W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics  Motivation: u Overheating of electronics causes premature failure  Requirements: u 100 mW per channel u Total for type 1(inner) module ~ 30 W u Want operating T < 50 ºC  Old Cooling Plan 60 mW): u Heat generated by IC u through stamp board u through legs/sockets u into cooling plate u to mounting channel/tubing u to cooling fluid

W. EbensteinDOE Review Duke UniversitySeptember 1999  From Lund: u ASDBLR & DTMROC dummy boards (pictured here) u Roof boards u Readout and display software

W. EbensteinDOE Review Duke UniversitySeptember 1999  Insulated box for performing cooling studies:

W. EbensteinDOE Review Duke UniversitySeptember 1999  1 mm PG cooling plate on type 1 tension plate with Lund mockup electronics (one roof board and two stamp board sets removed)

W. EbensteinDOE Review Duke UniversitySeptember 1999  Results: (60 mW / coolant at 14 ºC) u 1.3 mm Aluminum cooling plate:  ASDBLR: 46.5 ºC  DTMROC: 48.8 ºC  roof boards: 38.8 ºC  cooling, tension plates: ~ 27 ºC u 1.0 mm Aluminum cooling plate:  estimate 4 º higher than above u 1.0 mm PG cooling plate:  ASDBLR: 49.3 ºC  DTMROC: 51.1 ºC  roof boards: 39.5 ºC  cooling, tension plates: ~ 27 ºC u (Typical range: ± 2 ºC) u For 75 mW, add ~9 ºC

W. EbensteinDOE Review Duke UniversitySeptember 1999  New Cooling Plan for 100 mW: u Keep old scheme, and:  Make lower cooling plate thinner  Add upper cooling plate  Plates share cooling tubing u Reasons:  Increase in power expected to come mostly from upper chip (DTMROC)  Too late to make major changes to lower plate design  As always, must minimize material to reduce radiation length

W. EbensteinDOE Review Duke UniversitySeptember 1999  New mockup, showing PG vertical rail connecting cooling plates

W. EbensteinDOE Review Duke UniversitySeptember 1999  New mockup with one roof board removed, showing upper cooling plate

W. EbensteinDOE Review Duke UniversitySeptember 1999  Results: (100 mW - 40/60) u “0.6 mm” Aluminum cooling plates:  ASDBLR: 49 ºC  DTMROC: 50 ºC  roof boards: 28 ºC  cooling, tension plates: ºC

W. EbensteinDOE Review Duke UniversitySeptember 1999  Present Activities: u Proceeding with two-plate prototype:  0.6 mm thick lower plate  0.6 mm (at min) upper plate  3.3 mm wide PG connection from cooling tubing to upper plate, attached with metal-filled epoxy u Proceeding with FEA calculation:  Will model one (or a few) electronics stacks with all cooling parts  Steady state - simplifies problem  Will be able to parameterize plate thickness and material properties to validate and optimize design

W. EbensteinDOE Review Duke UniversitySeptember 1999  Summary: u Two plate design works at 100 mW u Will fine tune dimensions, material choices from:  results of FEA calculations  mockup results with various configurations  measured power consumption of real electronics  changes due to redesign of board-to-board connection (Lund flex design)  changes due to placement of electronics on stamp boards