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NeSSI Generation II Systems Rick Ales, Bill Menz and Dave Simko Sensor Bus Hunting Rick Ales, Bill Menz and Dave Simko Swagelok Company IFPACSM2004 Arlington, Virginia January 12-15, 2003

New Sampling/Sensor Initiative What is NeSSI Generation II? - A logical expansion of miniature modular technology - Adds intelligent devices to the system - Defines the need for an open architecture protocol that will allow the smart devices to communicate with each other - Intrinsic safety is an important issue - “Generation” is a misnomer, implying that it replaces what was before

Discussion Points Update on the DeviceNet/ODVA effort Stakeholders meeting with ODVA Workshop at NIST headquarters - Sensor bus issues - Microanalytical devices 4. IEEE 1451.6 Study Group A Profibus/Fieldbus/HART option DeviceNet revisited

The DeviceNet/ODVA Effort Develop an intrinsically safe version of DeviceNet Defined a suitable approach with ODVA - Establish an SIG made up of vendors - Possibly add an advisory group made up of end users Established a rough cost estimate Execute stakeholders meetings - July 29 at Rockwell in Cleveland - July 30 at NIST headquarters in Gaithersburg

Stakeholders Meeting with ODVA Summary - 19 attendees, all day meeting - Briefed on NeSSI, I, II, ODVA, and basics of DeviceNet - Open discussion of intrinsic safety - Technical panel discussion, followed by Q&A on IS and DeviceNet - Prepared a “go forward” plan with ODVA - Complete minutes on CPAC web, NeSSI

Workshop at NIST Summary - 21 attendees, all day meeting - Briefed on NeSSI, I, II, and the need for an IS sensor bus - IEEE 1451 presented – Kang Lee, NIST, MEL - CAN Open and CAN in Automation (CiA) presented - Microanaytics Workshop – microreactors, microsensors, microfluidics - Complete minutes on CPAC web, NeSSI

A Fieldbus/Profibus/HART Option Head-mounted Temperature Transmitters courtesy ABB Profibus PA Foundation Fieldbus HART Small Diameter, typically 1-3/4” – 2-1/4”, close to the 1-1/2” ANSI/ISA 76.00.02 requirement Intrinsically safe Softing AG supplies the chipsets for many manufacturers of these devices Softing feels they can miniaturize the electronics for smart NeSSI components

$ $ $ $ $ $ $ $ $ $ $ $ $ $ Digital Network Foundation Fieldbus RS-485 IEEE 1451 DeviceNet CANOpen Profibus Digital Network Open, multi-vendor infrastructure. Multivariable, configurable, self diagnostics, plug-n-play Temperature Range 125℃ Miniature 5” x1⅟₂” diameter Intrinsically Safe Class 1 Div 1 Protocol Simplicity Process Industry acceptance Cost $ $ $ $ $ $ $ $ $ $ $ $ $ $

Show Stoppers RS-485 No standard multi-vendor device definition or profiles. Requires device specific programming. Profibus & Foundation Fieldbus Controller chips do not meet temperature requirement. Multi-chip solution, not likely to meet size constraints. Cost per node is 3x to 5x as high as a CAN based device.

Challenges DeviceNet & CAN Open Develop IS specification and products by either: Convince vendors there is sufficient market opportunity for them to commit resources, or… Provide funding to finance IS project. Promote industry acceptance of “yet another bus.” IEEE-1451 Nomimal vendor base. Promote acceptance of “yet another bus.”

Status of the Hunt All we need are the project resources! DeviceNet & ODVA ODVA has proposed an intrinsically safe DeviceNet initiative “Go Forward Plan.” CAN Open, CiA and IEEE An industry study group will propose a CAN Open and IEEE 1451 device profile harmonization standard that includes an intrinsically safe CAN option. All we need are the project resources!