1. CAF Resistant, Low CTE FR-4 Dielectric Substrate

2. N Application
Customers aware of limitations of standard 140°C FR4 and would like a material with higher thermal resistance, CAF resistance, and better dimensional stability.
Customers who are currently using high Tg product but are not tied down by the 165°C Tg minimum requirement.
Customers who want to maintain high PTH reliability at a lower overall manufacturing cost.
Customers haunted by excessive resin recession, z-axis expansion, hole roughness, wicking or drilling problems.

3. N Product Attributes

4. N4000-7 CAF Resistance CAF Resistance Test Methodology
Test Site - PAPDC Laboratories, Fullerton, CA
Test Duration Hours
# of Coupons Tested = 3
Test Method - Tellabs GR-78-CORE PAR
Test Vehicle - Sun Microsystems Test Vehicle #1, CAF TV1 6/15/00.
Test Voltage - 10 volts and 50 volts
Stabilization Period - 96 Hours
Results Show all Coupons Pass with < One Decade of Resistance Drop (both voltages)

5. Low Tg FR-4 (competitor mtl.)
N CAF Test
Test Condition: 85°C / 85% RH / 50 volts for 10 days
Hole diameter: 13 mil (0.33mm)
Hole-to-hole spacing: 25 mil (0.64mm)
Glass-to-glass thickness: 56 mil (1.4 mm) 8 layer MLB
Results: Product did not meet min.OEM requirement Performance superior to Std. FR-4
Low Tg FR-4 (competitor mtl.)
N FR-4

6. Other Mtl. (140°C Tg FR4)
N (155°C Tg FR4)

7. FR4 Property Comparison High Tg vs. N4000-7
High Tg N4000-7
Tg DSC [oC]
TMA [oC]
Z-axis CTE [ppm/ oC]
(Before Tg) (-29%)
(After Tg) (-14%)
T-260 [minutes] (+2.0x)
Water Absorption [%] (-1.9x)
Time to delam. [minutes] (+ 2.3x)
by solder 288oC
0.062” bare laminate properties
Compared to High Tg
(Pressure 15 psi for 1 hour)

8. Z-Axis CTE Comparison High Tg vs. N4000-7
0.062” core (8 x % RC)
0.07
[ppm /oC] Before Tg After Tg
High Tg N
Low Tg
0.06
High Tg
N4000-7
0.05
0.04
Dimension change (um/m)
Expansion rate (slope) of Std. Tg (140oC) is similar to High Tg (175oC)
0.03
0.02
Expansion rate (slope) of N (155oC) is less than High Tg (175oC)
0.01 30 40 50 60 70 80 90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
270
280
290
300
Temperature [ °C ]

9. Z-Axis CTE Comparison High Tg vs. N4000-7
Calculate total Z -CTE in 260C
= CTE before Tg + CTE after Tg
= (Tg – 30C) (260C - Tg)2
Tg [oC] 1  oC oC oC
High Tg N
where ’s in [ppm/C]
Before Tg
After Tg
TMA
Total z-axis CTE in % at
Material
0.062” core

10. Decomposition Temperature Comparison (TGA)
Std. Tg 300 °C
High Tg 325 °C
N °C
N °C

11. Physical Appearance
High Tg
N4000-7
50 x magnification

12. Physical Appearance N4000-7
500 X
1000 X
3000 X
PTH before desmear
Optimum desmear
Over desmear (smooth)

13. N4000-7 Q1000 Thermal Cycling Test requirements:
1) Thermal cycling for °C to +125°C
2) Less than 10% change in resistance of original value
3) No 100% crack over copper barrel after cross-section
13 mil hole after 1000 hour cycling
0 % failure

14. N4000-7 European Automotive Application (K8)
Test Requirements:
Pre-bake sample in oven at 120°C for 8 hours
Place sample in humidity chamber for 72 hours at 40°C and 92% RH
Thermal shock sample within 1 hour after removal from chamber (solder float 1 x °C)
Objective:
0 - 15% resin recession

15. European Automotive High Tg after test N4000-7 after test (+30% r.r)
Passed resin recession requirement

16. N4000-7 on 28 Layer Network Backpanel (280 mils, 7.11 mm thick)
Actual PCB Properties High Tg N4000-7
Z-CTE [ppm/oC]
( oC) (-12%)
( oC) (-13%)
T-260 [minutes] (+ 3.1x)
Pass 2x solder 288°C
Pass 6x solder 288°C

17. Lower CTE for N4000-7 62 mils bare laminate 280 mils 28-layer MLB
  oC oC oC
High Tg N
1  oC oC oC
High Tg N
Z-axis CTE in % at
280 mils 28-layer MLB
Z-axis CTE in % at
High Tg N4000-7

18. Major OEM Applications
Network Backpanel
Mobile Phone
Automotive
Rambus™

19. N4000-7 Field Applications Layer Application Thickness Panel Size
4 - 6 Automotive 62 mils 18 x 24”
6-8 Rambus 48 mils 18 x 24”
6+1+1 Mobile phone 48 mils 18 x 21”
16 Backpanel mils 21 x 24”
20 Backpanel 220 mils 22 x 24”
28 Backpanel 280 mils 21 x 27”
42 Backpanel 360 mils 22 x 25”

20. N4000-7 Processing Characteristics
Process very similar to standard 140°C Tg FR4 material. [similar scaled factor, lamination cycle, drilling, and desmear].
Requires only standard low Tg lamination cycle. 45 minutes at 340°F (175°C) vs minutes at 360°F (182°C) for typical high Tg products.
Similar and/or even better chemical, thermal and mechanical characteristics than +170°C high Tg material.
Improved drill hole (roughness) quality and capacity.
No UL qualification needed if already qualified with any N4105- ## and N4205- ## material.