1. A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach Dave DeWire RJR Polymers Inc., Oakland, California 510-638-5901 Presented at the ECEN5005 SEMINAR SPONSORED BY IEEE EDS DENVER CHAPTER UNIVERSITY OF COLORADO, ENGINEERING CENTER, ECEE 265 Thursday March 20, 2003 4:00-6:00 PM

2. Who is RJR Polymers, Inc. Headquartered in Oakland California Technology company Worldwide Sales and Engineering force Full service/ solution provider –Electronic Air Cavity Packaging –Pre-Applied adhesives –Air Cavity Lids –Lidding Equipment –Engineered Solutions –Satisfy customer from Prototype to Volume Manufacturing

3. RJR’S Market Mix RF/ Wireless Imaging Medical Military WAN/ LAN/ Broadband Telecom Automotive MEM’s, MOEM’s, sensors, etc.

4. Let’s talk about RF Packaging The Perception of RF Power –Handset ~ 1 watt –Base Station ~ 10 to 200 watts –Broadcast transmitter ~ 1 to 100 kilowatts –Radar – kilowatts to megawatts –For “coverage enhancement” applications it’s usually a few watts Between handset and basestation The essence of RF Packaging –Electrical and environmental performance is a given –Thermal dissipation is the key element –Manage junction temperature –High performance path(s) to the outside world –Robust and Reliable –In this economy - the lowest overall cost while managing the above is the greatest measure of success.

5. Common RF Packaging What types are available to engineers today ? –Metal –Ceramic –LTCC/ Ceramic –Transfer Molded Plastic –No Packaging

6. Package Elements to Consider Cover material Lid seal Sidewall material Lead seal Lead material and finish Base seal Base material and finish Plus the process! Design Assembly

7. The Range of Thermal Conductivities Thermal Conductivity W/mK Some significant new materials in the 25 to 75 W/mK range are emerging. Ex. Diemat epoxies and Cool Polymers

8. Advantages/ Disadvantages Metal Packaging –Advantages Hermetic Thermal Hi Performance Large Cavities –Disadvantages Costly (largely machined) Expensive to assemble Seam Seal/ Laser Weld Not commercially acceptable for many applications Weight

9. Advantages/ Disadvantages Ceramic Packaging –Advantages Hermetic Thermal Die attach up to AuSn Temps Operating temperatures are high –Disadvantages Expensive/ Market price Can be substantial tooling costs Package is inherently costly –Brazing, etc. –Laser Machining, pressing, etc. Poor Lid Seal surface Quality RF feed thru’s are expensive

10. Advantages/ Disadvantages LTCC Ceramic Packaging –Advantages Price Tooling costs Good CTE Multilayering Low loss conductors (Cu, etc.) Integrated passives Miniaturization (small line geometry) –Disadvantages Price vs PCB’s Thermal Higher Dielectric (7.8 > 20GHz)

11. Advantages/ Disadvantages Plastic Packaging –Advantages Price, Price, Price Standard outlines –Infrastructure advantages –Disadvantages Tooling costs Thermal Very Lossy Marginal High Frequency Performance Thermal Non-hermetic No Cavity

12. R-Pak Air Cavity Packages ! Adaptable Technology for a broad range of applications Plastic backed for low power package applications like sensors CCD / CMOS for vision and optical sensor applications with glass covers Thermally enhanced metal backed for microwave and power applications So what’s new ?

13. What is R-Pak ? A process that takes the most of the best elements of traditional packaging formats and combines them into one Works in tandem with the benefits provided with the use of LCP (Liquid Crystal Polymers) Allows the engineer to “Build” a package using all the elements necessary to the device and final product Allows the designer to manage cost

14. Packages are molded around leadframes in a multi-up format cost effective for molding and downstream assembly Plastic formulated to match the CTE of copper for low stress and reliability Leads are coated with moisture resistant polymer before injection molding RJR ITS equipment supports package assembly and sealing The R-Pak Process

15. RJR’s Injection Molded Packages Package Stackup US Pat 6,511,866 Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc) Sidewall with leads Lids with epoxy (pre-applied) RJR formulated epoxy as interstitial layers Plastic alloy formulated to match the CTE of Copper or Copper alloys or Alloy 42 (WCu, CuMo, etc.) Leads are coated with moisture resistant polymer, then injection molded US Pats 5,816,158; 6,214,152 The 3 layers are bonded together using RJR IsoThermal Sealing (ITS) equipment US Pat 5,056,296

16. RJR Plastic Alloy – HTP-1280 R-Pak  Plastic Body Compound This custom thermoplastic compound is used in RJR R-Pak  plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications. –Physical: Density: 1.67 gm/ccASTM D792 Water Absorption0.02% ASTM D570 –Mechanical @ 23C: Tensile Strength21,000 PSIASTM D638 Tensile Modulus2.5 X 106 PSIASTM D638 Elongation @ Break1.2% ASTM D638 Flexural Strength31,000 PSIASTM D790 Flexural Modulus2.4 X 106 PSIASTM D790 IZOD Impact Strength Notched 1.6 ftlb/inASTM D256 –Thermal: Melting Point280  C (536  F)ASTM D3418 DTUL @ 1.8 Mpa (264 PSI)270  C (518  F)ASTM D648 –Electrical: Volume Resistivity1012 ohm-cmASTM D257 Surface Resistivity1017 ohmIEC 93 Dielectric Strength766 V/milASTM D149 Dielectric Constant3.8 @ 1 kHzASTM D150 3.7 @ 100 kHz 3.7 @ 10 MHz Dissipation Factor0.007 @ 100 kHzASTM D150 0.003 @ 10 MHzASTM D150 Arc Resistance165 Sec.ASTM D495 Comparative Tracking Index175 voltsASTM D3638 –Chemical Resistance: Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.

