(AlGaN/GaN) High electron mobility transistors Low dimensional System Master of Nanoscience Olatz Idigoras Lertxundi.

Slides:



Advertisements
Similar presentations
MICROWAVE FET Microwave FET : operates in the microwave frequencies
Advertisements

Microwave Solid State Power Devices Yonglai Tian
Solid state devices Crystal diodes – a crystal and a bronze wire Semiconductors – made from poor conductors with conductive impurities – Poor conductors.
Nanostructures Research Group Center for Solid State Electronics Research Quantum corrected full-band Cellular Monte Carlo simulation of AlGaN/GaN HEMTs.
Ch.1 Introduction Optoelectronic devices: - devices deal with interaction of electronic and optical processes Solid-state physics: - study of solids, through.
High Electron Mobility Transistors
Course code: EE4209 Md. Nur Kutubul Alam Department of EEE KUET High Electron Mobility Transistor (HEMT)
GaN HEMT Power Switch 의 특성 향상 방안 최영환.
GaN based Heterojunction Bipolar Transistors
Metal Semiconductor Field Effect Transistors
The metal-oxide field-effect transistor (MOSFET)
Electron Scattering Length - Mean Free Path – le - Avg. distance between scattering Si - ~ 5nm; GaAs - ~ 100 nm Electrical Resistance is closely related.
Nitride semiconductors and their applications Part II: Nitride semiconductors.
MSE-630 Gallium Arsenide Semiconductors. MSE-630 Overview Compound Semiconductor Materials Interest in GaAs Physical Properties Processing Methods Applications.
Slide # 1 MESA Isolation Source-Drain Contact DEPOSITION Schottky Contact DEPOSITION Bonding Pad DEPOSITION Top Cantilever OUTLINE ETCH BACK POCKET ETCH.
Optical properties and carrier dynamics of self-assembled GaN/AlGaN quantum dots Ashida lab. Nawaki Yohei Nanotechnology 17 (2006)
Field-Effect Transistor
Gallium Nitride
Technologies for integrating high- mobility compound semiconductors on silicon for advanced CMOS VLSI Han Yu ELEC5070.
High Electron Mobility Transistors (HEMT)
ECE 662 Microwave Devices Microwave Materials, Diodes and Transistors February 3, 2005.
Carrier Mobility and Velocity
ECE 250 – Electronic Devices 1 ECE 250 Electronic Device Modeling.
ELECT /01/03 SiC basic properties The basic properties of SiC makes it a material of choice for fabricating devices operating at high power and high.
Properties of HfO 2 Deposited on AlGaN/GaN Structures Using e-beam Technique V. Tokranov a, S. Oktyabrsky a, S.L. Rumyantsev b, M.S. Shur b, N. Pala b,c,
Introduction Trapped Plasma Avalanche Triggered Transit mode Prager
Modeling, Characterization and Design of Wide Bandgap MOSFETs for High Temperature and Power Applications UMCP: Neil Goldsman Gary Pennington(Ph.D) Stephen.
JFETs, MESFETs, and MODFETs
Real-Time Advanced Process Control for GaN MOCVD Rubloff Research Group Accomplishments.
Compact Power Supplies Based on Heterojunction Switching in Wide Band Gap Semiconductors NC STATE UNIVERSITY UCSB Status of HVPE GaN Growth and The Piezoelectric.
Field Effect Transistors
High Electron Mobility Transistor (HEMT)
Advisor: Prof. Yen-Kuang Kuo
Impurity Segregation Where Co is the initial concentration of th impurity in the melt.
Wideband Gap Semiconductors and New Trends in Power Electronics
UNIT- IV SOLID STATE PHYSICS. 1)Electrical conductivity in between conductors & insulators is a) high conductors b) low conductors c) Semiconductors d)
Lecture 1 OUTLINE Semiconductors, Junction, Diode characteristics, Bipolar Transistors: characteristics, small signal low frequency h-parameter model,
Advanced Power Electronics -- EPRI Preview P. M. Grant 13 March 1999 Strategic Initiative Program Beyond Silicon… Advanced Power Electronics for FACTS.
4H-SIC DMOSFET AND SILICON CARBIDE ACCUMULATION-MODE LATERALLY DIFFUSED MOSFET Archana N- 09MQ /10/2010 PSG COLLEGE OF TECHNOLOGY ME – Power Electronics.
High Electron Mobility Transistor
BASICS OF SEMICONDUCTOR
1 Materials Beyond Silicon Materials Beyond Silicon By Uma Aghoram.
C. Kadow, J.-U. Bae, M. Dahlstrom, M. Rodwell, A. C. Gossard *University of California, Santa Barbara G. Nagy, J. Bergman, B. Brar, G. Sullivan Rockwell.
Introduction to semiconductor technology. Outline –6 Junctions Metal-semiconductor junctions –6 Field effect transistors JFET and MOS transistors Ideal.
S.S.GaO. Outline Introduction Experiment Results and discussion Conclusion References.
Gallium Nitride Research & Development Rakesh Sohal
GaN based blue LED Joonas Leppänen Emma Kiljo Jussi Taskinen
Review of Semiconductor Devices
Transistors Student Lecture by: Giangiacomo Groppi Joel Cassell
Date of download: 9/26/2017 Copyright © ASME. All rights reserved.
ACADEMIC AND SCIENTIFIC WORK ROBERTO PINEDA GÓMEZ
Contents GaAs HEMTs overview RF (Radio Frequency) characteristics
Nitride semiconductors and their applications
Barrier Current Flow in Nitride Heterostructures
High Temperature Devices Based Upon Silicon Carbide
UNDERGRADUATE COURSES USING THE SMU CLEAN ROOM
Other Transistor Topologies
ECE 695 Discussion Session GaN HEMT Technology – Recent Advances
GaN HEMT with SiN/SiO2/SiN gate dielectric
Metal Semiconductor Field Effect Transistors
A p-n junction is not a device
Modelling & Simulation of Semiconductor Devices
“Transistors”.
Diamond Substrates for High Power Density Electronics
Basic Semiconductor Physics
POWER SEMICONDUCTOR DEVICES OVERVIEW
Epitaxial Deposition
Other Transistor Topologies
Solid State Electronics ECE-1109
Other Transistor Topologies
Presentation transcript:

