PCB issues requirements & procurement MMM Würzburg, 30/01/2014J. Wotschack1

Requirements  PCB WG (R. de Oliveira, P. Iengo, G. Maccarrone, F. Jeanneau, V. Polychronakos, M. Iodice) met for the 1 st time on 5 Dec 2013  Discussed first draft of Specification Document  Agreed on test orders in industry for glueing of Kapton foil and pillar deposition  Next meeting scheduled: 18 Feb  The specifications will include some items relevant for detector construction  Precision on positioning holes  Precision on outer PCB dimensions (cutting)  PCB planarity (thickness variations) MMM Würzburg, 30/01/2014J. Wotschack2

Proposal for board segmentation I (1) 2047 (1023) 2049 (1) 3072 (1024) Strip counting Two missing strips: Strip# 1024 and 2048 Connection to electronics PCB 6: last strip not connected PCB 7: last strip not connected PCB 8: all strips connected What to do with not connected strips on the electronics side? Example: 3-board eta-strip panel PCB 6 PCB 7 PCB 8 Alignment holes 200+ µm MMM meeting, 22/01/2014G. Sekhniaidze/ J. Wotschack3

Procurement  Split orders into different contracts  PCB material (2–3 providers?)  PCB patterning (2–3 companies)  Resistive-strip foils (Japan: in-kind contribution)  Glueing (2–3 industries)  Pillar making (2–3 companies, could be the same as PCB patterning)  Board layout  CERN (G. Sekhniaidze + R. de Oliveira) MMM Würzburg, 30/01/2014J. Wotschack4

Timeline  Test phase  Glueing and pillar deposition test under way (CEA, INFN, BNL) expect to be done in March 2014  Module-0  Need all PCB types (32 board types = 24 PCBs layouts, some with two boards/PCB) – 4 (?) boards/type  Typical cost: 2000 CHF/PCB = 200 kCHF (?)  Smaller number of boards will not change the costs considerably  How to finance the production?  Drawings: CERN, to be finalized in April  Orders to (?) Eltos, Elvia, Triangle Lab in May 2014  PCB delivery ≥August 2014 MMM Würzburg, 30/01/2014J. Wotschack5

Timeline for mass production  Volume: 1.8 MCHF  Need to go through CERN purchasing procedure even if orders are split into several contracts  Estimated duration: 4–6 months to contracts  Schedule  Start tendering process in June/July 2014, need (almost) final drawings  Contracts must be signed in November  First completed boards expected in Feb 2015 (?)  Split orders into three batches:  SM1+LM1 (512), LM2 (512), SM2 (512) MMM Würzburg, 30/01/2014J. Wotschack6

Conclusions  Time is short  Need to freeze layout and PCB production scheme very soon for Module-0  Very little time between Module-0 PCB reception and final orders (tendering)  Final drawings not later than June/July 2014, Module-0 drawings in March/April  Contracts must be signed in November 2014 MMM Würzburg, 30/01/2014J. Wotschack7