5x mixed with 25x Reduction 1.Draw mask, keeping 25x features within a 3mm square, within the traditional 14-15mm 5x die 2.When printing masks scale 25x.

Slides:



Advertisements
Similar presentations
Manufacturing Processes for a 4 Layer Multi-layer PCB Section through PCB Via hole SMD Pad The following presentation covers the main processes during.
Advertisements

BARTOSZEK ENGINEERING 1 The Design of the Booster Collimators Larry Bartoszek BARTOSZEK ENGINEERING 3/10/03.
Bumm/OU NanoLab Assembling Your EL Lamp Cleaning the ITO Application of the phosphor layer Application of the dielectric layer Application of the back.
ECE/ChE 4752: Microelectronics Processing Laboratory
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #6.
SEACORK INSTALLATION ON A CATAMARAN The first step is to make templates of all corner pieces to be cut from sheet material, which will be used for border.
One Way Circuits Limited Printed Circuit Board Manufacturer A Guide To Manufacturing Multilayer PCBs Use Left and Right Cursor keys to navigate ESC to.
Photolithography Photolithography is the transfer of patterns, circuits, device structures, etc. to a substrate or wafer using light and a mask.
For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN © 2002.
Design and Implementation of VLSI Systems (EN1600) lecture04 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Sedra/Prentice.
Top Side Conductor vacuum deposition Aluminum sputter deposit in Argon plasma CVC 601-sputter deposition tool.
Zarelab Guide to Microfluidic Lithography Author: Eric Hall, 02/03/09.
ACTFEL Alternating Current Thin Film Electroluminescent Lamps.
Click the mouse to continue. Aligning cell contents You align data in a cell in relation to the edges of the cell. Aligned on the right side of the cell.
Preparing & Exposing Photographic Silkscreens For use with Lesson 3 FOR EDUCATION USE ONLY ©2009 The Andy Warhol Museum, a museum of Carnegie Institute.
Workshop for NFF Nanoimprint System NFF MA6 Nanoimprint Upgrade.
Logo’s. Designing a logo for the bag Because we will be using a hand scanner to create our log, you will need to remember a number of things: 1. The maximum.
Status and outlook of the Medipix3 TSV project
TEM Prep using FIB and Kleindiek Micro-Manipulator General Reminders, Tips and Tricks When in FIB view, work quickly to do what is needed and then freeze.
Stencil and Photographic Silkscreen Printing For use with Lesson 6 FOR EDUCATION USE ONLY ©2009 The Andy Warhol Museum, a museum of Carnegie Institute.
PLAN #PartProcessTools and equipmentQuality controlSafety *Aprons must be worn is ALL stages of manufacture Tim e 1 MDF base Mark out on MDF piece Pencil,
Contact Print. A contact print is a photographic image produced from a film, usually a negative. The defining characteristic of a contact print is that.
Lecture 4 Photolithography.
1 EECS 373 Design of Microprocessor-Based Systems Prabal Dutta University of Michigan Lecture 13: PCB Design Oct 12, 2010 Some material from Mark Brehob.
Hongbo Zhang, Yuelin Du, Martin D.F. Wong, Yunfei Deng, Pawitter Mangat Synopsys Inc., USA Dept. of ECE, Univ. of Illinois at Urbana-Champaign GlobalFoundries.
Chris A. Mack, Fundamental Principles of Optical Lithography, (c) Figure 1.1 Diagram of a simple subtractive patterning process.
PCB manufacturing PCBpro.com.
PRST5450-eTraining presents… Book Repair Issues: “Tipping-In”
3-color reduction method. Gutenberg press created the ability to mass produce work. Gutenberg press created the ability to mass produce work. Print would.
Slide Medium 35mm Slides. Slide Medium 35mm Slides DEFINITION: A slide is a small format photographic transparency, individually mounted for one-at-a-
Page 1 Workshop for Electron Beam Lithography System JBX-6300FS By Nelson LI 13 November 2009 Nanoelectronics Fabrication Facility.
Big Books. Purpose of Big Books Reading Big Books together is non- threatening “social learning activity”. They show students how to read naturally, with.
A lesson approach © 2011 The McGraw-Hill Companies, Inc. All rights reserved. a lesson approach Microsoft® PowerPoint 2010 © 2011 The McGraw-Hill Companies,
LITHOGRAPHY IN THE TOP-DOWN PROCESS - NEW CONCEPTS
EUV Maskless Lithography J. Vac. Sci. Technol. B 30, (2012); 9/25/20121K. Johnson
Chapter 3 Drafting Media and Reproduction Methods.
Presenter Name Facility Name Ultra Thin CCD detectors for particle physics experiments.
Silk Screening.
Center for Materials for Information Technology an NSF Materials Science and Engineering Center Optical Lithography Lecture 13 G.J. Mankey
Lithography in the Top Down Method New Concepts Lithography In the Top-Down Process New Concepts Learning Objectives –To identify issues in current photolithography.
ANM 104 DESIGN THEORY & PRACTICE 1) Foundation Portfolio Information 2) Digital Image Composition Review & File Check 3) Digital Image Composition Work.
Exercise Lecture 7 Completing Exercise - Lecture 6 1.Create Your Own Blocks 2.Insert Blocks to Your New Drawing 3.Using Different Hatching Types.
1 Overview of Fabrication Processes of MOSFETs and Layout Design Rules.
Photo lithography. Why? Add a photo sensitive layer ontop of a material. After treating with UV light, remove the affected areas. After processing (e.g.
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING
LITHOGRAPHY IN THE TOP-DOWN PROCESS - BASICS
Fabrication Process for Micro Structures
Section 2: Lithography Jaeger Chapter 2 EE143 – Ali Javey.
Beyond the Border. Overview Create a 2D art piece with a composition that has center of interest. Explore the expansions of the main subject matter that.
Trieste, 8-10 November 1999 CMOS technology1 Design rules The limitations of the patterning process give rise to a set of mask design guidelines called.
Antenna Project in Cameron clean room Wafer preparation, conductor deposition, photolithography.
EE412 Deep Trench Spray Coating Final Presentation Karthik Vijayraghavan Mentor : Jason Parker 12/08/
Equipment and technological processes for manufacturing GaAs MMICs LITHOGRAPHY ONE TALK 3 1.
Wisconsin Center for Applied Microelectronics
Photolithography Photolithography is the transfer of patterns, circuits, device structures, etc. to a substrate or wafer using light and a mask.
EE 3311/7312 MOSFET Fabrication
Lithography.
Electron-beam lithography with the Raith EBPG
Electron-beam lithography with the Raith EBPG
ادوات الرسم الهندسي T1- مسطرة حرف 2- مثلثات 45 و مسطرة قياس
An Introduction to the Enlarger and Project 1
Relief printing is a printmaking process where protruding surface faces of the printing plate or block are inked; recessed areas are ink free.
Electron-beam lithography with the Raith EBPG
LITHOGRAPHY Lithography is the process of imprinting a geometric pattern from a mask onto a thin layer of material called a resist which is a radiation.
How to trim a sketch. How to model a mini iphone keyring stand.
Laboratory: A Typical Lithography Process
Learning outcomes All will trim the edges of their mask to make it neater All will draw the main features and details onto their mask Most will begin to.
Learning outcomes All will make improvements to the painted areas by adding a 2nd layer All will paint all areas of their mask Most will show their ability.
Area Of Composite Shapes
Learning outcomes All will add a base layer of paint to their mask
Presentation transcript:

