Static Surface Charges on Differently Passivated Silicon Strip Sensors Axel König, HEPHY11 th Trento Workshop, LPNHE Paris.

Slides:



Advertisements
Similar presentations
Silicon Technical Specifications Review General Properties Geometrical Specifications Technology Specifications –Mask –Test Structures –Mechanical –Electrical.
Advertisements

BASIC BLOCKS : PASSIVE COMPONENTS 1. PASSIVE COMPONENTS: Capacitors  Junction Capacitors  Inversion Capacitors  Parallel Plate Capacitors Resistors.
Metal Oxide Semiconductor Field Effect Transistors
Quality Assurance of Silicon Strip Detectors and Monitoring of Manufacturing Process Thomas Bergauer Institute f. High Energy Physics HEPHY, Vienna SiLC.
Piezoelectric Characterization in an AFM Joe T. Evans, Jr, Radiant Technologies, Inc.
January 22, Run IIB Silicon workshop Purdue University Bortoletto Daniela, Bolla Gino, Canepa Anadi Hamamatsu testing I-V characteristics up to 1000V.
Belle-II Meeting Nov Nov Thomas Bergauer (HEPHY Vienna) Status of DSSD Sensors.
7. October th IPRD Siena W. Treberspurg, U. Bartl, T. Bergauer, M. Dragicevic, E. Frühwirth, S. Gamerith, J. Hacker, A. König, F. Kröner, E. Kucher,
Chapter 6 The Field Effect Transistor
128 September, 2005 Silicon Sensor for the CMS Tracker The Silicon Sensors for the Inner Tracker of CMS CMS Tracker and it‘s Silicon Strip Sensors Radiation.
Lecture 11: MOS Transistor
First Proton Irradiation of CMS Sensors W. de Boer, A. Dierlamm, A. Furgeri, E. Grigoriev, F. Hartmann, F. Hauler, L. Jungermann, Ch. Piasecki.
Sensor overview Ulrich Heintz Brown University, Providence, RI 6/18/2015U. Heintz - Sensor Overview 1.
Field-Effect Transistors
FET ( Field Effect Transistor)
ECE 342 Electronic Circuits 2. MOS Transistors
October 2001General Tracker Meeting IEKP - Universität Karlsruhe (TH) 1 Results on proton irradiation tests in Karlsruhe F. Hartmann IEKP - Universität.
Haga clic para modificar el estilo de texto del patrón Progress on p-type isolation technology M. Lozano, F. Campabadal, C. Fleta, S. Martí *, M. Miñano.
ADVANCED STATIC CONTROL Mitigating Electrostatic Effects on Measurement Accuracy Arnold Steinman M.S.E.E. Electrostatics Consultant Electronics Workshop.
Chapter 4 Overview of Wafer Fabrication
1 Plans of Vienna SLHC Proposal Workshop 20. February 2008.
Medipix sensors included in MP wafers 2 To achieve good spatial resolution through efficient charge collection: Produced by Micron Semiconductor on n-in-p.
Status of the Low-Resistance (LowR) Strip Sensors Project CNM (Barcelona), SCIPP (Santa Cruz), IFIC (Valencia) Contact person: Miguel Ullán.
1 G. Pellegrini The 9th LC-Spain meeting 8th "Trento" Workshop on Advanced Silicon Radiation Detectors 3D Double-Sided sensors for the CMS phase-2 vertex.
NMOS PMOS. K-Map of NAND gate CMOS Realization of NAND gate.
ECE 4339 L. Trombetta ECE 4339: Physical Principles of Solid State Devices Len Trombetta Summer 2007 Chapters 16-17: MOS Introduction and MOSFET Basics.
Fabrication Technology(1)
Norhayati Soin 05 KEEE 4426 WEEK 12/1 3/13/2005 KEEE 4426 WEEK 12 CMOS FABRICATION PROCESS.
Heavy ion irradiation on silicon strip sensors for GLAST & Radiation hardening of silicon strip sensors S.Yoshida, K.Yamanaka, T.Ohsugi, H.Masuda T.Mizuno,
Structure and Operation of MOS Transistor
News on microstrip detector R&D —Quality assurance tests— Anton Lymanets, Johann Heuser 12 th CBM collaboration meeting Dubna, October
Spencer/Ghausi, Introduction to Electronic Circuit Design, 1e, ©2003, Pearson Education, Inc. Chapter 3, slide 1 Introduction to Electronic Circuit Design.
Thin Silicon R&D for LC applications D. Bortoletto Purdue University Status report Hybrid Pixel Detectors for LC.
Slide # Goutam Koley Electronic characterization of dislocations MorphologyPotential 0.1 V /Div 10 nm /Div Surf. Potential G. Koley and M. G. Spencer,
