1. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Flowchart of wire sweep analysis

2. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Outline of TSOP II 40∕44L and wire locations

3. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Illustration of element extrusion. The left panel shows the original 2D mesh and the extruded 3D mesh is shown in right panel.

4. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Mesh is refined around the projected area containing wires

5. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Outlines of the mesh models for mold-filling analysis

6. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Melt front of mold-filling analysis with and without accounting for wire density effect. Deeper color lines indicate the results from the simulation that accounts for the wire density effect, and the lighter color lines indicate the results from the simulation that does not account for the wire density effect.

7. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Illustration of extraction of mold-filling results

8. Date of download: 1/3/2018
Copyright © ASME. All rights reserved.
From: Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
J. Electron. Packag. 2004;127(3): doi: /
Figure Legend:
Comparison of the wire sweep indices between computational and experimental results