Introduction to K2E Devices

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Presentation transcript:

Introduction to K2E Devices KeyStone Training Multicore Applications Ran Katzur, Senior Applications Engineer, Training Lead

Agenda KeyStone Device Overview Introducing K2E (Edison) K2E Software For More Information

KeyStone Device Overview

Keystone II: K2H/K2K Devices High-performance ARM + DSP Memory Subsystem: Multi-bank shared memory 32- to 36- (40) bit translation Smart access arbitration Error detect/protect/correct Multicore Navigator: HW routing NETCP: HW acceleration Lots of connectivity: High bit-rate peripherals: SRIO, PCIe, Ethernet Device-specific: TSIP HyperLink: Seamless interface TeraNet: Non-blocking Smart arbitration Fast and wide

Keystone I: C667x Devices S R I O x4 P C e x2 U A T 2 GPIO w i t c h E r n G M Packet DMA Multicore Navigator Queue Manager MSMC MSM SRAM Memory Subsystem 1 to 8 Cores @ up to 1.25 GHz C66x™ CorePac L1P Cache/RAM L1D L2 Memory Cache/RAM HyperLink TeraNet Network Coprocessor Power Boot ROM Semaphore x3 PLL EDMA Management DDR3 EMIF Debug/Trace Accelerator Security Device Specific I/O High end of the market for signal processing: Amazing performance Great SOC features Challenges for broad market: Power consumption 10-15W Prices reflect performance NEW 5

Keystone I: C665x Devices (Gauss) 1 Cores @ 850 MHz C66x™ CorePac C6654 MSMC 32-Bit DDR3 EMIF Memory Subsystem Packet DMA Multicore Navigator Queue Manager PLL EDMA TeraNet Ethernet MAC SGMII S P I U A R T x2 C e I2C M c B G O EMIF16 Boot ROM Debug/Trace Power Management Semaphore Security / Key Manager Timers 32KB L1P Cache/RAM 32KB L1D 1024KB L2 Cache Signal Processing Engine Maintains most advantages of KeyStone, except: Few, more generic, accelerators No NETCP No TSIP, but McBSP Smaller, slower DDR, less pins Typical applications: Power limitations (sealed box) Performance requirements that can be achieved with 1-2 DSP cores No requirement for accelerators or TSIP Smaller DDR requirements NEW 6

Embedded Processing Domain

TI Embedded Processing Devices

Introducing K2E (Edison)

K2E Features Summary Powerful Quad-ARM A15 CorePac with 0-1 DSP CorePac support, as needed Robust Ethernet options: Up to 2 ports 10G and 8 ports 1G Multiple MDIOs support multiple physical Ethernet interfaces Optimized external data movement: Standard high-bit rate interfaces: Ethernet and PCIe (No SRIO) EDMA and Multicore Navigator Optimized internal traffic, priorities, arbitrations TeraNet bus MSMC Fast (1600 MHz), wide (72 bits), and large (8G) external memory; DDRA only

Comparing K2H and K2E Architecture K2H K2E ARM CorePacs 2 or 4 1, 2, or 4 DSP CorePacs 4 or 8 0 or 1 DSP Maximum Clock 1.2 GHz 1.4 GHz External Memory DDRA and DDRB DDRA only MSMC Memory (Shared L2) 6 MB 2 MB PLL 5x 3x SRIO 4x (20 Gbaud) NA Multicore Navigator 2 QMSS (16K queues) Single QMSS (8K queues) Hyperlink 2x 1x 5-Port 1GB Switch 1-2x 3-Port 10GB Switch USIM (Universal Subscriber Identity Module) TSIP USB 3.0 Secure Mode No Yes MDIO

Typical K2E Application Requirements Small, medium, or large I/O bandwidth Efficient signal-processing calculations; Fixed-point or floating- point or both Efficient power and performance: ARM A15 has high processing-to-power ratio NETCP offloads network processing Communication and networking interfaces 2x 10G and 8x 1G 2x PCIe and 3x USB

66AK2E05 Key Features Powerful microcomputer with DSP coprocessor Quad-ARM A15 CorePac 1x Queue Manager supports up to 8K queues 1x Network Coprocessor (NETCP) 1x 3-port 10GBE Switch Subsystem 10 Ethernet ports: 2x 10G 8x 1G Telecommunications Serial Port (TSIP) 2x PCIe and 2x USB 3.0 to support solid-state drive NEW 13

66AK2E05 Applications Communication and networking Fast hard-disk storage (PCIe, USB) Imaging, including analytics Example: Defense communication systems Advantages Integrated SOC solution High-speed communication and disk bandwidth for data storage DSP enables on-the-fly data processing Ability to scale up using HyperLink, or scale down using 66AK2E02 Low power (compared to other solutions) NEW 14

TI Embedded Processing Devices

66AK2E02 Key Features Scaled-down version of 66AK2E05 High connectivity, but does not have 10GBE 2x PCIe and 2x USB 3.0 enables fast disk storage Communication, storage with some analytics NEW 16

66AK2E02 Applications Smart Grid and Smart Metering Factory automation Building control Aerospace and defense Industrial networking and Fieldbus protocols (IEC 61158) Medical imaging NEW 17

TI Embedded Processing Devices

AM5K2E04 Key Features ARM-only TI multicore device (First in the KeyStone architecture) Quad-ARM A15 CorePac 1x Queue Manager supports up to 8K queues 1x Network Coprocessor (NETCP) 1x 3-port 10GBE Switch Subsystem Telecommunications Serial Port (TSIP) 2x PCIe and 2x USB 3.0 to support solid-state drive NEW 19

AM5K2E04 Applications Networking: Enterprise Service Provider Data Center/Cloud Industrial network and Fieldbus protocols (IEC 61158) Other industrial applications that do not require DSP NEW 20

AM5K2E04 Wins Defense Munitions Flight Control Panel Power efficiency High-performance processing Large amount of internal memory Efficient ARM instructions Flight Control Panel High-performance, Linux- based processor Open-source applications available Efficient memory and internal bus utilization (MSMC, TeraNet) Support for big Endian NEW 21

TI Embedded Processing Devices

AM5K2E02 Key Features/Applications Scaled-down version of AM5K2E04 Dual-ARM A15 CorePac 1x NETCP 10GBE not included Supports low-end applications of AM5K2E04 NEW 23

TI Embedded Processing Devices

K2E Software

K2E Software Support MCSDK _03_01_XX supports K2E and K2L (also, K2K and K2H): Contiguous memory (cmem) allocation for ARM User Space enables internal and external DMA-based communication. User Space IO (UIO) driver support for mmap interface, interrupt handling, and chip power control TSIP LLD: MCSDK_3_1_0_2\pdk_keystone2_3_01_00_02\packages\ti\drv\tsip mmap LLD: MCSDK_3_1_0_2\pdk_keystone2_3_01_00_02\packages\ti\runtime\mmap Automatic setting of EVM frequency based on the chip EFUSE value instead of environment variable in Uboot

For More Information Datasheets: Product Folders: 66AK2E05/02: http://www.ti.com/lit/SPRS865 AM5K2E04/02: http://www.ti.com/lit/SPRS864 Product Folders: 66AK2E05: http://www.ti.com/product/66ak2e05 66AK2E02: http://www.ti.com/product/66ak2e02 AM5K2E04: http://www.ti.com/product/am5k2e04 AM5K2E02: http://www.ti.com/product/am5k2e02 For questions regarding topics covered in this training, visit the support forums at the TI E2E Community website.