1. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Chapter 9 Electronic Systems Reliability © 2012 John Wiley & Sons, Ltd.

2. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.1 Parameter drift.

3. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.2 Temperature vs. reliability for electronic components.

4. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.3 Examples of electronic components. (a) Leadless chip capacitor (b) Quad flat pack IC package (QFP) (courtesy DfR Solutions) (c) Ball grid array (BGA) IC package. (a)(b)(c)

5. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.4 Five stacked die 4GB flash memory (pyramid stacking with wire bond interconnects). Reproduced by permission of DfR Solutions.

6. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.5 Micro-hybrid (Courtesy National Semiconductor Corporation).

7. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.6 Typical failure density functions of electronic components when no component burn-in has been carried out.

8. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.7 Logic device protection. Diode D1 prevents the input voltage from rising above the power supply voltage. Capacitor C1 absorbs high frequency power supply transients. Reproduced by permission of Reliability Analysis Center.

9. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.8 Transistor protection. Resistor R1 limits the base current IB and capacitor C1 absorbs power supply high frequency transients. Reproduced by permission of Reliability Analysis Center.

10. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.9 Temperature–power derating for transistors and diodes (typical).

11. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.10 Digital circuit noise decoupling.

12. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.11 Sneak analysis basic patterns (hardware).

13. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.12 Parameter distributions after selection.

14. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.13 Transpose circuit (from Spence and Soin (1988)).

15. Practical Reliability Engineering, Fifth Edition. Patrick D. T. O’Connor and Andre Kleyner. © 2012 John Wiley & Sons, Ltd. Figure 9.14 Monte Carlo analysis of filter circuit (from Spence and Soin (1988)).