Integration of the MVD Demonstrator S. Amar-Youcef, A. Büdenbender, M. Deveaux, D. Doering, J. Heuser, I. Fröhlich, J. Michel, C. Müntz, C. Schrader, S. Sedikki, J. Stroth, T. Tischler, and B. Wiedemann Oct. 2008, CBM Collaboration Meeting, JINR Dubna, Russia

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 2/13 Outline  MVD Demonstrator concept  Sensor  Support  Mechanics  Thermal  Flex Print Cable  Demo Aux board  Cryogenic operations see talk of C. Schrader

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 3/13 Consisting of:  2 MAPS Sensorchips  Heat-evacuating support  FPC  Readout electronics (artistic view)‏ MVD Demonstrator Concept  Setup a working detector with present mountings accounting for  Mechanical system integration  Electronic system integration

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 4/13 IPHC Mi17:  Single ended output  65k Pixel  4 channels  66 mm² Mi20:  Differential output  Similar to final versions  Particular advantage for FPC design  204k Pixel  2 channels  203 mm² MVD Demonstrator Concept: Sensor Mi20 Mi17 IPHC 2xMi20 instead of 4xMi17 Eudet telescope demonstrator STAR vtx det. upgrade

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 5/13 Achievements:  300µm (+/- 10cm x 1cm Chips TPG RVC TPG TPG plates availale:  350µm (not machinable)  1mm machining Vendor: Momentiv RVC: 6mm (+/-0.2mm)‏ Dummy Chips: 520µm (+/-10µm) Glue: Chips to TPG:  Film glue: 35µm (+/-5µm)‏ TPG to RVC:  Liquid glue: 25µm (+/-20µm) X 0 Segmentation Thickness Segmentation Notice: without FPC MVD Demonstrator Concept: Support - mechanics Measured: 7.3 mm

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 6/13 Typical values for metals: 500 MPa Sandwichshape for Stiffening: I ~ b·h³ I: Geometrical moment of inertia b,h: Profile Mechanical durability studies are ongoing:  Models  Simulation F Alternative materials are available!!! Chips TPG RVC TPG MVD Demonstrator Concept: Support - mechanics

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 7/13 FPC: 0.3 mm Chip: 0.2 mm TPG: mm °C Thermal simulation of heat evacuation δQ≈8W 50mm Varying cooling fluid temperature: Temperature scales lineary with fluid temperature: --> temperature at chip is tunable MVD Demonstrator Concept: Support - thermal

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 8/13 MVD Demonstrator Concept: Support - thermal  Glue only minor influence on heat capability  d TPG ≥ 200µm to avoid large gradient Axis Varying TPG thickness:

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 9/13 288°C 39.7°C CFC CX31 (Star)‏ d Support = 500µm MVD Demonstrator Concept: Support Note: Heat evacuation at STAR via air cooling! Simulation: Heat evacuation only via conduction through support material! CBM requirement: Vacuum operational

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 10/13 Chipside:  55pads/chip to be allocated 19 signal pads --> 19 lines 36 supply pads --> ≥ 4 lines  3 bias lines  1 ground line Boardside: Fine pitch connector  2 x 37 Pins  60 Pins In addition: some extra structures for probing MVD Demonstrator Concept: Multi Layer Flex Print Cable

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 11/13 Signal (ground-lines)‏ Ground Bias Chip Bonding Lines of copper! Alu doable but not standard! Status:  scheme is ready  contact to companies established  Layouting is ongoing (~Oct.2008)‏ MVD Demonstrator Concept: Multi Layer Flex Print Cable Cross section Approach:

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 12/13 MVD Demonstrator Concept: Demo Aux Board  FPC connected to Demo-AUX  Provides supply and control signals for the chip  Routes signals to MAPS-add-on board Details: see talk of C. Schrader

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 13/13 Cryogenic operation (for the future) :  To determine the ideal environmental condition for MAPS Simulation: -120°C °C State:  Mounting of units  First tests in nov./dec.08 T1T1 T2T2

Oct. 2008, CBM Collaboration Meeting, Dubna, Russia 14/13 Summary  Electronic:  Integrate Mimosa 20 as sensor  FPC: scheme is ready, layouting is ongoing  Demo Aux: Concept is advanced, implementation is ongoing  Mechanics:  First samples of capable support structures are ready  Exercise support structures!  Determine the ideal condition for MAPS Next steps  Test mechanics  Prepare for and test electronical connections