1. Dezső Sima Evolution of Intel’s Basic Microarchitectures - 2 November 2012 Vers. 3.2

2. Contents 1. Introduction 2. Core 2 3. Penryn 4. Nehalem 7. Westmere-EX 5. Nehalem-EX 6. Westmere

3. Contents 9. Sandy Bridge Extreme Edition 10. Ivy Bridge 11. Overview of the evolution 8. Sandy Bridge 11. Haswell

4. 8. Sandy Bridge 8.1 Introduction 8.2 Advanced Vector Extension (AVX) 8.3 On-die ring interconnect bus 8.4 On-die integrated graphics unit 8.5 Enhanced turbo boost technology

5. 8.1 Introduction (1) Sandy Bridge is Intel’s new microarchitecture using 32 nm line width. First delivered in 1/2011 8.1 Introduction

6. 32K L1D (3 clk) AVX 256 bit 4 Operands 256 KB L2 (9 clk) Hyperthreading AES Instr. VMX Unrestrict. 20 nm 2 / Core 256 KB L2 (9 clk) 256 KB L2 (9 clk) 256 KB L2 (9 clk) 256 KB L2 (9 clk) 256 KB L2 (9 clk) 256 KB L2 (9 clk) PCIe 2.0 @ 1.0 1.4 GHz (to L3 connected) 256 b/cycle Ring Architecture (25 clk) DDR3-1600 25.6 GB/s Main functional units of Sandy Bridge [143] Part 4 32 nm process / ~225 nm 2 die size / 85W TDP 8.1 Introduction (2)

7. Key features and benefits of the Sandy Bridge line vs the 1. generation Nehalem line [61] 8.1 Introduction (3)

8. Desktops Servers DP-Servers E5 2xxx, Sandy Bridge-EP, up to 8C, Q4/2011 UP-Servers E3 12xx, 4C, Sandy Bridge-H2, 4C, 3/2011 Mobiles Core i3-23xxM, 2C, 2/2011 Core i5-24xxM//25xxM, 2C, 2/2011 Core i7-26xxQM/27xxQM/28xxQM, 4C, 1/2011 Core i7 Extreme-29xxXM, 4C, Q1 2011 Core i3-21xx, 2C,no HT, no vPro, 2/2011 Core i5-23xx 4C+G, no HT no VPro, 1/2011 Core i5/24xx/25xx, 4C+G, no HT, vPro, 1/2011 Core i7-26xx, 4C+G, HT, vPro, 1/2011 Core i7-2700K, 4C+G, HT, no vPro, 10/2011 MP-Servers E5 4xxx, Sandy Bridge-EX, up to 8C, Q1/2012 Overview of the Sandy Bridge based processor lines Based on [62] and [63] 8.1 Introduction (4) Core i7-3960X, 6C, HT, vPro??, 11/2011 Core i7-3930K, 6C, HT, vPro??, 11/2011 Desktops Sandy Bridge Sandy Bridge-E Section 9)

9. 8.2 Advanced Vector Extension (AVX) (1) Figure: Evolution of the SIMD processing width [18] BMA-ból 8.2 Advanced Vector Extension (AVX) Sandy Bridge Introduction of AVX

10. Norhwood Northwood (Pentium4) 8 MM registers (64-bit), aliased on the FP Stack registers 8 XMM registers (128-bit) 16 XMM registers (128-bit) 16 YMM registers (256-bit) Figure: Intel’s x86 ISA extensions - the SIMD register space (based on [18]) BMA Ivy Bridge 8.2 Advanced Vector Extension (AVX) (2)

11. 8.3 On-die ring interconnect bus (1) 8.4 The on die ring interconnect bus of Sandy Bridge [66] Six bus agents. The four cores and the L3 slices share interfaces.

12. 8.4 On-die integrated graphics unit (1) 8.5 Sandy Bridge’s integrated graphics unit [102] Part4 12 EUs

13. Specification data of the HD 2000 and HD 3000 graphics [125] Part 4 - 8.4 On-die integrated graphics unit (2)

14. frames per sec i5/i7 2xxx/3xxx: Sandy Bridge i5 6xx Arrandale HD5570 400 ALUs Performance comparison: gaming [126] part 4 8.4 On-die integrated graphics unit (3)

15. 8.5 Enhanced turbo boost technology (1) Cooler Innovative concept of the 2.0 generation Turbo Boost technology Thermal capacitance The concept utilizes the real temperature response of processors to power changes in order to increase the extent of overclocking [64] 8.5 Enhanced turbo boost technology [64]

16. Concept: Use thermal energy budget accumulated during idle periods to push the core beyond the TDP for short periods of time (e.g. for 20 sec). Multiple algorithms manage in parallel current, power and die temperature. [64] 8.5 Enhanced turbo boost technology (2)

17. Intelligent power sharing between the cores and the integrated graphics [64] 8.5 Enhanced turbo boost technology (3)

18. Intelligent power sharing between the cores and the integrated graphics [68] 8.5 Enhanced turbo boost technology (4)

19. [61] WSM/M WSM/D NHM/M NHM/D 8.5 Enhanced turbo boost technology (5)

20. Remark 8.5 Enhanced turbo boost technology (6) Individual cores may run at different frequencies but all cores share the same power plane. Individual cores may be shut down if idle by power gates.

