1. The Role of Packaging in Microelectronics
Definition of Microelectronics. Microelectronic Devices, IC Packaging, Purposes of IC Packaging, Semiconductor Roadmap, IC Packaging Challenges,
DMT 243 – Chapter 2
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2. INTEGRATED CIRCUITS (ICs)
The Role of Packaging in Microelectronics
INTEGRATED CIRCUITS (ICs)
Microchips with a transparent window, showing the integrated circuit inside
An integration of many such circuit blocks (discrete components such as transistors, diodes, capacitors, resistors were mounted on the PWB) or components on a single chip
Resulting in miniaturized product became low in cost and high in reliability.
Can be as small as 1mm to 30 mm
also known as IC, microcircuit, microchip, silicon chip, or chip
Integrated circuit of Atmel Diopsis 740 System on Chip showing memory blocks, logic and input/output pads around the periphery
The integrated circuit from an Intel 8742, an 8-bit microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip
DMT 243 – Chapter 2
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3. The Role of Packaging in Microelectronics
Types of ICs
An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board.
ICs are divided into two categories:
Hybrid IC (HIC)
- Contains interconnected diodes, capasitors and resistors fabricated on asingle plastic, ceramics or insulated aluminium substrate.
Has the capability of performing a complete electronic circuit function.
Involves two or more material types.
Semiconductor ICs /Monolithic ICs /Silicon Chip
Contains devices fabricated from semiconductor materials.
DMT 243 – Chapter 2
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4. The Role of Packaging in Microelectronics
IC Evolution
The first IC in the world in the world in the 1960s had only about 10 elements.
Then LSI to VLSI
ULSI/GSI – level of 20 to 100 million transistor per chip.
Now – IC is projected to reach a billion transistor on a single chip (SOC)
DMT 243 – Chapter 2
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5. The Role of Packaging in Microelectronics
IC Evolution
DMT 243 – Chapter 2
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6. The Role of Packaging in Microelectronics
IC Packaging
Integrated circuit packaging is the final stage of semiconductor device fabrication
In the ICs industry it is called packaging and sometimes semiconductor device assembly. Also, sometimes it is called encapsulation or seal (by the name of its last step).
DMT 243 – Chapter 2
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7. The Role of Packaging in Microelectronics
IC Packaging
Most ICs are bonded to small IC packages
- It is possible to attach chips directly to boards. Method used extensively in low-cost consumer electronics. Placing chips in packages enables independent testing of packaged parts, and eases requirements on board pitch and P&P (pick-and-place) equipment.
IC Packages
- inexpensive plastic packages: <200 pins
- packages with >1000 pins available
(e.g. Xilinx FF1704: 1704-ball flip-chip BGA)
• IC Packaging Materials
- Plastic, ceramic, laminates (fiberglass, epoxy resin), metal
DMT 243 – Chapter 2
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8. The Role of Packaging in Microelectronics
IC Packaging
DMT 243 – Chapter 2
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9. 1st-level Interconnect 2nd-level Interconnect
IC Packaging
Chip
Package (Substrate or leadframe)
PCB
1st-level Interconnect
2nd-level Interconnect
Encapsulation
Printed Circuit Board
Substrate
Solder Joint
Leadframe
Au wire
Underfill
Solder Bump
Molding Compound
Pin Thru. Hole
DMT 243 – Chapter 2
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10. IC Packaging Classification
The Role of Packaging in Microelectronics
IC Packaging Classification
IC package categories:
PTH (pin-through-hole)
Pins are inserted into through-holes in the circuit board and soldered in place from the opposite side of the board
» Sockets available
» Manual P&P possible
DMT 243 – Chapter 2
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11. IC Packaging Classification
The Role of Packaging in Microelectronics
IC Packaging Classification
SMT (surface-mount-technology)
SMT packages have leads that are soldered directly to corresponding exposed metal lands on the surface of the circuit board
» Elimination of holes
» Ease of manufacturing (high-speed P&P)
» Components on both sides of the PCB
» Smaller dimensions
» Improved package parasitic components
» Increased circuit-board wiring density
DMT 243 – Chapter 2
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12. The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
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13. The Role of Packaging in Microelectronics
IC Packaging Material
Plastic
– die-bonding and wire-bonding the chip to a metal lead frame
– encapsulation in injection-molded plastic
– inexpensive but high thermal resistance
– Warning: Plastic molds are hygroscopic
» Absorb moisture
Storage in low-humidity environment. Observation of factory floor-life
» Stored moisture can vapourise during rapid heating
can lead to hydrostatic pressure during reflow process. Consequences
can be: Delamination within the package, and package cracking. Early
device failure.
DMT 243 – Chapter 2
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14. The Role of Packaging in Microelectronics
IC Packaging Material
Plastic
Details of a typical plastic package
DMT 243 – Chapter 2
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15. The Role of Packaging in Microelectronics
IC Packaging Material
Ceramic
» consists of several layers of conductors separated by layers of ceramic (Al2O3 “Alumina”)
» chip placed in a cavity and bonded to the conductors
Note: no lead-frame
» metal lid soldered on to the package
» sealed against the environment
» ground layers and direct bypass capacitors possible within a ceramic package
» high permittivity of alumina (εr=10)
Note: High permittivity leads to higher propagation delay!
» expensive
DMT 243 – Chapter 2
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16. The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
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17. The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
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18. The Role of Packaging in Microelectronics
Popular IC Packages
Plastic Dual-In-Line
(PDIP)
PDIP14
SC70
SC70-5
Small Outline
Integrated Circuit
(SOIC)
SO14
Thin Shrink Small Outline
(TSSOP)
TSSOP14
DMT 243 – Chapter 2
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19. The Role of Packaging in Microelectronics
Popular IC Packages
Plastic Lead Chip Carrier (PLCC)
PLCC28
Thin Quad Flat Package
(TQFP)
TQFP32
DMT 243 – Chapter 2
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20. The Role of Packaging in Microelectronics
Popular IC Packages
Small Outline Integrated Circuit (SOIC)
• Available from SO8..SO28
• Gull-wing leads
• Popular, cost effective, and widely available IC package for low-pin-count ICs
• Dimensions: 8.6mm x 3.9mm x 1.75mm
• Pin-to-pin: 1.27mm (50mil)
DMT 243 – Chapter 2
M.Nuzaihan

