Fast & Furious: Taming the Challenges of Advanced-Node Design Anirudh Devgan, Senior Vice President, Digital & Signoff Group

2© 2013 Anirudh Devgan. All rights reserved. By 2020 there will be over 10 billion mobile internet devices, and the core of each is a specialized semiconductor -Tablets -Smartphones -MP3 players -Gaming devices -Car electronics -Mobile video -Home entertainment -Wireless appliances Source: Morgan Stanley Semiconductors At the heart of the next technology wave Chassis Gateways Powertrain Instruments

3© 2013 Anirudh Devgan. All rights reserved. Low power important across markets – from smartphones to datacenters Time to market remains critical Feature-rich devices growing design size –Average number of IP blocks per design* –65nm: 48 IP Blocks –45/40nm: 73 IP Blocks –32/28nm 97 IP Blocks * Source: IBS Design Complexity is Increasing Complexity is growing exponentially – and signoff is the bottleneck Complexity = design size ● # views ● power ● performance ● time-to-market Mobile Computing Cloud/DatacentersConnectivity

4© 2013 Anirudh Devgan. All rights reserved. Over 50% of first tape outs in a new process slip the schedule What’s major cause? Customers Have Real Challenges How to avoid schedule delays Multi-CornerMulti-Corner Multi-ModeMulti-Mode RC Extraction Signal Integrity OCVOCV LDELDE Multi Voltage

5© 2013 Anirudh Devgan. All rights reserved. Challenges in Signoff and Design Closure More Timing Modes And Corners Multiple Clock Domains More Electrical Design Rules Timing Variation Modeling More Power Domains More Extraction Corners New Device Types More Voltage Domains Lower V DD Electrical Design Challenges Analog Effects

6© 2013 Anirudh Devgan. All rights reserved. Challenges in Signoff and Design Closure More Parasitic Devices More Physical Design Rules More Complex PV Design Rules Layout Dependent Effects Multi-patterning New Device Types Device Variation More Complex Litho / OPC Rules More Time Spent In Signoff & Design Closure At Advanced Nodes Physical Design Challenges CMP Litho 3D Devices

7© 2013 Anirudh Devgan. All rights reserved. What is the solution ?

8© 2013 Anirudh Devgan. All rights reserved. Cadence Silicon Signoff & Verification Solutions Bringing Innovation To Signoff  Better Solvers For Better Scalable Performance  Productivity Through Integration with Fast Accurate Built-Engines  Improved Accuracy – Both For Tools And Models

9© 2013 Anirudh Devgan. All rights reserved. SSV Technology Pillars SSV Signoff Key Priorities Efficient Scalability With Multiple CPU’s and Machines Performance “In-Design” Integration – Critical for both analog & digital below 28nm Integration with Implementation Significantly faster timing, power Closure, not just analysis Improved Multi-Mode/Corner Solvers Productivity with built-in Design Closure New Solvers with Improved Accuracy Algorithms Higher Accuracy Engines Needed For 20nm and Below Accuracy

10© 2013 Anirudh Devgan. All rights reserved. Tempus Timing Signoff Solution New technology accelerates timing analysis and closure by weeks Introduced: May 2013 TSMC certifies Tempus Timing Signoff Solution Endorsed by Texas Instruments for advanced giga-scale, giga-performance ICs Performance Massively parallelized Scalable to 100s of CPUs Up to 10X speed up over competition Accuracy 10X faster path-based analysis Advanced process modeling Closure 10X reduction in closure time Unlimited MMMC capacity Incremental Design Closure

11© 2013 Anirudh Devgan. All rights reserved. Voltus IC Power Integrity Solution Massively parallel execution delivers high performance for up to one billion instances “IDT produces industry-leading products across a wide range of nodes and applications, and we were pleased to see the Voltus technology delivers up to a 10X performance improvement across various test cases ranging from 180nm to 28nm designs.” - Alan Coady, senior director, IDT “We are teaming early on with Cadence to validate the Voltus technology and we are impressed by its performance gains. This type of enhanced productivity is invaluable to help us meet our time-to-market goals.” - Ken Hansen, vice president and chief technology officer at Freescale Semiconductor Introduced: Nov Voltus™: Breakthrough technology in power integrity analysis and signoff Up to 10X faster performance over existing solutions Certified for TSMC 16nm FinFET process Integrated with key Cadence technology for fast design signoff and closure

12© 2013 Anirudh Devgan. All rights reserved. Voltus: Tilera Press Release – 11/19/2013 Without any loss of accuracy from 65 hours to 8 hours for dynamic analysis and from 12 hours to 2.5 hours for static analysis. Without any loss of accuracy, Tilera cut power signoff runtime for this highly integrated 72 core system-on-a-chip design from 65 hours to 8 hours for dynamic analysis and from 12 hours to 2.5 hours for static analysis. achieved an 8X run-time performance improvement for power signoff of its largest design to date, the TILE-Gx72 processor

13© 2013 Anirudh Devgan. All rights reserved. Key Differentiation Tempus Up To10x Speed Up Massively Parallel Execution Signoff ECO Voltus / VPS Up To 10X Speed Up Massively Parallel Execution In-design Productivity QRC QRC 2X-3X Performance Gain QRC-Field Solver ~25X Average Speed Up In-design Productivity PVS / IPVS 2X Soc DRC Speed Up In-design Productivity DFM 2X Better Performance Over Competing Products In-design Productivity Strong Advanced Node Foundry Support SSV Current Product Performance Status Significant Increase In Productivity

14© 2013 Anirudh Devgan. All rights reserved. Cadence Silicon Signoff & Verification Solutions Bringing Innovation To Signoff Establish Cadence as a technology leader in signoff Develop Best-in-class products Our Goal: Enable faster design tape-outs by reducing time spent in design closure and signoff by fixing problems, not just analyzing them

15© 2013 Anirudh Devgan. All rights reserved.