5x mixed with 25x Reduction 1.Draw mask, keeping 25x features within a 3mm square, within the traditional 14-15mm 5x die 2.When printing masks scale 25x layers by 25 times 5x 25x

25x Reduction: alignment marks 3.Create 5” mask with stepper marks on edges, and two alignment marks at fixed spacing (i.e. 50mm). This will be used for contact lithography, at 1x scale 5x

25x Reduction: alignment marks 4.Create 5” mask with central alignment mark as used in previous step (step 3) but scaled 5x larger. 5x

25x Reduction: first reduction 5.Project 25x features onto 3” thin mask once in roughly center of mask 6.Leaving 3” mask in place in stepper, project alignment transparency from step 4 onto 3” mask at known spacing set by step 3 (i.e. 50mm) 5x 3” Mask

25x Reduction: first reduction 7.Develop and etch 3” mask 8.Using flood exposure tool and 1x alignment mask from Step 3, expose a 5” mask plate 5x 5” Mask

25x Reduction: spot develop 5” mask 9.Using dropper, spot develop and spot etch the alignment marks on 5” mask. DO NOT STRIP PR

25x Reduction: flood 5” mask 10.Using flood exposure tool, manually align the developed 3” mask to the features on the 5” mask and expose the 5” mask through the 3” mask. Be sure to place the chrome sides together 11.Develop and etch the 5” mask 3” Mask

25x Reduction: second reduction 12.Place 5” mask in stepper and expose final 3” thin mask using same program as normal 5x masks 13.To avoid getting alignment marks on 3” mask be sure to close down the x-y shutters to around % 3” Mask

25x Reduction: Conclusions Using this process, can use a mixture of 5x and 25x masks Additional processing time of about 1 hour per 25x mask One 3” and one 5” mask are wasted as a result Excellent feature definition from printed transparencies No e-beam mask conversion