Tracker Upgrade Mechanical/Thermal Engineering 3 June meeting theme: Modules and Structures News on Phase 1 BPIX Upgrade Mechanics & Modules, R. Horisberger. S. Koenig / PSI Update on the Phase 1 FPIX Half Disk Design, S. Kwan / FNAL Phase 1 FPIX Mechanics - Plans for module assembly, K. Arndt / Purdue Phase 2 Outer Tracker Module analysis, S. Kyre / UCSB TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

BPIX module design Reduction / optimisation of components from present version TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

BPIX prototypes and test structures Barrel model structure in carbon-fibre Module support with clamps Thermal tests due to start in PSI, Lyon, CERN TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

FPIX PresentPlanned Phase 1 TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela MODULE LAYOUT  12 identical half-disks  only 2x8 modules  One 2x8 module placed on each side of a substrate for all outer and inner radius blades  Substrate uses Thermal Pyrolytic Graphite – material with excellent in-plane thermal conductivity Inner half-disk Outer half-disk Simon Kwan, Fermilab on behalf of the USCMS Pixel Mechanics R&D group

FPIX Outer (inner) half-disk assembly with Edge Cooling Concept TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela Simon Kwan, Fermilab on behalf of the USCMS Pixel Mechanics R&D group 0.7 mm thick carbon fiber ring for support uses only 3.0 mm thick CC ring for cooling and support uses Cf skin to enclose the tubing Ss tubing Machined groove to house tubing One piece ring made of CC

FPIX Half-disk assembly with Edge Cooling Concept TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela Simon Kwan, Fermilab on behalf of the USCMS Pixel Mechanics R&D group Cf supporting spokes Configuration (1) Heat sink on outer edge only HDI being the outermost within module 0.06 cf TPG cf Blade 150% heat load, 7.3W per blade; sensor: 0.6 W; ROC: 6.7 W ∆T = 5.2C across model ∆T = 3.4C Across sensor

FPIX Module development – Various Integrated Module/Panel Concepts under study, here one example Equipment for automated module assembly under development TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela Kirk Arndt, Purdue on behalf of the USCMS Pixel Mechanics R&D group 2x8 BBM TBM TPG HDI 2x8 BBM TPG HDI pigtail

FPIX Module development - Adhesives study TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela Kirk Arndt, Purdue on behalf of the USCMS Pixel Mechanics R&D group Requirements for adhesive: – Thermal conductivity: > 0.2 W/m-K – Soft: shear modulus < 50 N/mm^2 – Conformable to 50 micron non-flatness – Radiation hard – Electrically non-conductive – Curing at room temperature – Not flowing during application: adhesive confined within chip – Good wetting properties – Not creeping after curing – Allow integrated module replacement without damaging the support Status – Begun a market survey of adhesives for pixel integrated module assembly with potential to meet requirements for SLHC (including adhesives used in current LHC detectors – ALICE, ATLAS, CMS, LHCb and TOTEM) – 6 primary candidate adhesives selected for further testing so far – Building mechanical grade samples using candidate adhesives for evaluation of mechanical properties before and after irradiation FPIX adhesive sample for tensile testing after irradiation

Phase 1 FPIX Time-scale and milestones Module and disk conceptual design and studies are ongoing  baseline conceptual mechanical and electrical design this summer. Small prototype development for testing will follow. Goal to build full-scale prototypes for thermal and mechanical tests in early Time scale for Phase 1 TDR (Spring 2010) TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela USCMS Pixel Mechanics R&D group

Phase 2 Outer Modules First thermal analysis based on module design shown in April 09 tracker week TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela This is the start, and too early to refer to the first results. Need to work on module and support geometry, materials, power of components, cooling contacts, etc. Bonding tests (inclined and long bonds) planned at UCSB Susanne Kyre, UCSB

Summary Design of Phase 1 BPIX and FPIX modules and structures advancing well. – Important gains (~ factor 2) in material budget seem achievable BPIX design: basic concept same as in present detector, but important changes in support design, cooling pipe. – Prototyping of BPIX structures on-going, thermal tests about to start – Cooling pipe to structure gluing requires verification (common topic within the Tracker) FPIX design: important changes in the mechanics concept: outer/inner disk, edge cooled modules. – Many details to be worked out, and prototyped, but seems in good track. – Performance of the edge cooling to be tested. Module – coolant deltaT’s likely to be different in BPIX and FPIX due differences in cooling pipe position vs. modules – Is this a problem? Work on the Phase 2 outer module mechanical/thermal engineering started TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

On the Tracker-wide Mechanical/Thermal Engineering 1.Need to ensure coherent references on requirements (thermal, precision/accuracy), choice of materials (glues, cooling pipes, …), quality control, etc. 2.A lot of experience and know-how within the collaboration (and within other similar projects) – enhance communication and organization of documentation – Common entry web page(s) pointing to group pages. lists. 1 &2 to be tackled by the Tracker Upgrade Engineering coordinators: A. Onnela, H. Postema, K. Arndt, R. Schmitt, S. Koenig Tracker-wide Mechanical/Thermal Engineering meetings to be held every two months – Within ‘Tracker monthly’ or other suitable – We too need afternoon slots! Tracker Upgrade Project Office (D. Abbaneo, S. Kwan) meets weekly/bi- weekly, and calls sessions on specific topics, including engineering. TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela