Basic Principles of X-Ray Inspection for BGA’s
Increased Use of BGA’s Ball Grid Arrays - array of solder ball connections underneath component Provides many advantages over leaded components –Reduced component size –Increased I/O count –Smaller footprint –Increased performance characteristics
The Problem with BGA’s How to verify a solder bond that cannot be observed? Hidden joints - touch up not possible Only way to test integrity of joints –Electrical test –Look Under/Video Scope –X-Ray
How X-Rays Work image Presence or Absence of Material wedge object x-rays detector image detectorlow density high density material x-rays Differences in Material Density
X-ray tube generates x-ray energy X-rays absorbed where density exists in sample - remaining x-rays pass through & strike the detector Detector converts x-rays to visible light, video camera sends image to processor Image Processor enhances x-ray images for high- resolution viewing The image you see How an X-Ray System Works
Solder Connections Under X-Ray Analysis Main characteristic: uniformity of the connections If X-ray shows all connections uniformly circular & equal in area - good indication of complete/proper reflow
Nearly all Defects have “Signatures” Bridging, missing balls, large voids obvious Other defects subtle Look for pattern in distortion of size/shape of bond image Operator learns to identify defect signatures, process problems and quickly make adjustments
May be due to excess paste or flux Improper rework implicated Solder splattering due to poor reflow conditions Defects Identified by X-Ray: Bridging Look Under Scope Image
Misregistration Result of errors in component placement Possible issues with solder mask alignment
Insufficient Reflow More difficult to spot If package misplaced, ball shape may be elliptical (easier to identify) Bond distribution not consistent
Can occur in manufacturing process Usually due to mishandling Missing Balls
Cold Solder More difficult to identify Signified by jagged irregular edge around the perimeter of the solder ball
Solder Voids Result of moisture in BGA package – must be thoroughly baked out Problems with solder paste Huge issue with lead- free solder
Voids a process indicator, not defect unless excessively large Motorola Study - balls that contain voids up to 24% more reliable than those without voids! Solder Voids
At 70 kV Associated with camera used in many X-ray systems As voltage increased, void artificially appears to expand (bloom) At 50 kV Makes void appear larger than it really is Glenbrook systems not subject to voltage blooming Solder Voids & Voltage Blooming
Potato Chipping/Popcorning BGA’s outside edge lifts up from a pad Center joints squashed due to compression under die area Caused by moisture in BGA or excessive topside temperature Normal Potato Chipping
Note distortion/ warpage of ball bonds lower right corner View through Look-Under scope. Note package peeling away from solder ball Potato Chipping/Popcorning
Opens (require angled viewing) Ball smaller than adjacent balls Pad shadow seen below indicating no contact between ball & pad Note two unattached spherical shapes unlike oval shapes adjacent to it –indicate no contact between pad & solder ball
RTX-113HV X-Ray Inspection System Features powerful 80 kV X-ray tube GTI-5000 image processor with auto-BGA analysis software Sees through dense multilayer PCBs & metal capped BGAs Variable Angle Viewing allows for 45 degree viewing
GTI-5000 Image Processing Software Provides analysis of BGA defects: bridging, voids, missing balls Measures BGA ball size, ball roundness & void size Software identifies any ball outside of set tolerance Includes CPU, Frame Grabber, Software, Color Monitor
Variable Angled Viewing Allows for 45 degree viewing X-Ray source is rotated Allows inspection for full range of hidden BGA defects: –Missing or mis-registered solder spheres –Misalignments –Gross solder voids –Non-wetting or non-contact
Operating voltage: 120V, 50/60 Hz Energy sensitivity: 160 kV X-Ray Tube – 80 kVA Resolution: >20 line pairs per millimeter; can easily resolve a 1 mil bond wire Magnification: x Maximum field of view: 1” diameter circle Maximum PCB size: 27” x 27” (685mm x 685mm) with PCB manipulator Specifications: RTX-113HV
Other Real-Time X-Ray Inspection Systems from Glenbrook Technologies JewelBox Series 80 or 90kV 5-7, or 10 micron Focal Spot size 7x-2000x magnification 5 Axis, 360 o Positioner RTX-113 35-52kV 20 line pairs/mm resolution (up to 100 optional) Variable Angle Viewing option available RTX-Mini 40kV 20 line pairs/mm resolution Truly Portable – can be hand carried or shipped!
11 Emery Ave Randolph, NJ Tele: (973) Fax: (973) Manufacturer’s Rep Aaron Caplan 1310 E. Maple Ave Sterling, VA (703)
11 Emery Ave Randolph, NJ Tele: (973) Fax: (973) Manufacturer’s Rep Aaron Caplan 1310 E. Maple Ave Sterling, VA (703)