Cloudland Instruments Hawkeye Mechanical Design Snapshot Compiled April 8th, 2016

Cloudland Instruments Overall Mechanical Requirements House the optics Connect the instrument to rails and spacecraft Fit within overall length of payload. Position CCDs and get their heat out Provide a shutter for dark frames Support the Finder Scope assembly Maintain a light tight package around sensors Support the circuit boards Implement materials and finish for thermal control Distribute heat by creating thermal paths Meet weight budget

Cloudland Instruments Optical Design Concept – 4 Arrays

Cloudland Instruments Mechanical Design Concept Solenoids for shutter Circuit Cards Science Apertures Finderscope Aperture Interface to CubeSat Debug Port Shutter Vane

Cloudland Instruments Payload Illustration Within Rails Without Rails

Cloudland Instruments A Solid Model has been constructed to aid Visualization

Cloudland Instruments Payload Length Payload length is at inches or mm A protrusion of inches or 3.8 mm is needed for finderscope board. This protrusion will lie within the SIR bracket.

Cloudland Instruments Payload to Platform Interface 16x Rail Attachment (4 per rail) 4x End Plate attachment

Cloudland Instruments Interface to Platform Endplate Location of four attachment holes on Endplate. We will provide four M2 threaded holes. Holes not symmetric. Will need to know final orientation

Cloudland Instruments Interface to Platform Rails Total of 16 attachment points to Platform rails. We will provide 16 threaded M2 holes. Eight holes per each of two End Caps.

Cloudland Instruments Payload to Platform Interface Based on the configuration of the Payload it was determined that directly mounting to the Platform rails was the best option. Mounting locations based on solid models provided by Clyde Space. Areas requiring clearance such as protruding screw heads on the SIR mounting brackets have been noted. Clyde Space requires a 1 mm clearance between Payload and Platform structure for vibration purposes.

Cloudland Instruments Interference Clearance Clearance of 3.5 mm for four stack termination screws will be provided to clear screw head height of 2.5mm. This screw is located on the Clyde Space mounting bracket.

Cloudland Instruments Interface Issues to Address Space and location of cable routing needs to be determined. Due to the non symmetric mounting holes on the End Panel and SIR Mounting Bracket, orientation of those pieces will need to be communicated so we can place our attachment points. The location of the sun sensor will have to be determined so we can design for it. It was mentioned that a smaller sensor might be used.

Cloudland Instruments CCD Stack Assembly CCD Parts Stack, Top to Bottom Lightshield * CCD Pedestal CCD Board * Held in by two 2-56 flat head Phillips screws using two threaded swages.

Cloudland Instruments “Finderscope” Assembly RG 830 Filter Lens Elements Micron 752x480 Pixel CMOS Sensor Field Of View

Cloudland Instruments Circuit Card Configuration CCD Board Analog Board Motherboard Picozed Board Interface Board Finderscope sensor

Cloudland Instruments Circuit Board Placement Circuit boards will be attached directly to the housing or to each other by way of threaded stand offs and threaded swages Board spacing was based on connector spacing and board proximity to mechanical components and payload edges. Space is very limited.

Cloudland Instruments Thermal Considerations Heat sinking rails will be used on the Analog and Mother board. Heat sinking will be needed to dissipate heat from four CCDs. Additional heat sinking will be required on the PicoZed board due to heat produced by Zynq processor. We plan to create a heat sinking surface on main housing that contacts processor.

Cloudland Instruments Materials and Finish The majority of parts will be made of standard Aluminum T6. The optic barrels will be made of Stainless Steel due to the lower expansion properties. Exterior surfaces will be gold plated to take advantage of the thermal properties. These include the end pieces and cover plates.

Cloudland Instruments Payload Weight Breakdown Weight chart is divided into subassemblies and component groups. Current total weight estimate is Kg The majority of weight changes will occur in the Enclosure components. Payload Weight qtylbs.Total lbslbsKg Shutter Solenoids Solenoid Bracket Vane Arm Brackets Fasteners (ss) Optics Scrambler Wedge Filter Lens Lens Lens Barrel (ss) Adjustment sq CCD Assy ccds Pedestal Lightshield Boards Pico Zed Board CCD Board Analog Board Interface Board Mother Enclosure Side cover Long Side cover Short10.05 Sides ends Top Baffle10.03 Housing10.41 Baffles Filter Housing Finderscope ccd Board Lenses Housing TOTALS:

Cloudland Instruments Weight Budget Currently the estimated weight of payload is kg. Most of the weight is concentrated in the mechanical structures. Total payload weight will be controlled here. Circuit Board weights will need to be revisited after prototype boards are made. Numbers not expected to change too much. Weight of following should not change since design is determined. –Shutter Assembly –Optical Assembly –CCD array assembly (Includes lightshields and pedestals) –Finderscope

Cloudland Instruments Instrument fits within CubeSat Envelope