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ECE 477 Final Presentation Group 11  Fall 2005 ChadJeffMel Maruf.

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Presentation on theme: "ECE 477 Final Presentation Group 11  Fall 2005 ChadJeffMel Maruf."— Presentation transcript:

1 ECE 477 Final Presentation Group 11  Fall 2005 ChadJeffMel Maruf

2 Outline Project overviewProject overview Block diagramBlock diagram Professional componentsProfessional components Design componentsDesign components Success criteria demonstrationsSuccess criteria demonstrations Individual contributionsIndividual contributions Project summaryProject summary Questions / discussionQuestions / discussion

3 Project Overview Objective: Design and prototype a device to improve the safety and alertness of a driver.Objective: Design and prototype a device to improve the safety and alertness of a driver. This device should:This device should: –Determine if the driver is leaving the lane. –Detect obstacles in the road ahead. –Watch for patterns indicating unsafe driving. –Appropriately warn the driver if any of the above occur.

4 Block Diagram

5 Professional Components Constraint analysis and component selection rationaleConstraint analysis and component selection rationale Patent liability analysisPatent liability analysis Reliability and safety analysisReliability and safety analysis Ethical and environmental impact analysisEthical and environmental impact analysis

6 Design Constraints Microcontroller Video Support, DSP chip, Packaging, Development Tools Camera Sensor Type (CCD), Output Type (NTSC), Resolution (240+ lines), Input Voltage (<12 V), Size (Small) Clover CM720 Analog BF532

7 Patent Liability Analysis Commercial products: IterisIteris –AutoVue™ system –Infinity FX (2005) and Infinity M45(2006) ValeoValeo –LaneVue™ CitroenCitroen –Uses 9 infrared sensors Mitsubishi electricMitsubishi electric

8 Patent Liability Analysis USPTO patents: Patent NoTitleDate Filed 6,553,130Motor vehicle warning and control system and method June 28, 1996 6,678,394Obstacle detection systemJanuary 13, 2004 6,930,593Lane tracking system employing redundant image sensing devices August 16, 2005 6,819,779Lane detection system and apparatusNovember 16, 2004 6,813,370Lane marker recognizing apparatusNovember 2, 2004 6,748,302Lane tracking control system for vehicleJune 8, 2004 Our device infringes on these patents under the doctrine of equivalents.

9 Reliability/Safety Analysis Analysis for 10^6 operational hoursAnalysis for 10^6 operational hours PartsMTTF Microprocessor – ADSP- BF532 151,149 hours Voltage Regulator – FDS9431A 86,374 hours ADC – TVP5146135,501 hours PLD – ATF22V10C2 3.039 X 10^6 hours SDRAM – MT48LC4M16/SO9.85 X 10^5 hours

10 Criticality LevelsCriticality Levels  High - A system failure that is undetectable by the user  Unstable voltage supply  Image corruption  False output  Low - A system failure that could be readily identified.  EEPROM  3.3V supply Reliability/Safety Analysis

11 Ethical/Environmental Analysis Ethical Challenges Ethical Challenges Develop a safe testing strategy. Develop a safe testing strategy. User over-reliance on the device. User over-reliance on the device. Tamper-resistant packaging. Tamper-resistant packaging. Solution Solution Control the test environment. Control the test environment. Use a three-person-test method. Use a three-person-test method. Clearly mark the package with warning labels Clearly mark the package with warning labels Warn about over-reliance. Warn about over-reliance. Warn about tampering with the package. Warn about tampering with the package.

12 Ethical/Environmental Analysis Environmental Impact Environmental Impact - Manufacture - Manufacture - Normal usage - Normal usage - Disposal/Recycling - Disposal/Recycling Solution Solution - Unavoidable impacts due to PCB manufacturing - Unavoidable impacts due to PCB manufacturing - Use minimal layers and more copper planes over - Use minimal layers and more copper planes over lone traces lone traces - Recycling/Disposal - Recycling/Disposal - Provide a list of certified e-waste - Provide a list of certified e-waste recyclers recyclers

13 Design Components Packaging design considerationsPackaging design considerations Schematic design considerationsSchematic design considerations PCB layout design considerationsPCB layout design considerations Software design considerationsSoftware design considerations

14 Packaging Design Power on Indicator LED Array Buzzer Front View – LEDs PWR Side View – External ConnectorsPower Cord Camera Power Supply Camera Video Input

15 Packaging Design Power Jack Camera Mounting Mechanism Camera Clamp for Camera Red level line

16 Packaging Design Front View LED Array Power LED Rear View Camera Video input Camera Power Supply Buzzer Top View

17 Schematic Design

18 Fix: Changed from power to ground

19 Schematic Design Fix: Changed from C channel to Y channel Fix: Used oscillator instead of crystal

20 Schematic Design Added a new LDO to drop from 12 Volt to 5 Volt

21 PCB Layout Design

22 Software Design Initialization I2C (Video In signal to ADC) PLL, PPI, GPIO, SDRAM, DMA Find Obstacle Preprocess image Perform Cross Correlation Set Output Find Vehicle Position Interrupt Service Routine

23 Success Criteria Demonstrations 1.Ability to capture a series of real image video - demo demo 2.Ability to determine lateral position of car within lane - demo demo 3.Ability to detect drift from lane - demo demo 4.Ability to detect intrusion of other vehicle/hazard/obstacle in lane - demo demo 5.Ability to detect an impaired driving behavior- demo demo

24 Individual Contributions Team Leader – Chad AeschlimanTeam Leader – Chad Aeschliman Team Member 2 – Jeffery LeeTeam Member 2 – Jeffery Lee Team Member 3 – Golam MarufTeam Member 3 – Golam Maruf Team Member 4 – Ying Mei TanTeam Member 4 – Ying Mei Tan

25 Team Leader – Chad Aeschliman HardwareHardware –Tested components SoftwareSoftware –Initialization –I2C driver –Main interrupt routine –Algorithms for vehicle position and obstacle detection –Debugging DocumentationDocumentation –Design constraints –Software narrative

26 Member 2 – Jeffery Lee HardwareHardware Schematic and Circuit Design PCB Layout Preliminary and Final Design Most of the hands-on hardware work. 100% of all soldering and fly-wiring. DocumentationDocumentation –Ethical and Environmental Analysis –OrCad and Schematic Documentation

27 Member 3 – Golam Maruf HardwareHardware - LED and Audio output - LED and Audio output - Packaging - Packaging SoftwareSoftware - Interrupt service routines - Interrupt service routines - Software testing - Software testing DocumentationDocumentation - Schematic - Schematic - Reliability & Safety Analysis - Reliability & Safety Analysis - User Manual - User Manual

28 Member 4 – Ying Mei Tan HardwareHardware –Packaging SoftwareSoftware –I2C driver –Output generator –Webmaster DocumentationDocumentation –Packaging homework –Patent homework –User Manual

29 Project Summary Important lessons learnedImportant lessons learned –Technical Image processingImage processing Embedded system design techniquesEmbedded system design techniques Soldering techniquesSoldering techniques –Non-Technical Team organizationTeam organization Professional writingProfessional writing

30 Project Summary Second iteration enhancementsSecond iteration enhancements –Use a Microprocessor with internal FLASH and video output capabilities to speed software development –Use Analog video chip –Utilize parallel processing –Leave room for heat sinks on LDOs –Add mounting holes to the PCB

31 Project Summary Additional enhancementsAdditional enhancements –Use extra headers for prototyping. Thoughts/ConclusionsThoughts/Conclusions –The serial port is a vital tool for debugging.

32 Questions / Discussion


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