21. 9. The Sandy Bridge-E line

22. 9. The Sandy Bridge-E line (1) 9 The Sandy Bridge-E line of processors (2. gen. Core i7 processors) Introduced in 11/2011 as a “precursor” of the upcoming DP/MP server lines. Key features vs the original Sandy Bridge line (1) a) 6 cores with 2 cores disabled but does not incorporate graphics [76].

23. 435 mm 2 2.27 B trs 15 MB L3 216 mm 2 995 mtrs 8 MB L2 [61] [76] 9. The Sandy Bridge-E line (2) Sandy Bridge (2x) Sandy Bridge E

24. CPU Specification Comparison CPU Manufacturing Process Cores Transistor Count Die Size AMD Bulldozer 8C32nm8~2B315mm 2 AMD Thuban 6C45nm6904M346mm 2 AMD Deneb 4C45nm4758M258mm 2 Intel Gulftown 6C32nm61.17B240mm 2 Intel Sandy Bridge E (6C)32nm62.27B435mm 2 Intel Nehalem/Bloomfield 4C45nm4731M263mm 2 Intel Sandy Bridge 4C32nm4995M216mm 2 Intel Lynnfield 4C45nm4774M296mm 2 Intel Clarkdale 2C32nm2384M81mm 2 Intel Sandy Bridge 2C (GT1)32nm2504M131mm 2 Intel Sandy Bridge 2C (GT2)32nm2624M149mm 2 Comparison of die parameters of recent DT processors [77] 9. The Sandy Bridge-E line (3)

25. L1L2L3Main Memory AMD FX-8150 (3.6GHz) 42165195 AMD Phenom II X4 975 BE (3.6GHz) 31559182 AMD Phenom II X6 1100T (3.3GHz) 31455157 Intel Core i5 2500K (3.3GHz) 41125148 Intel Core i7 3960X (3.3GHz) 41130167 Cache/memory latencies of recent DT processors [77] 9. The Sandy Bridge-E line (4)

26. b) 4 parallel memory channels (inherited from the server side) instead of 2 of the previous lines. Support of DDR3 of up to 1600 MT/s. A single DDR3-1600 DIMM per channel or 2 DDR3-1333 DIMMs per channel [78]. 9. The Sandy Bridge-E line (5)

27. c) 40 PCIe 2. gen. lanes to connect graphics cards directly to the processor instead of 16 to 32 of the previous generation Sandy Bridge [78]. d) LGA-2011 socket instead of the LGA-1155 used in the pervious generation Sandy Bridge due to the increased number of memory channels connected to the processor.. 9. The Sandy Bridge-E line (6)

28. Processor Core Clock Cores / Threads L3 Cache Max Turbo Max Overclock Multiplier TDPPrice Intel Core i7 3960X 3.3GHz6 / 1215MB3.9GHz57x130W$990 Intel Core i7 3930K 3.2GHz6 / 1212MB3.8GHz57x130W$555 Intel Core i7 3820 3.6GHz4 / 810MB3.9GHz43x130WTBD Intel Core i7 2700K 3.5GHz4 / 88MB3.9GHz57x95W$332 Intel Core i7 2600K 3.4GHz4 / 88MB3.8GHz57x95W$317 Intel Core i7 2600 3.4GHz4 / 88MB3.8GHz42x95W$294 Intel Core i5 2500K 3.3GHz4 / 46MB3.7GHz57x95W$216 Intel Core i5 2500 3.3GHz4 / 46MB3.7GHz41x95W$205 Main features of the Sandy Bridge-E line vs the Sandy Bridge line [77] 9. The Sandy Bridge-E line (7)

29. Intel’s DT board for Sandy Bridge-E processors [79] (The DX79SI ATX board for the Core i7-3960X /3930K) Max. memory: 8 x 8 GB 9. The Sandy Bridge-E line (8)

30. 10. The Ivy Bridge line

31. 10. Te Ivy Bridge line – 10.1 Introduction (1) Introduced: 4/2013 Figure 10.1: Intel ’ s Tick-Tock development model [Based on 1] Tick-Tock Development Model Merom 1 NEW Microarchitecture 65nm Penryn NEW Process 45nm Nehalem NEW Microarchitecture 45nm Westmere NEW Process 32nm Sandy Bridge NEW Microarchitecture 32nm Ivy Bridge NEW Process 22nm Haswell NEW Microarchitecture 22nm TOCK TICKTOCKTICKTOCKTICK 10. The Ivy Bridge line 11.1 Introduction The Ivy Bridge is termed also as the 3. gen. Intel Core processors.