Low Resistance Strip Sensors – RD50 Common Project – RD50/ CNM (Barcelona), SCIPP (Santa Cruz), IFIC (Valencia) Contact person: Miguel Ullán.
CERN, November 2005 Claudio Piemonte RD50 workshop Claudio Piemonte a, Maurizio Boscardin a, Alberto Pozza a, Sabina Ronchin a, Nicola Zorzi a, Gian-Franco.
N. Zorzi Trento, Feb 28 – Mar 1, 2005 Workshop on p-type detectors Characterization of n-on-p devices fabricated at ITC-irst Nicola Zorzi ITC-irst - Trento.
1 Device Simulations & Hardware Developments for CBM STS Sudeep Chatterji CBM Group GSI Helmholtz Centre for Heavy Ion Research CBM Collaboration Meeting,
Joachim Erfle Summary of measurements after first irradiation of HPK samples 19 th RD50 Workshop November 2011 CERN Joachim.
IFR Praha 2004, 16 th April 2004Václav Vrba, Institute of Physics, AS CR 1 Václav Vrba Institute of Physics, AS CR, Prague Silicon sensors status.
INFN and University of Perugia Characterization of radiation damage effects in silicon detectors at High Fluence HL-LHC D. Passeri (1,2), F. Moscatelli.
Paul Dolejschi Progress of Interstrip Measurements on DSSDs SVD.
Defect Engineering and Pad Detector Characterization Defect engineering: Search for hydrogen enrichment in silicon is still ongoing but takes time High.
Celso Figueiredo26/10/2015 Characterization and optimization of silicon sensors for intense radiation fields Traineeship project within the PH-DT-DD section.
Punch through protection and p-stop ion concentration in HPK strip mini-sensors Jan Bohm, Institute of Physics ASCR, Prague Peter Kodys, Pavel Novotny,
KIT – Universität des Landes Baden-Württemberg und nationales Forschungszentrum in der Helmholtz-Gemeinschaft Status Interstrip resistance.
Metal-oxide-semiconductor field-effect transistors (MOSFETs) allow high density and low power dissipation. To reduce system cost and increase portability,
Paul Dolejschi Characterisation of DSSD interstrip parameters BELLE II SVD-PXD Meeting.
Field Effect Transistor (FET)
EUDET FP7 brainstorm EUDET-JRA2 Jan Timmermans. My personal opinion…. I would be in favour of waiting till next call Because “grand” particle physics.
Studies on n and p-type MCz and FZ structures of the SMART Collaboration irradiated at fluences from 1.0 E+14 to 5.6E+15 p cm -2 RD50 Trento Workshop ITC-IRST.
1 Updates on Punch-through Protection H. F.–W. Sadrozinski with C. Betancourt, A. Bielecki, Z. Butko, A. Deran, V. Fadeyev, S. Lindgren, C. Parker, N.
Claudio Piemonte Firenze, oct RESMDD 04 Simulation, design, and manufacturing tests of single-type column 3D silicon detectors Claudio Piemonte.
How to design a good sensor? General sensor desing rules Avoid high electric fields Provide good interstrip isolation (high Rint) Avoid signal coupling.
IH2655 Seminar January 26, 2016 Electrical Characterization,B. Gunnar Malm
ADC values Number of hits Silicon detectors1196  6.2 × 6.2 cm  4.2 × 6.2 cm  2.2 × 6.2 cm 2 52 sectors/modules896 ladders~100 r/o channels1.835.
Low Mass, Radiation Hard Vertex Detectors R. Lipton, Fermilab Future experiments will require pixelated vertex detectors with radiation hardness superior.
Field Effect Transistors
QA Tests Tests for each sensor Tests for each strip Tests for structures Process stability tests Irradiation tests Bonding & Module assembly Si detectors1272.
1 Interstrip resistance in silicon position-sensitive detectors E. Verbitskaya, V. Eremin, N. Safonova* Ioffe Physical-Technical Institute of Russian Academy.
How to Use This Presentation
Karlsruhe probe equipment and QA proposals/expertise
Axel König, HEPHY Vienna
I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group
Revision CHAPTER 6.
Field Effect Transistors (FETs)
Optional Reading: Pierret 4; Hu 3
EMT 182 Analog Electronics I
Dr. Hari Kishore Kakarla ECE
Presentation transcript:

