Semiconductor Memories ECE423 Xiang Yu 12.16.06. RAM vs. ROM  Volatile  RAM (random access) SRAM (static) SRAM (static) SynchronousSynchronous AsynchronousAsynchronous.

Slides:



Advertisements
Similar presentations
Chapter 5 Internal Memory
Advertisements

Computer Organization and Architecture
Computer Organization and Architecture
+ CS 325: CS Hardware and Software Organization and Architecture Internal Memory.
D75P 34 – HNC Computer Architecture Week 10 Computer Memory. © C Nyssen/Aberdeen College 2003 All images © C Nyssen/Aberdeen College except where stated.
FERROELECTRIC RAM.
9/20/6Lecture 14 - Static Memory1 Static Memory. 9/20/6Lecture 14 - Static Memory2 Static Memory.
ECE 301 – Digital Electronics Memory (Lecture #21)
Computer Organization and Architecture
Chapter 5 Internal Memory
IT Systems Memory EN230-1 Justin Champion C208 –
Memory Key component of a computer system is its memory system to store programs and data. ITCS 3181 Logic and Computer Systems 2014 B. Wilkinson Slides12.ppt.
CSCI 4717/5717 Computer Architecture
F1020/F1031 COMPUTER HARDWARE MEMORY. Read-only Memory (ROM) Basic instructions for booting the computer and loading the operating system are stored in.
Lecture # 13 Memory and Storage
Intro to Cache Memory By david hsu. Examples of memory Paper and writing, books Neon signs Cassettes and other magnetic tape memory Abacus Art material.
12/1/2004EE 42 fall 2004 lecture 381 Lecture #38: Memory (2) Last lecture: –Memory Architecture –Static Ram This lecture –Dynamic Ram –E 2 memory.
Physical Memory By Gregory Marshall. MEMORY HIERARCHY.
Chapter 4 ระบบหน่วยความจำ The Memory System
2. Memory. Main memory – speed & types Organization of RAM RAM – Random Access Mem Static RAM [SRAM] - In SRAM, a bit of data is stored using the state.
Lecture on Electronic Memories. What Is Electronic Memory? Electronic device that stores digital information Types –Volatile v. non-volatile –Static v.
Faculty of Information Technology Department of Computer Science Computer Organization and Assembly Language Chapter 5 Internal Memory.
Ovonic Unified Memory.
TEJ3M Teacher: Ms. Luce Name: Alex H. Date: February 18th 2010
© Banff and Buchan College 2007 DH2T 34 Computer Architecture 1 LO2 Lesson One Memory.
Chapter 5 Internal Memory. Semiconductor Memory Types.
Memory /27/081ECE Lecture 13 Memory 2.
Chapter 8 Memory Interface
Computer Architecture CST 250 MEMORY ARCHITECTURE Prepared by:Omar Hirzallah.
1 Very Large Scale Integration II - VLSI II Memory Structures Hayri Uğur UYANIK Devrim Yılmaz AKSIN ITU VLSI Laboratories.
Chapter 3 Internal Memory. Objectives  To describe the types of memory used for the main memory  To discuss about errors and error corrections in the.
Internal Memory.
Digital Design: Principles and Practices
CIM101 : Introduction to computer Lecture 3 Memory.
+ CS 325: CS Hardware and Software Organization and Architecture Memory Organization.
Types of Memory Technologies  Volatile  RAM (Random Access Memory)  DRAM (Dynamic RAM)  SRAM (Static RAM)  SDRAM (Synchronous DRAM)  Non-Volatile.
Copyright © 2007 – Curt Hill Primary Memory and Electronic Storage Implementations.
Memory Cell Operation.
Literature Review on Emerging Memory Technologies
Semiconductor Memory Types
Seminar On RAM & ROM. PRESENTED BY PRESENTED BY 1) YATIN KSHIRSAGAR. 2) GHANSHYAM DUSANE. 3) GANESH RAJOLE.
Index What is an Interface Pins of 8085 used in Interfacing Memory – Microprocessor Interface I/O – Microprocessor Interface Basic RAM Cells Stack Memory.
Chapter 5 Internal Memory
William Stallings Computer Organization and Architecture 7th Edition
Internal Memory.
William Stallings Computer Organization and Architecture 7th Edition
The Triplets – ROM & RAM & Cache
William Stallings Computer Organization and Architecture 8th Edition
Information Storage and Spintronics 13
שמות מאפיינים ומטרות של זיכרונות ROM - ו RAM
Information Storage and Spintronics 10
William Stallings Computer Organization and Architecture 7th Edition
William Stallings Computer Organization and Architecture 8th Edition
BIC 10503: COMPUTER ARCHITECTURE
Kinds of memory in human and machine
Lecture No. 41 Memory.
MICROPROCESSOR MEMORY ORGANIZATION
Chapter 4: MEMORY.
Chapter 4 Internal Memory
William Stallings Computer Organization and Architecture 8th Edition
Semiconductor memories are classified in different ways. A distinction is made between read-only (ROM) and read-write (RWM) memories. The contents RWMs.
Information Storage and Spintronics 11
Presentation transcript:

