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Report on CMS 3D sensor tests Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN 47907- 2036.

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Presentation on theme: "Report on CMS 3D sensor tests Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN 47907- 2036."— Presentation transcript:

1 Report on CMS 3D sensor tests Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN 47907- 2036 US 26 April 2012

2 Pre- and post-irradiation lab and beam tests (@ FNAL) performed for SINTEF and FBK 3D sensors – CNM sensors only tested in testbeams Irradiation – 800 MeV protons/cm 2 at Los Alamos – Fluences: 3.5E14, 0.7E15, and 3.5E15 n eq /cm 2 All ROCs work after irradiation – Except SINTEF case: 1 out of 6 ROCs worked Post-irradiation lab measurements carried out in the thermal chamber – Leakage current – Noise – Source data Introduction

3 Cold setup Purdue cold test setup Environmental chamber -35 °C < T < 200 °C Humidity control Works with CAPTAN and PSI DAQ systems Good for sensor IV measurements and ROC calibrations at cold Manual temperature control Cold setup for irradiated 3D sensor testing

4 Cold setup Purdue cold test setup Sr-90 source Linear actuator Sensor HV Temperature sensor

5 Thermal measurements in the chamber Purdue cold test setup Infrared camera placed in the chamber to measure the sensor temperature Thermal image of sensor at emissivity = 1 Thermal chamber at 10 °C

6 Thermal measurements in the chamber Thermal chamber at 10 °C ROC is ON --- temperature sensor pcb ROC is OFF ΔT = 13 °C

7 FBK 3D PIXEL SENSORS

8 Sensors  Full 3D  200 μm thickness  ATLAS08 batch (2010) Sensor ROC Bump bonds VHDI Base plate Adhesive Wire bond Bias wire FBK 3D plaquette

9 IV measurements Thermal chamber at -20 °C

10 Noise scan Thermal chamber at -20 °C

11 Source testing Sr-90 source: 1 mCi, E β = 0.546 ΜeV Random trigger used Thermal chamber at -20 °C 1 Vcal = 65 e- MP = 10.6 ke- (Thickness: 200 μm) 4E_14_W8 @ -15V Φ = 1E15 p/cm 2

12 Source charge collection scan Sr-90 source: 1 mCi, E β = 0.546 ΜeV Random trigger used Landau convoluted Gaussian fit Thermal chamber at -20 °C 4E_14_W8 @ -15V Φ = 1E15 p/cm 2

13 Charge collection scans Thermal chamber at -20 °C

14 Source testing: pre- and post-irradiation Signal LOSS: 1E 43% after 1E15 p/cm 2 (0.7E15 n eq /cm 2 ) 1E 50% after 5E15 p/cm 2 (3.5E15 n eq /cm 2 ) 2E 14% after 1E15 p/cm 2 (0.7E15 n eq /cm 2 ) 4E 14% after 1E15 p/cm 2 (0.7E15 n eq /cm 2 )

15 Beam test results (1E_2) V bias = -15V : 20 o tilt Preliminary Beam spot 98.5% efficiency 62% size 1 pixel 37% size 2 pixels Unirradiated sensor

16 Beam test results (2E_9) V bias = -5V : 20 o tilt Preliminary Beam spot 94.6% efficiency 77% size 1 pixel 22% size 2 pixels Unirradiated sensor

17 SINTEF 3D PIXEL SENSORS

18 Sensors Plastic protection Cooling tubes SINTEF 3D plaquette 2E Configuration 4E Configuration n+ (readout)p+ (bias) 100 μm 150 μm

19 SINTEF 3D Plaquette Al fixture VHDI Adhesive ROC Sensor Bump bonds Support wafer HV bias wirebond Au plated Ceramic Bias pad

20 Chamber @ -20 °C Sensor: 4E_B2-10_1 ϕ = 1E15 n eq /cm 2 Noise scan

21 V bias = -90V Thickness = 200 µm MPV = 9600 electrons Chamber @ -20 °C Sensor: 4E_B2-10_1 ϕ = 1E15 n eq /cm 2 Sr-90 source: 1 mCi, E β = 0.546 ΜeV Random trigger used Charge collection

22 Chamber @ -20 °C Sensor: 4E type 200 μm thick ϕ = 1E15 n eq /cm 2 Charge collection scan

23 CNM 3D PIXEL SENSORS

24 CNM 3D sensors Columns etched from opposite sides of substrate Columns don't pass through full thickness 1E type only Hole aspect ratio 25:1 10µm diameter, 250µm deep P- and N-type substrates, 285µm thick Giulio Pellegrini et al (CNM)

25 Beam test results (12-3_62A) V bias = -15V : 0 o tilt Preliminary Beam spot 93.4% efficiency 99% size 1 pixel 1% size 2 pixels Unirradiated sensor Sensor: 1E type 200 μm thick

26 Summary & Outlook All irradiated ROCs work (CNM, FBK) except SINTEF Lab measurements performed in the thermal chamber at -20 °C Thermal measurements suggest sensor temperature is -7 °C (ROC ON) when thermal chamber at -20 °C due to ΔT = 13 °C IV, noise scan, and source testing done – Negligible increase in noise – Leakage current increased – Not much increase in depletion voltage Post- and post-irradiation beam test results will be ready in few months More 3D sensors will be irradiated with fluences up to 1E16 n eq /cm 2 Search for a testbeam facility since FNAL will have no beam for sometime starting from May 2012

27 BACKUP SLIDES

28 BEAM CONTROL ROOM DUT PIXEL DETECTORS SCINTILLATORS 3.7V POWER SUPPLY ACELLERATOR CLOCK CLOCK AND TRIGGER DISTRIBUTION FNAL testbeam 120 GeV protons No B field Meson Area

29 FNAL testbeam layout


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