17. Thermally-Enhanced Package Exploded View Package lid with pre-applied adhesive Lid Material: Plastic, Ceramic, Metal, Glass, etc. Injection molded sidewall Shown with moisture resistant seal encapsulating the leads and pre-applied adhesive on bottom surface Wire Bonds Device Solder Preform or Epoxy, etc. Package Base Base Material: Cu, Cu/Mo, Cu/Mo/Cu, WCu, Al2O3, BeO, DBCu, etc. Completed Package

18. Epoxy Sealing Materials Common properties –Minimal moisture transmission –Low ionics –Very low volatiles (outgassing) –Cure in minutes for efficient assembly Lead primer formulation –Adherent to LCP and lead finish –Viscosity supports efficient lead coating process Sealing epoxy –Uniform cover and sidewall coating –Easily B-staged

19. Sealing Equipment - ITS (Isothermal Packaging System) Semiautomatic Custom Designed and Built Plates Controls: Time Pressure Temperature UPH: 600 - 700* 99% + Yield ** Run Rates are Dependant on Package Size and Configuration

20. 1) Package Base Thermally-Enhanced Package Build Process 2) Leadframe with moisture barrier applied 3) Injection mold sidewall over leadframe 4) Nickel and Gold plate leadframe 5) Epoxy coat molded sidewall 6) Perform Die attach to base leadframe 7) Using RJR’s ITS system – attach assembled base leadframe to coated injection molded sidewall 8) Wire Bond device to package 9) Using RJR’s ITS system – seal package lid to molded sidewall 10) Trim, Form and singulate Process Steps RJR Polymers Customer location –or- RJR Location

21. Advantages/ Disadvantages R-Pak Packaging –Advantages Low Cost Prototype tooling cost is low Cost Control High Power High Frequency Near Hermetic Lots of options Less expensive than Ceramic Thermal Flat seal surface Design Flexibility Additional Elements (Partial Matching) –Disadvantages Not classically Hermetic “Near” Hermetic 10 -8 Custom Package Tooling costs (~$60k) Not the “magic bullet”

22. The Partially Matched Plastic Package The RJR partially matched, air cavity plastic microwave power package enables efficient packaging at 5 GHz –integrated matching structures in the package transform very low device impedance to a more friendly higher impedance –metal base provides high power dissipation and eutectic die bonding capability and an excellent ground return –lower cost than ceramic packaging with much more functionality 3.9mm

23. Moisture Resistant –pass JEDEC Level I Moisture Pre-Conditioning Robust –pass –65°C to +150°C temp cycle –Mil-Std 883; Method 1010; Condition C High performance –typically better electrical performance than ceramic Lower cost packages but also –substantially lower tooling costs. –rapid prototyping Some Other Nice Features

24. RELIABILITY TESTING MOISTURE SENSITIVE JEDEC A112A / J-STD-20-A +85°C/85%HR, 168hrs THERMAL SHOCK JEDEC A106A, Condition C. 15cycles, +125°C to -65°C TEST CRITERIA RESULT SO2F SO8 V32 LD2 V48 SOLDER REFLOW JEDEC A112A / J-STD-20-A CONV OVEN MAX. TEMP +220°C WIRE BONDABILITY DIE ATTACHABILITY STABILIZATION BAKE JEDEC A103A TEMP +150°C, 200hrs. PRECONDITIONING JEDEC A113B +85°C/85%HR, 168hrs TEMPERATURE CYCLING JEDEC A104B, Condition B 100 CYCLES, +125°C to -55°C GROSS LEAK JEDEC A109, Condition C1&3 DIE PENETRATION MIL-STD- 883E, Method 1034 INTERNAL VISUAL MIL-STD-883E, Method 2014 PHYSICAL DIMENSIONS JEDEC B100A V52 N= 20 INTERNAL VISUAL MIL-STD-883E, Method 2010.10 & 2017.7 N= 20 WIRE PULL STRENGTH MIL-STD-883E, Method 2011.7 N= 20 PACKAGE COPLANARITY JEDEC B108 20/20 Pass MAX/MIN 10.5g 8.5g 12.1g 8.1g MAX/MIN XX.Xg X.Xg XX.Xg X.Xg 20/20 Pass MAX/MIN XX.Xg X.Xg XX.Xg X.Xg 20/20 Pass INC

25. The R-Pak low cost injection molded packaging process combines the thermal advantages gained by using a eutectic die attach material between die and backplane with a moisture resistant plastic sidewall specifically designed to manage higher frequency and power. Features: Eutectic Die attach Moisture resistant Low CTE CTE matched package Low Dielectric Low Parasitics High Power High Frequency Low Cost ! Package Applications: RF/ Microwave WLAN/ LAN Short Range Wireless MEMS/ MOEMS LDMOS CCD/ CMOS Eutectic Die Attach in an Air Cavity Plastic Package ! In Summary

26. Thank You