Sincerity Cooperation Innovation Environmental

Sincerity Cooperation Innovation Environmental Contents HINNOTECH Introduction HINNOTECH Culture HINNOTECH Material Introduction Laminate Property Benchmark PCB Process Properties Summary

Sincerity Cooperation Innovation Environmental HINNOTECH Introduction JIANGMEN HINNO-TECH CO., LTD. is a professional manufacturer of CCL materials and optical materials, and a joint venture established by JIANGMEN YINGJIANG TRADING CO., LTD. and Hong Kong Well Bright International Development Co., Ltd. It owns independent production, marketing and development research. HINNOTECH Basic Information Established DateAugust 2009 Mass Production DateApril 2010 Employee50 Capacity Prepreg: 600Km/month at present 1800Km/month in the end of 2010 Laminate: 300K SH/month in Q2 of K SH/month in Q2 of 2012 ProductLead-free: H-840, H-850, H-880 Lead-free and Halogen-free: H-850G

Sincerity Cooperation Innovation Environmental HINNOTECH Organization Chart

Sincerity Cooperation Innovation Environmental HINNOTECH Culture Corporate culture: Integrity Management, Pioneer Innovation, ECEP (Energy Conservation Environmental Protection), People-oriented. Corporate values: Sincerity, Cooperation, Innovation, Environmental. Quality policy: Create excellent quality, Exceed customer expectations. Environmental Policy: Legislation compliance, Environmental protect implemention, Pollution prevention, Energy efficiency, Waste induction, Continuous improvement. Vision: Technology innovation creates good lives.

Sincerity Cooperation Innovation Environmental HINNOTECH Materials Introduction Product Properties PCB Application End-user Application

Sincerity Cooperation Innovation Environmental Product Properties ItemsConditionsUnitsH-840H-850H-880H-850G Material Classific- ation IPC-4101C ANSI--FR4(Normal)FR4(Mid)FR4(High)FR4(Mid) Cure system--PN Halogen Free--No Yes Lead Free - -Yes General Charact- eristics TgDSC TgTMA T260TMAmin >120 T288TMAmin121820>60 Td5% wt loss Z-CTEbefore Tg ppm/ 40 Z-CTEafter Tg ppm/ Z-CTE 50~260 % Peel StrengthHTE 1ozlb/in9.0 Moisture AbsorptionD-24/23% Solder Heat Resistance (288 Floating, 10sec/cycle) -->6cycle Dk1GHz-4.8 Df1GHz CAF 85 /85% RH,50V hrs>2000

Sincerity Cooperation Innovation Environmental PCB Application ItemsConditionsUnitsH-840H-850H-880H-850G PCB Process Layer count > Total thickness Cu thickness (max)InnerOZ4666 Line/Space (Min) Innermil2/2 Outermil3/3 Through hole diameter (min)-mm0.25 Through hole pitch (min)-mm0.60 Aspect Ratio (max)--10:114:118:114:1 Lamination-- 40min/180 60min/180 Drilling--Lead Free FR4 Desmear--Lead Free FR4 HINNOTECH Products have high performance /cost ratio.

Sincerity Cooperation Innovation Environmental End-user Application ItemsH-840H-850H-880H-850G Application Type AV Equipment Digital Camera Game Machine Personal Computer Liquid Crystal Display Server Mobile Phone Exchanger Semiconductor- Memory Module Semiconductor Testing Device- Auto Engine Control Remark: excellent application, good application.

Sincerity Cooperation Innovation Environmental Laminate Property Benchmark Lead-free Normal Tg Benchmark Lead-free Mid Tg Benchmark Lead-free High Tg Benchmark Lead-free & Halogen-free Benchmark

Sincerity Cooperation Innovation Environmental Lead-free Normal Tg Benchmark ItemUnit H-840NP-140MS1141KFIT-588 Tg (DSC) T260(TMA)min>60 35>60 T288(TMA)min12 7>1515 Decomposition Temperature(5% wt loss) > Z-CTE (before Tg) ppm/ Z-CTE (after Tg) ppm/ Z-CTE(50~260 ) % Peel Strength (HTE 1oz)lb/in Moisture Absorption (D-24/23)% Solder Heat Resistance (288 Floating, 10sec/cycle) ->6cycle Dk(1GHz) Df(1GHz) Remark: based on 1.6mm. H-840 has higher Tg, lower CTE and lower moisture absorption, which shows it has better thermal resistance than other similar materials.