Semiconductor Memories ECE423 Xiang Yu

RAM vs. ROM  Volatile  RAM (random access) SRAM (static) SRAM (static) SynchronousSynchronous AsynchronousAsynchronous DRAM (dynamic) DRAM (dynamic) FPM DRAMFPM DRAM EDO DRAMEDO DRAM SDRAMSDRAM DDR SDRAMDDR SDRAM DDR2 SDRAMDDR2 SDRAM Etc..Etc..  Non-volatile  ROM (read only) System/Video BIOS  PROM OTP with fuses/anti-fuses  EPROM UV light for erasure  EEPROM Reprogrammable with software and hardware  Flash Memory

SRAM & DRAM  SRAM Pros Pros Extremely FastExtremely Fast No refresh cycleNo refresh cycle Cons Cons Large area - 6T/bitLarge area - 6T/bit ExpensiveExpensive Applications Applications Memory caches L1 & L2Memory caches L1 & L2  DRAM Pros Cheaper Higher density - 1T/bit Cons Slower in speed Needs refresh cycle Applications Computer memory

Flash Memory Pros  Non-volatile  Portability  High Density Floating gate transistor Floating gate transistor CG and FGCG and FG MLC technologyMLC technology  High Isolation Cons  Oxide layers near min. limit  High voltage required  Slow WRITE cycle  Capacitance Coupling  Limited Use

Focus For Improvement  Non-volatility  Portability  Small Area  High Density  Faster WRITE/ERASE cycles  Lower Power  Lower Costs  Longevity

FRAM  FeRAM (Ferroelectric RAM) Uses ferroelectric characteristics of the capacitor Uses ferroelectric characteristics of the capacitor lead (Pb) zirconate (Zr) titanate (Ti) - PZTlead (Pb) zirconate (Zr) titanate (Ti) - PZTPros  Non-volatile  Small size  Fast WRITE cycles Cons  A potential WRITE after each READ  Longevity  Polarization degradation  Requires high temperatures  Want higher densities

MRAM  Magnetoresistive RAM Uses properties of magnetism and the development of the MTJ Uses properties of magnetism and the development of the MTJ Uses STT technology (Spin Torque Transfer) Uses STT technology (Spin Torque Transfer)Pros  Non-volatile  Small size  Fast WRITE cycles  Longevity Cons  Requires high temperatures  Want higher densities

PRAM  Phase-change RAM, PCM, C-RAM (chalcogenide RAM) Uses the special property of chalcogenide alloy Uses the special property of chalcogenide alloy Germanium (Ge), antimony (Sb) and tellurium (Te) – GSTGermanium (Ge), antimony (Sb) and tellurium (Te) – GST Switches between amorphous (0) and crystallized (1) states with heat from currentSwitches between amorphous (0) and crystallized (1) states with heat from currentPros  Non-volatile  Small size  High density  Fast switching times Cons  Requires high current (heat)  Longevity

Comparisons  Overall View ParametersSRAMDRAMFlashFRAMMRAMPRAM Non-volatileNoNoYesYesYesYes RefreshNomsNoNoNoNo Cell Size 6T1T1C1T1T1C1TCMTJ1T1R Read Time 2 ns 10 ns 70ns10ns10ns10ns Write Time 2 ns 10 ns 10μs 20 ns 5 ns Write cycles > > > > 10 12