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October 2006 Mark Whitley Mid term Review 1 Mark Whitley LHCb VELO Backend Bonding at The University of Liverpool.

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Presentation on theme: "October 2006 Mark Whitley Mid term Review 1 Mark Whitley LHCb VELO Backend Bonding at The University of Liverpool."— Presentation transcript:

1 October 2006 Mark Whitley Mid term Review 1 Mark Whitley LHCb VELO Backend Bonding at The University of Liverpool

2 October 2006 Mark Whitley Mid term Review 2 Backend Bonding The backend bonding using our Hesse and knipps bondjet 710. Use the Bonding Document.

3 October 2006 Mark Whitley Mid term Review 3 Setting Up For Bonding Back end bonding is all the wires that are bonded from the Beatle 1.5 down to the hybrid. Approximately 70 wires per chip. Radial side is different to the phi side. For back end bonding, the bonding jig needs to be mounted as shown. Allows the operator to visual inspect the bonding during the bonding process (the transducer will not foul the view of the operator).

4 October 2006 Mark Whitley Mid term Review 4 Calibration & Test Bonds Mount the hybrid in its handling frame. 1 st radial side up onto the bonding jig. 2 nd Phi side up. Apply the vacuum. If there is any leak of suction around the hybrid then you will experience problem bonds so it is important the hybrid is well supported. large gold pad, use this for a P-axle and wedge geometry calibrations. Prior to starting any bonding programs. In manual bonding use the same bonding parameters as the program. Bond 7 wires. Measure the pull strengths of these wires.

5 October 2006 Mark Whitley Mid term Review 5 Programs Two different programs. 1 st Program name lhcbhybr LHCb Hybrid Radial side. 2 nd Program name lhcbhybp LHCb Hybrid Phi side. There are 1,104 wires in the radial program and 1,088 wires in the phi program. If one wire has not been bonded it could mean the whole chip might not work. Bonding map for back end bonds. Addressing for each chip is different

6 October 2006 Mark Whitley Mid term Review 6 Reference Systems Both programs have 17 reference systems as show. The whole Hybrid is reference system 1. Each chip has its own reference system. All chip reference systems bond down to reference system 1.

7 October 2006 Mark Whitley Mid term Review 7 The Fiducials (Hybrid) Reference system 1 (the hybrid). The fiducials used for the reference system are as follows. Should the loaded program fail to find any of the alignment points. Manually align the eye points as shown using the red crosshair.

8 October 2006 Mark Whitley Mid term Review 8 The Fiducials (chips) Reference system 2. The fiducials for reference system 2 is repeated for every chip (Reference systems 2 through to 17). Should the loaded program fail to find any of the alignment points. Manually align the eye points as shown using the red crosshair.

9 October 2006 Mark Whitley Mid term Review 9 Bond Parameters Welding parameters: US-threshold 1: Bond force 1: US-threshold 2: Bond force 2: Change at: US-channel: Max. deformation: Max. bond time: Positioning parameters: Offshoot: Delay: 110 ms % CN % CN ms A % mm 10 ms Please see bonding document for comprehensive list of parameters


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