Date of download: 10/22/2017 Copyright © ASME. All rights reserved. From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film J. Electron. Packag. 2009;131(4):041008-041008-5. doi:10.1115/1.4000361 Figure Legend: The thermocompression bonding process for a COG packaged by NCF
Date of download: 10/22/2017 Copyright © ASME. All rights reserved. From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film J. Electron. Packag. 2009;131(4):041008-041008-5. doi:10.1115/1.4000361 Figure Legend: The geometric model for a COG module
Date of download: 10/22/2017 Copyright © ASME. All rights reserved. From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film J. Electron. Packag. 2009;131(4):041008-041008-5. doi:10.1115/1.4000361 Figure Legend: The element meshing for a COG module
Date of download: 10/22/2017 Copyright © ASME. All rights reserved. From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film J. Electron. Packag. 2009;131(4):041008-041008-5. doi:10.1115/1.4000361 Figure Legend: Effects of the thickness of substrate/chip on warpage
Date of download: 10/22/2017 Copyright © ASME. All rights reserved. From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film J. Electron. Packag. 2009;131(4):041008-041008-5. doi:10.1115/1.4000361 Figure Legend: Effects of the bonding force on warpage
Date of download: 10/22/2017 Copyright © ASME. All rights reserved. From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film J. Electron. Packag. 2009;131(4):041008-041008-5. doi:10.1115/1.4000361 Figure Legend: Effects of the multifactor on warpage