Sincerity Cooperation Innovation Environmental Lead-free Mid Tg Benchmark ItemUnitH-850 IS400TU-662EM-825S1000 IT-158 Tg (DSC) T260(TMA)min>6060>60 60 >60 T288(TMA)min Decomposition Temperature(5% wt loss) Z-CTE (before Tg) ppm/ Z-CTE (after Tg) ppm/ Z-CTE(50~260 ) % Peel Strength (HTE 1oz)lb/in Moisture Absorption (D-24/23)% Solder Heat Resistance (288 Floating, 10sec/cycle) - >6cycle Dk(1GHz) Df(1GHz) Remark: based on 1.6mm. H-850 has excellent thermal resistance, low CTE, high peel strength and low moisture absorption. Its properties are similar to the others.

Sincerity Cooperation Innovation Environmental Lead-free High Tg Benchmark ItemUnitH HRTU-752EM-827S1000-2IT-180A Tg (DSC) >170 T260(TMA)min>6060>60 60>60 T288(TMA)min2010> Decomposition Temperature(5% wt loss) Z-CTE (before Tg) ppm/ Z-CTE (after Tg) ppm/ Z-CTE(50~260 ) % Peel Strength (HTE 1oz)lb/in Moisture Absorption (D-24/23)% Solder Heat Resistance (288 Floating, 10sec/cycle) - >6cycle Dk(1GHz) Df(1GHz) Remark: based on 1.6mm. H-880 also has high reliability as same as other high Tg materials.

Sincerity Cooperation Innovation Environmental Lead-free & Halogen-free Benchmark ItemUnitH-850GR-1566 MCL-E-67G DE-156NPGEM-285S1155IT-150G Tg (DSC) Tg (TMA) T260(TMA)min>120>60 T288(TMA)min>60 Decomposition Temperature(5% wt loss) Z-CTE (before Tg) ppm/ Z-CTE (after Tg) ppm/ Z-CTE(50~260 ) % Peel Strength (HTE 1oz)lb/in >6.0 Moisture Absorption (D-24/23) % <0.5 Solder Heat Resistance (288 Floating, 10sec/cycle) - >6cycle Dk(1GHz) Df(1GHz) Remark: based on 1.6mm. H-850G also has good thermal resistance, low CTE, high peel strength and low Df properties.

Sincerity Cooperation Innovation Environmental PCB Process Properties Inner Layer Laminate Drilling Desmear Punch or Routing

Sincerity Cooperation Innovation Environmental Inner layer The first board test must be taken to find suitable parameter (dimension compensation) before mass production. For Oxide treatment, we prefer to multibond and recommend to use lead free medicament. Recommend to post-oxide baking for at least 40min at 120 to remove moisture.

Sincerity Cooperation Innovation Environmental Lamination

Sincerity Cooperation Innovation Environmental Drilling H-880H-850GH-850H-840FR4 370HREM827 Remark: 2000hit, 1.6mm 2PNL/stack for Φ0.4mm hole. HINNOTECH products have low drilling loss that is close to traditional FR4

Sincerity Cooperation Innovation Environmental Desmear Desmear cycles Desmear Loss Desmear Items H H H-850GH-840FR4 H-840 and H-850G have good desmear properties as same as traditional FR4. But H-850 and H-880 are a little difficult to be desmeared comparing to traditional FR-4.

Sincerity Cooperation Innovation Environmental Punch or Routing MaterialType H-840Punch or Routing H-850Routing H-880Routing H-850GPunch or Routing Punch ability comparison (FR4 H-840 H-850G) H-840 and H- 850G are same as traditional FR4 for punch. Guideline for punch or routing Based on 1.6mm thickness.

Sincerity Cooperation Innovation Environmental Summary HINNOTECH lead-free or/and halogen-free materials have excellent performances such as high thermal resistance, high peel strength, low CTE, and so on. The PCB process properties are quite excellent for HINNOTECH materials. Especially, their drilling loss are lower than similar materials in present market, which can help PCB to achieve cost down. HINNOTECH products have high performance/cost ratio. Based on the above information, it is absolutely optimal choice to use HINNOTECH lead-free or/and halogen- free materials for lead-free assembly application.

Sincerity Cooperation Innovation Environmental UL Certification UL File No. E335867

Sincerity Cooperation Innovation Environmental Prepreg Manufacturing Process

Sincerity Cooperation Innovation Environmental Laminate Manufacturing Process

Sincerity Cooperation Innovation Environmental Thank you !