TMC Business Focus IC Back-end Manufacturing Outsourcing Services Products Manufacturer and Seller Memory DRAM Memory Chips & Modules EEPROM Flash Memory Cards (MMC/RS-MMC, SD/Mini-SD) Other Multi-die LEDs SAW Filters (for Digital TV Tuners)

Company Profile History Quick Facts 1995 Dec. Incorporation Date 1997 Apr. IC Manufacturing Service Line Started Dec. Received ISO-9002 Certification 1998 Jun. DRAM Chip and Module Product Line Started 2002 Oct. EEPROM Product Line Started 2004 Dec. Flash Memory Card Product Line Started IPO (list #8143) 2005 Feb. DDR II Modules (window BGA) Product Line Started Quick Facts Capital Reserves: 36 Million USD (1.2 Billion NT) Floor Plant/Factory: 46,400 ft2 / 207,000 ft2 Assembly Capacity: 115 Wirebonders

Major Stockholders : Five Publicly Traded Companies

Company Location Taipei City CKS Airport Hsinchu Industrial Park Hsinchu Science-Based Industrial Park Taichung City Hsinchu Science-Based Park CKS Airport Taiwan Micropaq Corporation Head office in this park Distance to TMC Taipei 47 miles CKS Airport 20 miles Hsinchu Science-Based Industrial Park 7 miles Taichung 58 miles Kaohsiung 176miles Kaohsiung City

Doing business with TMC TMC's mission is to become an integral part of our customers' operation, to grow together in not only in delivering quality outsourcing services, but in providing the latest memory products as well. To achieve this, TMC has developed a high performance business strategy that involves a two-pronged approach: I. Solid Outsourcing Services Platform - Provide high quality, high yield, timely, and independent assembly, packaging, and testing services (including SMT) for both single-die and multi-die devices II. Constant Product Innovation - Invest on innovation and improvement of new memory packaging technology to take advantage of trends in personal computing, consumer electronics, and communications

TMC Management Chart Board of Directors Chairman Dr. Jin S. Wang President Mr. C.K. Yang Chip Sales Director Fu Module Sales Director Hsieh Outsourcing Services VP Chiang Taipei Sales Office Director Wang

TMC Manufacturing Chart Factory I Director Fu Wire-bonding Die-bonding Molding & T/F Testing 4〞Wafer Fab. Quality Control Quality Assurance Reliability Testing Product Control Material Control R&D： L/F & Substrate CAD Design Window BGA LEDs SAW Design Factory II Director Lin Die Probing Chip Testing SMT Module Testing Troubleshooting R&D： Programming Compatibility Testing Platform Quality Control Quality Assurance Product Control Material Control