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ATLAS-NSW CERN MMM workshop assembly of the module (quadruplet)

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Presentation on theme: "ATLAS-NSW CERN MMM workshop assembly of the module (quadruplet)"— Presentation transcript:

1 ATLAS-NSW CERN MMM workshop assembly of the module (quadruplet)
Patrick PONSOT for the CEA-Saclay-Irfu group: F.Bauer, P.Daniel-Thomas, E.Ferrer-Ribas, J.Galan, W.Gamache, A.Giganon, P-F.Giraud, P.Graffin, S.Hassani, S.Herlant, S.Hervé, F.Jeanneau, H.LeProvost, O.Meunier, A.Peyaud, Ph.Schune 21-22 of February 2013

2 OUTLINE Principle about the planarity of the PCBs
How to build a flat double plane (// at 80µm)? How to keep under control the deformation of the 4 PCBs inside a quadruplet (only one in-plane alignment system per quadruplet)? How to align the PCBs during assembly of the doublet or quadruplet? Saclay’s plan 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

3 Principle about planarity
Planarity of the PCBs should be better than 50µm. The baseline: Doublet are made of thinner PCBs with honeycomb (or foam) The planarity is given by the symmetry of the structure (assembly procedure should provide this, no asymmetric residual constraints…) Better is the symmetry, better will be the planarity Planarity is coming from the assembly procedure 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

4 Principle about planarity
Planarity of the PCBs should be better than 50µm, is it possible to get it only with spacers? Planarity of the assembly is partially destroyed by the stiffness of the PCBs which try to recover their initial geometry Between spacers there is nothing to avoid this effect 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

5 Building a flat double-plane
How to build a flat double plane (// at 80µm)? Each proposal should be checked with tests? With honeycomb and glue compensation for parallelism of the 2 PCBs (will be tested at Saclay) With additional calibrated spacers inside the honeycombs to control the parallelism of the 2 PCBs during the gluing (tests are in progress at CERN) By piling of planes with adjusted spacers at each gluing step (proposal from Hermann) …etc. Tests are planned at Saclay Tests are done at CERN with the help of the Saclay antenna Proposal from Hermann (Tests?) 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

6 Building a flat double-plane
Preparation of gluing tests at Saclay A new marble (3mx2m) will be delivered on April (today, the size of our marble is 2mx0.9m) An optical head on the CMM machine will be available on March Material to do gluing with vacuum has been ordered Measurements of the thickness of Nomex honeycombs has been done (9.96 to 10.01mm) Gluing tests of the drift pillars have been done (results on the next slides) Compression tests are performed at present, to estimate the maximum pressure that we can apply during gluing procedure without stress on the PCBs …etc. 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

7 deformation of a quadruplet
How to keep under control the deformation of all the 4 PCBs inside a quadruplet with only one in-plane alignment system? The idea is to glue drift pillars to distribute the deformation to all PCBs Stress test of drift pillars: Various geometry size of coverlay (but thickness for all 128mm) Pillars made out of ceramic or peek and either with a central “glue gap” or not Glue  Araldite 2011 Tests performed with a bulked MESH or a standard MESH 5mm 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

8 Stress test of drift pillars
2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

9 Stress test of drift pillars
Summary of the results (at least 3Kg are expected) CERAMIC PEEK “Glue gap” CERAMIC Copper Tear 9.6kg Tear 6.3kg Tear 8.4kg Copper + Coverlay Tear 10.5kg Tear pillars + standard Mesh Tear 10.87kg Pillars + bulked Mesh Broke 11.08kg We have a conclusive gluing process – CERAMIC wins 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

10 Layout of the PCBs proposed by Rui
Alignment of the pcbs How to align the PCBs during assembly of the doublet or quadruplet? Against pins fixed on the marble (as for sTGC) Or with Rasnik© alignment systems (masks could be done directly on the PCBs) An optical test will be done with reducing of the thickness of the PCB (0.2mm) to define if we can form the image through the FR4 Layout of the PCBs proposed by Rui 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

11 Saclay’s plan Measurement of the stiffness of a composite panel
Mock-ups and a stiffener will be done to define a more realistic Young modulus for simulation (1mx0.6m) Measurement of the deformation of a doublet (mechanical and thermal loadings) 3 stiffeners will be done to study the distribution of the deformation with the spacers glued in the drift gap (ceramic pillars) Contribution for mechanical prototype with 4 modules (quadruplets) Design and simulations Building of the largest module (M4) The construction of a small operational quadruplet (1.2mx0.6m) The idea is to identify the main problems to prepare the study of the module -1 2013/02/21-22 CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT

12 DSM Irfu SIS/LCAP (PC N°12, Bt 123) Patrick PONSOT
Thank you for your attention ! Commissariat à l’énergie atomique et aux énergies alternatives Centre de Saclay | Gif-sur-Yvette Cedex T. +33 (0) | F. +33 (0) Etablissement public à caractère industriel et commercial | RCS Paris B DSM Irfu SIS/LCAP (PC N°12, Bt 123) Patrick PONSOT CERN MMM workshop - CEA-Saclay/DSM/Irfu - Patrick PONSOT 2013/02/21-22


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