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Electro-Chemicals Products For Semiconductor Assembly Industry P4018-ST Molten solder purified-able chemical powder compound (AOP – 22S, a short name of.

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Presentation on theme: "Electro-Chemicals Products For Semiconductor Assembly Industry P4018-ST Molten solder purified-able chemical powder compound (AOP – 22S, a short name of."— Presentation transcript:

1 Electro-Chemicals Products For Semiconductor Assembly Industry P4018-ST Molten solder purified-able chemical powder compound (AOP – 22S, a short name of AOP-22 Super ! ) AOP-22S Molten solder purified-able chemical powder compound is used for oxidation prevent and heat loss on molten solder & Tin surfaces of wave soldering & solder-dipping pot, It is designed for effectively isolating air contact to molten solder surfaces, and to prevent oxide formation in the solder & Tin pot, further more to separating oxides & impurities away from molten solder, and wrapping these oxides & impurities without let it go, in order to enhances of solder-ability to perfect condition, reducing soldering temperature, increasing first dip yield, reducing touch-up repair yield and life time reliability of dipped products. Features & Benefits 1. AOP-22S would turn into liquid form 2 ~ 5 minutes after it touch molten solder surfaces. 2. Lasting over 12 hours in liquid form, under full production of a solder pot. 3. Saving over 32 ~ 50 kg Solder/Tin in a full day production of a solder-pot. 4. Saving electricity power consume over 60 Kwh in a full day production. 5. No more existing of Solder/Tin dross, once AOP-22S applied and covered on molten solder surfaces, and all impurities & oxides will be effectively absorbed by it, which would makes molten solder become ultra-clean, consequently enable users may steadily & continuously apply ultra-pure Solder/Tin on each joint of PCB or components. OPERATING PARAMETERS Parameters Sn 63/ Pb 37Sn / Ag / Cu Sludge/Form replenish cycle (Hour) 8 ~ 12 Solder-pot Temperature Solder-pot Temperature ( ) < 240< 260 Dosage ( Kilogram ) 1 ~ 2 / pot

2 Electro-Chemicals Products For Semiconductor Assembly Industry APPLY METHODE 1. Cut a hole on Aluminum foil P.E bag and gently spray the powder on molten Solder / Tin surface of a pot, where outside the AOP Fixture square frame. 2. It takes 2 ~ 5 minutes for all powder turning to liquid form. 3. Make sure each dosage enough to cover all molten solder surface out of square frame of Fixture, it usually require 1 ~ 2 kg / pot. 4. An opened bag is recommend to fully put onto molten solder surface, out of square frame, it would be moisturize if stay in atmosphere over 1 minute. MAINTENANCE 1. The effectiveness would reduce once AOP-22S turns to light brown colour with much higher viscosity, which indicates over saturated absorption. 2. Take a scoop with round hole and scrub most of gel sludge residues out from molten solder surface, and dump it into paper carton, thermal makes AOP- 22S melt and turn to liquid form, for most metals it would be quit sticky such as Stainless-steel, take a handle rod with blade-head to scrub and cutting thick & hard layer follow by wet mob to clean thinner layer, before new powder add-in. 3. Put new powder to keep effectiveness of ultra clean molten solder benefits. GENERAL PRECAUTIONS 1. Operation temperature should not exceed 320. 2. It is a very steady physical features chemical compound, and required free of maintenance. 3. Dumping cycle – dispose the gel sludge residues after it floating on molten solder surface, yet ! In mass production line once per 8 ~ 12 Hrs will be fine. DISPOSAL Immerse AOP sludge SUS container under water and use these mild acidic water in waste water treatment system, or submit to wastes contractor are either way to handle AOP sludge wastes. AOP-22S working life time depends on quantity of dipped products and surface size it covered. When special features of lower soldering temperature implemented, put more AOP powder on molten solder surface, would be helpful and essential !!.

3 Electro-Chemicals Products For Semiconductor Assembly Industry AOP-22S commercial package Date 20 th September 2009 Revision 1 Legal announcement 1. Features & specification indicated might not be accurate, It is proposed for reference only, which may be subject to change or modify without prior notification. 2. Features,specification and related technical literatures in this Technical Bulletin is the property of Leading-Trends Applied Technology Corp. Copy, Duplicate, Modify or apply it in any form without prior authorize, may violate the intelligent property of ours. 1. 2. ORDERING INFORMATION Product Code NameFormApplication Packing Size P4018-ST Chemical powder compound (AOP-22S) Powder Molten solder purification And oxides prevent 1 Kg P.5


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