SENSITIVE SKIN. OUTLINE INTRODUCTION SKIN MATERIALS DEVICES SIGNAL PROCESSING ADVANTAGES DISADVANTAGES APPLICATION CONCLUSION.

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Presentation transcript:

SENSITIVE SKIN

OUTLINE INTRODUCTION SKIN MATERIALS DEVICES SIGNAL PROCESSING ADVANTAGES DISADVANTAGES APPLICATION CONCLUSION

INTRODUCTION What is sensitive skin? It is a large area flexible array of sensors, with data processing capabilities, with the ability to sense the surroundings. It make possible the use of unsupervised machine in our midst.

INTRODUCTION Machines in unstructured environments Societal needs and concerns a) Health industry b) Eco friendly c) Difficulties of acceptance

SYSTEM COCEPT FIG: Sketch of interconnects between sensors, intelligence and actuators

RESEARCH ISSUES Skin Materials Sensing Devices Signal and Data Processing Applications

SKIN MATERIALS Hold embedded sensors Flexible Stretch, shrink and wrinkle Novel wire materials

Substrate / interconnect issues 1. Stretching and bending make the substrate thin or place interconnects at neutral plane

MODELS Three different models of substrate / interconnect system evolved: 1.Saran wrap model 2.Soccer ball model 3.Panty hose model

Adding Sensors To Substrate 1.Hybrid Approach

2.Integrated Approach In here circuits are directly on the substrate. This method avoids the high cost and reliability issues of hybrid assembly.

3. Distributed Intelligence Approach A network of optical fiber are used to sense the properties

Devices For Sensitive Skin 1.Flexible or deformable 2.Power storage 3.Deployed 2-D array 4.Smaller array 5. Self sensing ability 6.Measure distance to objects 7.Studies in h/w architecture 8.Unique properties

Large - Area Electronics 1.Organic electronics and optoelectronics on flexible substrates. OTFT

2. Thin Film MEMS Thin film micro electromechanical (MEMS) devices on plastic substrate demonstrate that mechanical sensors can be built on flexible substrate. 3. Nanostructures Ultra large area ICs embedded into electrotextiles

Manufacturing Of Large Area Sensitive Skin Printing techniques 1.Direct Printing 2.Laser Writing 3.Nanoimprinting

Direct Printing

Laser Writing

LASER WRITING Laser writing is combined with MAPLE process: 1.Electronic circuit patterns are formed 2.Move the receiving substrate 1 beam dia. 3.Assemble to get desired pattern

Nanoimprinting Principle A thickness is created which is transferred through resist layer via on O2 plasma based etching process. Fig shows a nanoimprint lithography (NIL)

SIGNAL PROCESSING Fault Tolerance Data Reduction Data Processing

ADVANTAGES Reversal of negative impacts of machines Reduction in weight and thickness Can be rolled FIR AND IIR filters conserves the battery power. Friendly to environment

DISADVANTAGES Skin be able to conform to arbitrary shapes. Able to flex, bend and stretch Properties of fusion vary when components fail or repaired.

APPLICATIONS 1.Human skin or Wearable skin 2.Sensitive skin for machines 3.Environmental sensitive skin 4.Actuated sensitive skin

FUTURE SCOPE Develop new inexpensive consumer electronics Displays, printers Store and information Ranging from medicine and biology to machine industry and defense space exploration, mine detection

CONCLUSION Sensitive skin will make it possible to have unsupervised machinery in unstructured, unpredictable surroundings. It will make the machine cautious and eco friendly. It is an enabling technology with far reaching application The state of art in the areas that are basic to the development of skin technology shows that highly efficient devices are feasible. All this non withstanding the fact that the existing prototypes are clumsy, have low resolution, accuracy and reliability, and are not yet ready for commercialization.