32. 10.1 Introduction (2) 32 nm 216 mm 2 995 mtrs 22 nm 160 mm 2 1480 mtrs (Resized to 32 nm feature size) Figure 10.2: Contrasting the Sandy Bridge and Ivy Bridge dies [81] Sandy Bridge Ivy Bridge

33. 10.1 Introduction (3) [84]

34. 10.1 Introduction (4) Major innovations of Ivy Bridge [80]

35. 11.2 The new 22 nm tri-gate process technology (1) 11.2 The new 22 nm tri-gate process technology [82]

36. 10.2 The new 22 nm tri-gate process technology (1) [82]

37. 10.2 The new 22 nm tri-gate process technology (1) [82]

38. 10.2 The new 22 nm tri-gate process technology (1) [82]

39. 10.2 The new 22 nm tri-gate process technology (1) [82]

40. 10.2 The new 22 nm tri-gate process technology (1) Figure: Contrasting 32 nm planar and 22 nm tri-gate transistors [82]

41. 10.2 The new 22 nm tri-gate process technology (1) [82]

42. 10.2 The new 22 nm tri-gate process technology (1) [82]

43. 10.2 The new 22 nm tri-gate process technology (1) [82]

44. 10.2 The new 22 nm tri-gate process technology (1) Figure: Ivy Bridge chips on a 300 mm wafer

45. 10.2 The new 22 nm tri-gate process technology (1) ProcessorFeature sizeNo. of cores L2 + L3 size No. of transistorDie size Ivy Bridge22 nm Tri-Gate4 (+ IGP)9 MB1,48 milliárd160 mm 2 Sandy Bridge32 nm HKMG4 (+ IGP)9 MB995 millió216 mm 2 Sandy Bridge-E32 nm HKMG616,5 MB2,27 milliárd435 mm 2 Gulftown32 nm HKMG613,5 MB1,17 milliárd240 mm 2 Lynnfield45 nm HKMG49 MB774 millió296 mm 2 Bloomfield45 nm HKMG49 MB731 millió263 mm 2 Orochi (Bulldozer)32 nm HKMG SOI8 (4 modul)16 MB~1,2 milliárd315 mm 2 Llano32 nm HKMG SOI4 (+ IGP)4 MB1,45 milliárd228 mm 2 Thuban45 nm SOI69 MB904 millió346 mm 2 Deneb45 nm SOI48 MB758 millió258 mm 2 Table: Main implementation parameters of recent processors [81]

46. 10.3 Supervisory Mode Execution Protection (SMEP) [83]

47. 10.4 System architecture (1) [81]

48. 10.4 System architecture (2) [81]

49. 10.5 Performance (1) [81]

50. 10.5 Performance (2) [81]

51. 11. The Haswell line

52. 11. The Haswell line of processors (1) Expected date of introduction: 4/2013 Figure 1.1: Intel ’ s Tick-Tock development model [Based on 1] Tick-Tock Development Model Merom 1 NEW Microarchitecture 65nm Penryn NEW Process 45nm Nehalem NEW Microarchitecture 45nm Westmere NEW Process 32nm Sandy Bridge NEW Microarchitecture 32nm Ivy Bridge NEW Process 22nm Haswell NEW Microarchitecture 22nm TOCK TICKTOCKTICKTOCKTICK 11. The Haswell line of processors

53. 11. The Haswell line of processors (2) The Haswell die [85]

54. 11. The Haswell line of processors (3) Haswell’s system architecture [86]

55. 11. The Haswell line of processors (4) [80]

56. 11. The Haswell line of processors (5) [80]

57. 11. The Haswell line of processors (6) [80]

58. 11. The Haswell line of processors (7) [80]

59. 11. The Haswell line of processors (8) [80]

60. To 12. – Additional references

61. [81]: Olivera, A régóta várt Intel Ivy Bridge tesztje, Prohardware, 2012-04-13, http://prohardver.hu/teszt/intel_ivy_bridge_teszt/az_ivy_bridge.html [80]: Chappell R., Toll B., Singhal R.: Intel Next Generation Microarchitecture Codename Haswell: New Processor Innovations, IDF 2012 [82]: Bohr M., Mistry K.: Intel’s Revolutionary 22 nm transistor technology, May 2011, http://download.intel.com/newsroom/kits/22nm/pdfs/22nm-Details_Presentation.pdf [83]: George V., Piazza T.,Jiang H.: Technology Insight: Intel Next Generation Microarchitecture Codename Ivy Bridge, IDF 2011 [84] 3 rd Generation Intel Core Processor Family Quad Core Launch Product Information, April 23, 2012 http://download.intel.com/newsroom/kits/core/3rdgen/pdfs/3rd_Generationhttp://download.intel.com/newsroom/kits/core/3rdgen/pdfs/3rd_Generation _Intel_Core_Product_Information.pdf [85] Ivy Bridge and Haswell die configurations (estimates included), Anandtech, 03-21-2012, http://forums.anandtech.com/showthread.php?t=2234017 [86]: Piazza T.,Jiang H., Hammerlund P., Singhal R.: Technology Insight: Intel Next Generation Microarchitecture Codename Haswell, IDF 2012 SPCS001