1. Embedded Stackable Board Computer PM Sandy Chen sandy.chen@advantech.com.tw Nov’. 20.2011 MIO-5270 Sales kit MI/O Extension SBC (AMD G-Series)

2. AMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11 2 GbE/ HD Audio/ 4COM/ 2 SATAII/ 6 USB2.0/ Mini-PCIe/ 1 CFast/ MIOe AMD G-Series + AMD A50M, DDR3 1066MHz T40R1.0G SC (5.5W) / T40E 1.0G DC (6.4W) (Fan-less) T56N 1.65G DC (18W) +A50M(4.7W) AMD G-Series + AMD A50M, DDR3 1066MHz T40R1.0G SC (5.5W) / T40E 1.0G DC (6.4W) (Fan-less) T56N 1.65G DC (18W) +A50M(4.7W) Advantech iManager & SUSIaccess Supports Embedded Software API and Utility Win CE, Win7, WinXP, WinXPe, Linux Support Advantech iManager & SUSIaccess Supports Embedded Software API and Utility Win CE, Win7, WinXP, WinXPe, Linux Support Low Power Consumption (kit TDP: 10.5~23W) 12V DC Power input, support DC power hot plug design Extended Temperature Option (-20~80C) Low Power Consumption (kit TDP: 10.5~23W) 12V DC Power input, support DC power hot plug design Extended Temperature Option (-20~80C) 2 GbE/ HD Audio 4 COM/ 6 USB2.0/ 2 SATAII/ GPIO/ SMBUS/ CFast MIOe/ Mini-PCIe Expansion or mSATA 2 GbE/ HD Audio 4 COM/ 6 USB2.0/ 2 SATAII/ GPIO/ SMBUS/ CFast MIOe/ Mini-PCIe Expansion or mSATA 2018/Q3 Longevity 2018/Q3 Longevity DirectX 11, 2D/ 3D/ Motion Video Acceleration Multiple display: 48-bit LVDS, HDMI, VGA Hardware decode (UVD 3):H.264, VC-1 & MPEG2 DirectX 11, 2D/ 3D/ Motion Video Acceleration Multiple display: 48-bit LVDS, HDMI, VGA Hardware decode (UVD 3):H.264, VC-1 & MPEG2 MIO-5270 Compelling Features Available Now! DC Jack 2 x 2 Power

3. MI/O Extension Features

4. MIO-5270 Product SPEC

5. Block Diagram

6. Board Layout – Component Side SATA1 HD & PWR LED FAN DDR3 SODIMM USB 5/6 USB 1/2 DC Power VGA 48 bits LVDS HDMI USB 3/4 GbE1GbE2 SATA2 AMD G-Series RS422/485 Reset Inverter Power Button SATA Power AMD A50M eDP LVDS Power Select (3.3V/ 5V/ 12V) SMBUS

7. Board Layout – Solder side Mini PCIe MIOe Expansion CFast socket Dimension (mm): 146 mm (L)* 102 mm (W) (5.7" x 4.0") Audio COM1/3/4 (RS232) RS422/485 Select COM2 (RS422/485) GPIO

8. Rear I/O Placement Power Connector Type Option DC Jack If need specific power connector type on different SKU, support by request. MIO-5270S-S0A1E MIO-5270D-S0A1E MIO-5270D-S6A1E

9. Thermal Solution

10. . MIO-5270 Advanced Technology AMD G-Series Low Power Consumption Solution  Power Consumption: – T40R 1.0G Single Core: TDP of AMD bundle kit is 10.5 Watts (Value) – T40E 1.0G Dual Core : TDP of AMD bundle kit is 11.4 Watts (Low Power) – T56N 1.65G Dual Core: TDP of AMD bundle kit is 23 Watts (Performance)  Low Idle Power: – Optimized display refresh minimizes DRAM activity, Display refresh doesn’t require chipset activity – UVD 3.0 offloads video decode dramatically reducing CPU loading during video playback Maximum Integrated Graphics Performance!  AMD graphics core with DirectX® 11  Support 48-bit LVDS, HDMI V1.3, VGA (eDP option)  2D/ 3D/ Motion Video acceleration  DVD/ Blu-ray MIOe Expansion with Maximum Flexibility  Unified pin definition including Display, Communication, I/O, Storage, Power interfaces…  MIO-5270 provides the computing & power, customer can choose standard module or design self module to secure domain knowhow.  Efficient schedule with complete solution (MIO-5270 + MIOe module)  Less RD design resource & total cost Support iManager  Enhance system reliability.  Manage onboard devices

11. Design for Ruggedized Solution --- Advantech MIO-5270 MIO-5270 is designed with 100% Solid Capacitors ( 固態電容 )  Wide temperature design and test criteria: Power/ Clock generator/ Sequence  PCB Type: TG-150 as PCB type, much reliable in high temperature environments. Rugged Design on Selected Components  Higher tolerance for high frequencies & high temperature  With better MTBF compared with Electrolytic Capacitors  No more exploding capacitors  More reliable solution if using Solid capacitors than Electrolytic capacitors High ESD Protection for RS-232 I/O Pins to ±15kV  IEC61000-4-2 Air Gap Discharge: ±15kV  IEC61000-4-2 Contact Discharge : ±8kV  Human Body Model: ±15 kV

