree with a major in Packaging of Electronics and Optical Devices, a thesis is not normally required If the student wants to pursue a research project and has a topic of sufficient applicability to the interests of the student’s sponsoring company, it is permissible to substitute a thesis for two (2) of the ten (10) courses required for graduation

Fall Thesis Requirement (continued) Basic requirements for substitution: n The research should be totally funded by the sponsoring company n The research may either be performed at SMU or on the premises of the sponsoring company, depending on the topic and the scope of the work n The student will need to select a faculty member to act as thesis advisor n SMU faculty and staff, associated with the project, are willing to sign a confidentiality agreement, but there is a basic requirement that the thesis, and any publications derived from the thesis, be publishable in the open literature n Depending on the scope of the work and the level-of-effort, it may be necessary for the student’s sponsoring company to compensate the faculty thesis advisor for time required for supervision

Engineering Leaders Masters Series Fall 2007 Loan Programs and Distributed Payment Plan for Tuition

Fall SMU Tuition Loan Programs nFor graduate students registered for a minimum of six hours per semester, go to and click on “Grad and Professional Students” nFederally backed low interest loans are available, and students may be eligible for up to $18,000 per year nPayment is not required until after the student finishes his or her studies nFor graduate students registering for three hours per semester, application websites for two lenders that offer educational loans nBoth of these lenders offer loans, which are consumer/credit based with variable interest rates. Funds are disbursed directly to the student, not the school.

Fall Distributed Tuition Payments nTo ease the pain of advance tuition payments prior to reimbursement by your company, SMU has created an arrangement whereby you can make distributed tuition payments through Sallie Mae nTwo payment plans are available depending on when you apply nThese are: 5 month/ten month payment plan and four month payment plan n 5 Month and 10 Month Payment Plans n Due Dates – The 1st of each month beginning June 1st n Enrollment fee - $50.00 for the 5 Pay Plan (Fall or Spring Only) and $100 for the 10 Pay Plan (Fall & Spring) n Last date to enroll in this plan for Fall is August 4th n Students can enroll by phone ( or ), online at or by mailing in the enrollment formwww.tuitionpay.com

Fall Distributed Tuition Payments n4 Month Payment Plan n Due Dates – August 25th, September 25th, October 25th, November 25th - Please note that this plan was set up so that the students MUST pay for the first (August 25th) payment and the enrollment fee AT THE TIME OF ENROLLMENT regardless of when they enroll in this plan. n Enrollment Fee - $ for plans $2, or less & $ for plans $2, or more. n The last date to enroll in this plan for Fall is September 30th n The only way to enroll for this plan is by PHONE. Students cannot enroll online. nThe 5 Month Payment Plan is offered before the fall semester begins. nThe 4 Month Payment Plan is offered to those students who are not able to make payment after payment due date. Those students who enroll on the 4 Month Payment Plan are also responsible for a $100 Late Payment Fee in addition to the enrollment fee.

Engineering Leaders Masters Series Fall 2007 Thumbnail Sketches of Coursework

Fall Core Courses nME Fundamentals of Electronic Packaging n This course is an introduction into all aspects of the packaging of electronics covered in this degree program nME 7342 – Introduction to Thermal Management of Electronics n This is an introductory course into all of the methods used for the thermal design and thermal management of electronic components and systems nME Electronic Packaging Materials: Processes, Properties, and Testing n This course covers all of the materials used in electronic components and systems and the properties of those materials nME 7358 – Vibration Analysis of Electronic Systems n This course introduces all aspects of the mechanical design of electronic components and systems, particularly in the areas of vibrations and mechanical shock

Fall Packaging Electives nME Introduction to Microelectromechanical Systems (MEMS) and Devices n This course develops the basics for microelectromechanical devices and systems, including microactuators, microsensors, and micromotors, micromachining techniques (surface and bulk micromachining), and microfabrication techniques nME Convective Cooling of Electronics n This course reviews of the fundamentals of convection heat transfer, followed by applications of these principals to the convective cooling of electronic components and systems. Special topics in convective cooling, such as spray cooling, jet-impingement cooling, microchannel cooling, and heat pipe applications will also be included. nME Conductive Cooling of Electronics n This course reviews of the fundamentals of conduction heat transfer, followed by application to the conductive cooling of electronics. Special topics in conductive cooling, such as contact conductance, interface thermal resistance, heat spreaders, thermal interface materials, phase change materials, and thermoelectric devices

Fall Packaging Electives (continued) nME Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems n This course focuses on the utilization of CAD tools to develop mechanical and thermal models of electronic systems and to design elements of these systems nME Thermal, Fluid, and Mechanical Measurements in Electronics n This course covers all methods of experimental measurements used in the design and testing of electronic systems. In addition, proper experimental procedures will be discussed nME Analysis and Design of Optoelectronic Packaging n This course will cover optical fiber interconnections, packaging for high-density optical back planes, selection of fiber technologies; semi-conductor laser and optical amplifier packaging, optical characteristics and requirements, optical alignment, and packaging

Fall Packaging Electives (continued) nME Electronic Product Design and Reliability n This course will investigate the failures, failure modes, and failure mechanisms in electronic systems, including failure detection, environmental stress tests, and failure analysis. n In addition, this course will cover temperature as a reliability factor and provide an overview of high temperature electronics, the use of silicon devices at high temperatures, and the selection of passive devices for use at high temperatures. nME 5/ Electronic Manufacturing Technology n This course covers an introduction to the electronics manufacturing industry, electronic components, interconnections, printed wiring boards, soldering and solderability, automated assembly, including leaded component insertion and surface mount device placement