(AlGaN/GaN) High electron mobility transistors Low dimensional System Master of Nanoscience Olatz Idigoras Lertxundi

Outline Introduction Introduction Gallium Nitrate Gallium Nitrate AlGaN/GaN HEMT operation principles AlGaN/GaN HEMT operation principles 2 dimensional electron gas 2 dimensional electron gas Origin of 2 dimensional electron gas Origin of 2 dimensional electron gas Charge control Charge control Summary Summary References References

Introduction Transistor are used in many electronic devices, e.g. switch, amplifiers, oscillators. Transistor are used in many electronic devices, e.g. switch, amplifiers, oscillators. To satisfy growing demands of: To satisfy growing demands of: High power. High power. High speed. High speed. High efficiency communications. High efficiency communications. Heterostructure field effect device. Heterostructure field effect device. Conventional HEMTs use a AlGaAs/GaAs  AlGaN/GaN. Conventional HEMTs use a AlGaAs/GaAs  AlGaN/GaN.

Introduction Heterojuction  2 DEG 3 contacts: Source and drain  ohmic contacts. Gate  Schottky barrier. Current flows from the source to the drain.

Introduction Output characteristic: Transconductance:

Introduction 1960 GaN small crystals was made GaN small crystals was made Takashi Minura, Fujitsu laboratories designed the features of the first HEMT Takashi Minura, Fujitsu laboratories designed the features of the first HEMT HEMT was announced the lowest noise device HEMT was announced the lowest noise device Kahn demonstrated the first AlGaN/GaN HEMT Kahn demonstrated the first AlGaN/GaN HEMT.

Outline Introduction Introduction Gallium Nitrate Gallium Nitrate AlGaN/GaN HEMT operation principles AlGaN/GaN HEMT operation principles 2 dimensional electron gas 2 dimensional electron gas Origin of 2 dimensional electron gas Origin of 2 dimensional electron gas Charge control Charge control Summary Summary References References

Gallium Nitrate High electron density (Polarization effects). High electron density (Polarization effects). Adequate for high power amplifiers  Adequate for high power amplifiers  High breakdown voltage. Large heat capacity. Large heat capacity. Necessary to growth in a wafer of another material. Necessary to growth in a wafer of another material. Molecular Beam Epitaxy. Molecular Beam Epitaxy. Metal Organic Vapor Beam Epitaxy. Metal Organic Vapor Beam Epitaxy.