12. Power Hot Plug Design on MIO-5270 MIO-5270 was designed for single 12V DC in and with Power Hot Plug protection IC design on MIO-5270. The power tolerance range is 12V +/-10%. Based on following operation process, MIO-5270 still can work stable to bootup if the power tolerance range is 12V +/- 10%  Standard power turn on process on normal single board. – Connect SBC + power cable + power supply or DC power module, then turn on the power button as ON.  Not normal power turn on process: – Turn the power button as ON first, then connect SBC + power cable + power supply or DC power module, in such kind of operation the board may with unstable problem (board damage, not bootup…) with unstable surge. DC Power Module DC Adapter Power Supply DC Jack 2x2 right angle power connector

13. AMD G-Series Platform- GPU Architecture

14. AMD G-Series Platform- Direct X11 - DirectX 11 Enables an Amazingly Rich Experience

15. AMD G-Series Platform- Software Support Linux Support

16. Performance Benchmark

17. MIO-5270 Performance_CPU Test with 2GB Memory

18. MIO-5270 Performance_Graphic

19. MIO-5270 Power Consumption

20. Rugged Design on ESBC w/ iManager

21. Page 21 Power Consumption

22. BIOS iManager for ESBC --- Guaranteed Boot up at Extreme Cold iManager Initial System Running Start Bootup OS

23. System Hanged iManager for ESBC --- Voltage Dips & Interrupt Detection & Recovery iManager Initial System Running Voltage Dips System Running Bootup Voltage back to normal range

24. Page 24

25. Target Applications POS/ KIOSK HMI (Human Machine Interface) Transportation Casino Gaming, Pachinko/Slot Machine Medical Feasibility management Digital Signage General Purpose Less effort to get “Flexibility” Fan-less when using heat spreader

26. Order Information Optional Accessories Packing List Embedded OS/ API

28. New Form Factor: MI/O Extension

29. The SPEC on standard SBC can’t be fulfilled if need additional I/O change  Resource: Need redesign PCB to fulfill the SPEC requirement  Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.  Resource: Need redesign PCB to fulfill the SPEC requirement  Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE. The customer needs a board easier for system integration The customer hopes to keep domain knowhow through easier way Time to Market Time to Profit  Less cabling: less problems and cost on assembling.  Concentrated thermal design: make thermal design be easier in customer’s system integration.  Less cabling: less problems and cost on assembling.  Concentrated thermal design: make thermal design be easier in customer’s system integration.  Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.  Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time. Why a New Form Factor – MI/O Extension - Takes New Position between SBC and COM

30. Positioning on Different Solutions MI/O ExtensionSingle Board ComputerComputer On Module Readiness 100% (I/O module only by demand) 100%60~80% (Need bundle carrier board ) Flexibility MiddleLowHigh RD Resource Low ~ Middle (design I/O module if needed) LowHigh (design carrier board) Pricing Middle High Develop Schedule Short ~ MiddleShortLong Dimension 146*102mm 100*72mm 146*102mmQ7, ETX, COM-Express, COM-Ultra... Keep domain knowhow Yes (design I/O module) NoYes (design carrier board) Target customer Only lack few I/O interfaces Sensitive on pricing Tight development schedule With RD ability who can design I/O module. Need single board solution Need wide-range choices Time to Market Complicated SPEC demand With exists COM carrier board With senior RD ability who can design power sequence and I/O functions.

31. MI/O Extension: Multiple I/O Extension MIO/ MIOe Solution from Advantech 100% Done on MI/O Extension  W/ CPU, memory, power, complete I/O and expansion slots  Better thermal design  Requires less cabling Flexibility from MIOe  Secure core knowledge on MIOe modules  Advantech provide MIOe design guide for reference  Unified multiple interfaces & ready for future mainstream interfaces  Power comes from MI/O CPU board instead of MIOe, less design effort, Easy for System Integration  SFF in 146* 102mm on MI/O Extension  Easier system assemblage  Save up to 20% system space  Reduce total cost ownership MIOe MI/O

32. MI/O Extension Mechanical Placement Heat Generating Parts on Component Side  Including CPU, South bridge, memory, power, active IC…  solve the thermal issues on one side Thermal Solution  Larger space for better thermal result..  Reduced tooling fee with minimum CNC rework. Coast Line and DIP connectors  Saves production costs  Right angle DIP connectors (Power) Component Side Expansion Slots on Solder Side  MIOe Expansion  miniPCIe expansion  CF/Cfast card (can take the card away from rear I/O) Hard Disk Placement  Hard disk on solder side prevents thermal issues  Saves system space. SMD Lockable Connectors  Lockable connector type on COM & audio. Solder Side

33. Rear I/O Placement With minimum cabling needed LVDS cable SATA cable COM cable Audio cable LED 2 GbEs HDMI CRT 2USBs DC Power

34. MI/O Extension( Multiple I/O ) New Form Factor Install Hard Disk Install MIOe Install Heat Spreader MIO MI/O Screws MIOe Heat Spreader Hard Disk

35. Flexibility Possibilities MI/O A MI/O B MIOe Module A MIOe Module B MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications Your own MIOe design ! MIOe Module C

36. Unified MIOe for MIO Extension SBC InterfaceNumberFunctions can be DisplayPort1HDMI, LVDS, DVI, CRT or eDP display interface… PCIe x 14Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion… USB 3.0 USB 2.0 1212 Super speed storage, capture card, HD Webcam & display interface… LPC1Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O… HD Audio1Line out, keep flexibility with selected amplifier… SMBus1Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication… VCC (Power)+12V VCC (Power)+5VSB GND Interfaces are considered including most demands from customer and future chipset trends

37. Easy System Integration Minimum Design Effort Secure Core Knowledge Compact Chassis Design Flexibility/ Vertical Market Cost Effective MIO MIO Positioning

38. Contact product manager for any further information Sandy.Chen@advantech.com.tw@advantech.com.tw Thank you!