Static Surface Charges on Differently Passivated Silicon Strip Sensors Axel König, HEPHY11 th Trento Workshop, LPNHE Paris

1Axel König Content Introduction Sensor prototyping with Infineon The defective area of strips First occurrence Affected sensor parameters Connection to static charges Presumable mechanism Reproducing the defective area of strips Quantization of the threshold potential Mapping of surface charges Differently passivated sensors of Infineon Sensors of different vendors Summary and Conclusion

2Axel König Introduction Since 2009, HEPHY and Infineon are collaborating on the development of silicon strip sensors Started with p-in-n sensors on 6’’ wafers Continued with n-in-p sensors on 8’’ wafers (currently under investigation) Main Goal: Prototype sensors suitable for todays and future LHC experiments Basic sensor specifications AC-coupled strips Biasing via polysilicon resistors 8’’ n-in-p wafer of Infineon 6’’ p-in-n wafer of Infineon

3Axel König The defective area of strips Nearly all sensors of the 6’’ run were electrically characterized Global parameters: IV and CV Single strip parameters Single strip current I strip Polysilicon resistance R poly Coupling capacitance C ac Current through the dielectric layer I diel Area of defective strips was observed Very narrow for first 6’’ batch Much broader for second 6’’ batch So far no defective area observed for the 8’’ run (n-in-p with p-stop or p-spray) Defective area observed in batch 1 Defective area observed in batch 2 1 st 6’’ batch 2 nd 6’’ batch

4 Axel König Affected sensor parameters The defective area expresses as follows: Increase in I strip Decrease in R poly Decrease in C ac I diel nearly unaffected Decrease in interstrip resistance R int ➔ shorted strips in a confined region Interstrip resistance measurements only partly realized (very time consuming) Single strip parameters of a sensor showing a defective area of strips. Bottom: Interstrip resistances R int with basic schematics R poly R int

5Axel König Conncection to static surface charges Extensive investigations at HEPHY and Infineon were conducted Results No defective area for sensors of wafers which are not sawed No defective area for sensors sawed with CO 2 enriched water Bathing in water removes defective area Application of ionizing blower removes defective area All observations are linked to static surface charges responsible for the defective area Sensor sawed with deionized water as lubricant (red) and sensor sawed with CO 2 enriched water as lubricant (green)

6Axel König Presumable mechanism Structural similarities between silicon strip sensors and field effect transistors (FET) FET: Current flow between source and drain is controlled via a potential applied at the gate Inversion layer “p-channel” (for n bulk) serves as a conductive connection Same mechanism might be responsible for the observed defective area Potential evoked by static charges located on top of the passivation “p-channel” inversion layer might be formed in case of negative surface charges ➔ Low ohmic interconnection of strips resulting in a defective area Schematic cross section of a silicon strip sensor Schematic Working principle of a FET

7Axel König Reproducing the defective area - equipment Idea: Reproduce the defective area by applying static charges onto a sensors surface Charge application achieved by self made corona discharge device High voltage cascade  up to 30 kV between a needle tip and a grounded chuck Corona discharge happening at the needle tip Application of charges in a confined region possible Further confinement possible by using masks made out of conductive rubber Setup used for charge application Close up of corona discharge needle tip Potential distribution of charged up sample Measured cone of the corona discharge

8Axel König Reproducing the defective area - results Single strip parameters before and after charge application

9Axel König Quantization of threshold potential causing the DA Single strip current vs. gate voltage Specially prepared sample with applied “gate” pads

10Axel König Mapping surface potentials Monroe ESVM model 279L Mapped surface potentials using the ESVM

11Axel König Removing static surface charges Mapped surface potentials for differently lasting times of inflow. From left to right: initial, after 1 min of ionflow, after 6 min of ionflow, after 21 min of ionflow Ionizing blower (left) and sample (right)

12Axel König Persistance of static charges – setup and procedure Sample set Initial condition after application of ionizing blower

13Axel König Persistance of static charges - results Discharge dissolves horizontally along the strips Only one sample exhibits a complete discharge after 5 days ➔ Sample with passivation v2 v6 v5 v4 v3 v2v1

14Axel König Comparing charge persistance to other vendors (1) Initial condition after application of ionizing blower

15Axel König Again discharge dissolves horizontally along the strips for all sensors Micron sensors exhibit very a fast charge dissipation Slow charge dissipation for sensors of Hamamatsu and ITE Sensors of Infineon exhibit the same behavior as seen before (passivation v2) Comparing charge persistance to other vendors (2) Mapped surface potentials of sensors of different vendors Micron IFX HPK ITE initial 1 day2 days 3 days

16Axel König Static surface charges are able to induce a defective area of strips ➔ Importance of ESD safe handling and storage ➔ Not an issue for sensors of Infineon only ➔ Partly performed charge up tests of sensors of other vendors show a similar behavior Surface charges are highly persistent depending on the material used for passivation ➔ No short-term effect ➔ Right choice of passivation becomes more important Application of an ionizing blower speeds up charge dissipation Threshold potential can be determined by specially prepared samples Ongoing and upcoming investigations Influence of static surface charges on n-on-p sensors (p-stop or p-spray strip separation) Determination of threshold potentials for differently passivated sensors Investigate long-term charge up effects due to charge trapping in the passivation Find the optimal passivation regarding the protection against environmental influences and charge dissipation behavior Summary and outlook

Thank you for your attention! Axel König17

Backup Axel König18

19Axel König Charge up test Infineon n-on-p

20Axel König Charge up test Hamamatsu n-on-p