Gallium Nitrate Substrate material. Substrate material. Sapphire Sapphire o Most used material, cheap, good quality commercial wafers. o Large lattice mismatch  high amount of dislocation. o Poor thermal conductivity. Silicon Carbide. Silicon Carbide. o Low lattice mismatch. o High thermal capacity. o Expensive material. Silicon Silicon o Most common semiconductor. o Acceptable thermal conductivity. o Available in large quantities.

Outline Introduction Introduction Gallium Nitrate Gallium Nitrate AlGaN/GaN HEMT operation principles AlGaN/GaN HEMT operation principles 2 dimensional electron gas 2 dimensional electron gas Origin of 2 dimensional electron gas Origin of 2 dimensional electron gas Charge control Charge control Summary Summary References References

Discontinuity through the conduction band of the two semiconductors determines a charge transfer, creating a triangular potential. Electrons are confined in the triangular potential in discrete quantum state. Mobility of the electrons in 2DEG is higher than in a bulk. Operation principles (2 DEG)

Triangular quantum well Triangular quantum well Infinitely high barrier for z 0. Infinitely high barrier for z 0. Applying boundary condition. Applying boundary condition. Airy function Airy function cn  0 of Airy function

Operation principles (Polarization) AlGaN/GaN HEMTs transistor don’t need doping to obtain a high electron density. AlGaN/GaN HEMTs transistor don’t need doping to obtain a high electron density. Spontaneous polarization. + Piezoelectronic polarization. = (cm 2 /Vs) carrier concentration (cm 2 /Vs) carrier concentration Spontaneous polarization. Wurtzite structure. Polarization at zero strain. Due to the lack of symmetry. It appears in both layers. Piezoelectronic polarization. Difference of the lattice constant of GaN and AlGaN. Pseudomorfic growth of AlGaN.

Operation principles (Polarization)

Operation principes (Charge control) Charge density, controlled by a gate voltage. Charge density, controlled by a gate voltage. Schootky barrier. Schootky barrier.

Operation principles (Charge control)

Outline Introduction Introduction Gallium Nitrate Gallium Nitrate AlGaN/GaN HEMT operation principles AlGaN/GaN HEMT operation principles 2 dimensional electron gas 2 dimensional electron gas Origin of 2 dimensional electron gas Origin of 2 dimensional electron gas Charge control Charge control Summary Summary References References

Summary HEMT transistor are widely used in electronic application. HEMT transistor are widely used in electronic application. AlGaN/GaN structure looks promising. AlGaN/GaN structure looks promising. Still in research. Still in research. Electron transistor. Electron transistor.

Outline Introduction Introduction Gallium Nitrate Gallium Nitrate AlGaN/GaN HEMT operation principles AlGaN/GaN HEMT operation principles 2 dimensional electron gas 2 dimensional electron gas Origin of 2 dimensional electron gas Origin of 2 dimensional electron gas Charge control Charge control Summary Summary References References

References “Crecimiento y fabricación de transistores HEMT de AlGaN/GaN por epitaxia de haces moleculares.” Tesis Doctoral, Ana Jiménez Martín. “Crecimiento y fabricación de transistores HEMT de AlGaN/GaN por epitaxia de haces moleculares.” Tesis Doctoral, Ana Jiménez Martín. “The physics of low dimensional semiconductors.” John H. Davies. “The physics of low dimensional semiconductors.” John H. Davies. “Characterization of advanced AlGaN HEMT structures” Anders Lundskog. “Characterization of advanced AlGaN HEMT structures” Anders Lundskog. “The physics and chemistry of Solids” Stephen Elliot. “The physics and chemistry of Solids” Stephen Elliot. “GaN based power high electron mobility transistor” Shreepad Karmalkar. “GaN based power high electron mobility transistor” Shreepad Karmalkar. “Power-Supported Bridges for Multi Finger AlGaN/GaN Heterojunciton Field Effect Transistor (HFET)” Michael H.Willemann “Power-Supported Bridges for Multi Finger AlGaN/GaN Heterojunciton Field Effect Transistor (HFET)” Michael H.Willemann

THANK YOU !!