21. The Role of Packaging in Microelectronics
Popular IC Packages
Thin Shrink Small Outline (TSSOP)
• Available up to TSSOP64
• Popular, cost effective, and widely available IC package for low-profile applications
• Dimensions: 5.0mm x 4.4mm x 1.2mm
• Pin-to-pin: 0.65mm (25mil)
DMT 243 – Chapter 2
M.Nuzaihan

22. The Role of Packaging in Microelectronics
Popular IC Packages
Ball Grid Arrays (BGA)
• Shown: BGA54
• Available pin count >1700
• Advanced IC package for high-density low-profile applications
• Chip-scale package (CSP)
• Dimensions: 8.0mm x 5.5mm x 1.4mm
• Pin-to-pin: 0.8mm
• Low lead inductance
DMT 243 – Chapter 2
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23. DMT 243 – Chapter 2
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24. List of plastic mold package
DMT 243 – Chapter 2
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25. List of Ball Grid Array Packages
List of Ball Tape Carrier Packages
DMT 243 – Chapter 2
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26. Purposes of IC Packaging
The Role of Packaging in Microelectronics
Purposes of IC Packaging
To provide the signal and power distribution of the packaged IC to the systems.
To provide mechanical support and robustness to the fragile IC.
To provide for environmental protection of the IC
To dissipate heat generated by IC chips
To facilitate the packaging and handling of IC chips
DMT 243 – Chapter 2
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27. Requirements for IC Packaging
The Role of Packaging in Microelectronics
Requirements for IC Packaging
Must provide acceptable electrical properties, including capacitance, resistance and inductance.
IC assembly technologies should provide a low cost solution for the electrical interface between the chip and package.
High throughput manufacturing.
High reliability.
Repairability or replaceability where interconnection between IC and package should provide removal of the failed IC.
DMT 243 – Chapter 2
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28. SEMICONDUCTOR ROADMAP
The Role of Packaging in Microelectronics
SEMICONDUCTOR ROADMAP
Updated every 2 years by a group of semiconductor companies known as Semiconductor Industry Association (SIA).
The roadmap is called International Technology for Semiconductors (ITRS).
Three most important parameters for packaging are:
(1) I/O which controls the pitch of the IC package;
(2) Size of the IC which controls the reliability of the IC to package connection;
(3) power which controls heat dissipation properties of IC and system-level packaging.
DMT 243 – Chapter 2
M.Nuzaihan

29. The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
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30. The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
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31. The Role of Packaging in Microelectronics
DMT 243 – Chapter 2
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32. IC Packaging Challenges
The Role of Packaging in Microelectronics
IC Packaging Challenges
Team Work Activity
DMT 243 – Chapter 2
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33. The Role of Packaging in Microelectronics
(NEXT WEEK)
Wafer Back Grinding, Die Preparation, Die Attach, Wire Bonding, Die Overcoat, Molding, Sealing, Marking, DTFS, Lead Finish, Electrical Testing, Tape & Reel, Dry Packing, Boxing and Labeling.
DMT 243 – Chapter 2
M.Nuzaihan