1 Project Assignment Chris Allen Course website URL people.eecs.ku.edu/~callen/713/EECS713.htm

2 Project purpose and scope Purpose Demonstrate a working knowledge of high-speed digital design Individual work This work is to be performed by each individual student Issues to be addressed may include circuit schematic definition, detailed timing analysis, component placement, transmission line design and routing, thermal management, board stack design, crosstalk, EMI reduction, timing skew, clock generation and distribution, device characterization, the effect of packaging on electrical performance, decoupling and bypass capacitor selection and placement, differing termination options, cables and connectors, and return signal current Deliverables may include Circuit schematic, timing diagrams, layout artwork, test procedures, project write-up

3 Project purpose and scope Topic approval Project selection, scope, and deliverables must be approved by the instructor prior to the initiation of the work Presentation schedule and evaluation During the last few scheduled days for this class, each student shall deliver a 5-minute presentation to the class on the project objectives, its treatment (design, analysis, findings, etc.) and conclusions. Completed project deliverables are due on the last day of class (Thursday Dec 12). Project scores will be based on the presentation quality and content (20%), project complexity (30%), and the quality and completeness of the report (50%). Presentation quality and content will be assessed by the audience.

4 Project report Report includes: Cover page (1 pg) includes title, author’s name, abstract Report body (12 pgs max) introduction clearly outlines project’s scope and relevance to high-speed digital description of research process, findings, and analysis conclusions References cite references properly to avoid plagiarism Appendices (if needed) data, graphs, program code, minimal text Format: All margins 1”, 11-pt Arial font, line spacing of 1.5 Due on 12 Dec 2013 at 5 pm Electronic submission, pdf format Evaluation based on technical content, writing, format, etc

5 Project topic suggestions (1 of 2) Project selection is the responsibility of the student and projects must be approved by the instructor. Suggested projects are listed below. Projects can be completely paper design or it may have both a paper design and a hardware component (this will be one factor in determining the complexity). 1.Work / research related project involving the design of a high-speed digital circuit. 2.Challenging, general-purpose high-speed digital designs such as: high-speed data acquisition system (A/D, memory with memory controller) high-speed arbitrary waveform generator (D/A, memory with memory controller) direct digital waveform synthesis (DDS, D/A with control logic) 3.Design two classroom demonstrations which demonstrate concepts and/or principles related to high-speed digital design. You may use the examples given in the text as guide, however do not simply duplicate these for this project. Any custom test fixtures must also be designed and detailed as part of this project.

6 Project topic suggestions (2 of 2) 4.Design one laboratory exercise for students enrolled in a future laboratory that would accompany this class. The lab exercise should state its objective, the student’s pre-lab preparation, the equipment required, the steps to be followed, the questions to be answered, data analysis and write-up. Any custom test fixtures must also be designed and detailed as part of this project. 5.Literature review of a high-speed digital circuit related topic that was not thoroughly covered in class. Find two or three published research papers that report on a central topic and provide an overview, background, interpretation, and conclusion. Suggested sources are listed on the following slide. Hardware-oriented projects must demonstrate the concept, i.e., laboratory measurements must be made using instruments available in the EECS teaching laboratories.

7 Literature resources for project (1 of 2) IEEE Transactions on Advanced Packaging focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2008, 2009 International Symposium on Advanced Packaging Materials 1997 – 2007 IEE Colloquium on Advances in Interconnection Technology 1991 International Symposium for Design and Technology of Electronics Packages (SIITME) 2009 IEE Colloquium on Diamond in Electronics and Optics 1993

8 Literature resources for project (2 of 2) IEEE Multi-Chip Module Conference International Conference on Multichip Modules and High Density Packaging 1998 International Conference on Thermal Issues in Emerging Technologies: Theory and Application, THETA, International Conference on Wafer Scale Integration IEEE Transactions on Components and Packaging Technologies IEEE Topical Meeting on Electrical Performance of Electronic Packaging