1. Новые возможности с экосистемой от Freescale Semiconductor
Андрей Абрамов
Генеральный директор Freescale Semiconductor в России 1

2. Freescale Semiconductor
50+ years of innovation
Leadership in growth markets
Broad product & technology portfolio
Deep customer relationships
Flexible manufacturing strategy
Significant R&D investment
Talented, global workforce
Solid financial position 2 2 2 2 2

3. Global leadership in embedded processing and Automotive Industrial
#1 supplier of automotive MCUs including engine management
1 of every 2 new cars powered by Freescale Technology
#1 supplier for body control computers
Leader in safety deployment
Technology behind Ford Sync
Leader in telematics
Shipped 9 Industrial microcontrollers every second in 2008
Freescale introduces smart electricity meters
More than 5 million highly integrated MCUs with embedded RF for new generation of wireless insulin pumps
Networking
Consumer
The leading provider of RF remote control technology
#1 in communications processors having shipped more than 200 million
Nearly 7 of every 10 mobile phone calls are made using Freescale Base Station Products
i.MX processors power top 3 ebooks from Amazon, Sony & iRex
Announced deal with e-ink to develop next generation ebook technology
FSL i.MX processor and power management ICs are in the first smartbook “Sharp Netwalker”
FSL has shipped more than 40 M units of sensor products into the fast growing China cell phone market
Source: iSuppli, Gartner, IDC and company estimates

4. Technology Offerings Across Markets
Automotive
Industrial
Consumer
Networking
Multimedia Processors
Microcontrollers
Communication Processors
Embedded Processors
Control Processors
Wireless Connectivity: Baseband Processing, and RF Transceivers
Sensors
Analog & Power Management
Digital Signal Processor Technologies

5. Investing in Research and Development
More than $800 million investment in research in each of the last three years
Materials
Process technologies
Silicon manufacturing
IP and product development
More than 6,300 patent families 5 5 5 5 5 5

6. MCU Portfolio: Solutions-Focused and Core Agnostic
Built on…
Power Architecture®
Technology
Market-leading performance, reliability and software enablement for automotive and industrial applications.
90nm
MIPS
32-bit
Kinetis
based on ARM®
Cortex™-M4 core
90nm
NEW!
MIPS
Scalable, ultra-low-power product families with bundled software enablement for industrial and consumer applications.
ColdFire
ColdFire+
Application-oriented ultra-low power solutions with optimized enablement, integration and cost for appliance, metering and consumer applications.
NEW!
MIPS
90nm
Digital Signal Controllers
16-bit
Application-oriented solutions for automotive, motor control and power conversion applications.
S12 and S12X
General portfolio positioning
NOTE: Kinetis has been moved above CF/CF+
Scalable cost & power-optimized product families for industrial, automotive and consumer applications.
8-bit
RS08 and S08
Giving customers an ideal solution regardless of architecture preference.

7. Kinetis ARM Cortex-M4 Microcontrollers7

8. First available broad-market MCU samples based on ARM Cortex-M4!
Kinetis MCUs Scalable Mixed-Signal Consumer and Industrial Microcontroller Families
The most scalable portfolio of low-power ARM Cortex-M4 MCUs available today
Innovative Low Power 90nm Thin-Film Storage Flash with FlexMemory
Over 200 hardware and software compatible ARM Cortex-M4 devices with high performance signal processing capability and run currents of <200uA/MHz.
Scalable
FlexMemory
Offers EEPROM capability with unprecedented programming speed and endurance, capable of over 10 Million cycles
One of the most comprehensive ARM® enablement portfolios
Exceptional mixed-signal integration
Mixed
Signal
Enablement
Flexible, High-speed, high-precision 16-bit ADCs, 12-bit DACs, Programmable Gain Amplifiers, Voltage References, and Low Power Touch Sensing lower system costs.
Complimentary Freescale MQX RTOS and Eclipse-based CodeWarrior 10.0 IDE, as well as IAR, KEIL and other ARM ecosystem providers help speed time to market
More than 200 New Parts
7 scalable families
First available broad-market MCU samples based on ARM Cortex-M4! 8 8 8 8

9. TFS Competitive Comparison
Market Need
Other 90nm NVM Technologies
90nm TFS
High area efficiency and reliability
Erase times 50-90% higher than TFS
Floating gate bit cells susceptible to charge loss when subject to even microscopic defects
Very high-density arrays
Unique nanocrystal charge storage technology provides unparalleled redundancy and reliability
Lower stop and run currents
Read, program and erase down to ~2.0V
3x greater run current and 5-10x greater standby currents
Read/program/erase down to 1.71V
<1mA operation at low frequency
EEPROM capability
No integrated EEPROM capability
Off-chip EEPROM has slower erase + write times (5-10 msec)
Off-chip EEPROM has lower endurance
FlexMemory user-configurable as EEPROM and/or program flash
Write time: ~100usec
Erase + write time: 1.5ms
Scalability
Area efficiency limited by cell construction
Excellent area efficiency (low-voltage charge pump for programming)
Array and analog area efficiency allow cost-competitive low- and high-density products with single technology
AREA improvement for TFS vs alternatives specifically:
-    TFS vs 90LC:  15% to 40% smaller, depending on the byte count, while being about 30% faster, having more small sectors, etc.
-    TFS vs 90FL:  60%-70% smaller size, with similar read performance 
-    TFS vs ESF3:  Comparable size at 512K, but TFS-Lo is 40% smaller at 128K.  
The smaller size advantages are at 512K, while the larger advantages are at 128K.  The existing TFS-Lo design was optimized for 128K-256K, otherwise a larger advantage at 512K could be obtained.
TFS is lower power, more area-efficient, more flexible and more scalable 9

10. Traditional Embedded EEPROM Read-while-write with program memory
Freescale FlexMemory vs. Traditional EEPROM
Attribute
Traditional Embedded EEPROM
FlexMemory
Read-while-write with program memory
Yes
Granularity
Byte write/erase
Write time
~1-5msec
(byte write only)
~100usec
(word or byte program, brown-outs w/o loss or corruption of data)
Erase + write time
~5-10 msec
~750 usec + ~750 usec (1.5 msec)
Guaranteed endurance
50-300K cycles (fixed)
SoC implementation and user configurable, can exceed 10M cycles
Minimum write voltage
≥ 2.0V
1.71V
Flexibility
Fixed by part number
Programmable trade-off quantity vs. endurance
Comparison of Flexmemory vs. traditional EEPROM memory
Offers user (one-time) configurable trade off between quantity of available EEPROM and endurance.
Industry leading speed (order of magnitude faster than competition)
Industry leading endurance (up to an order of magnitude greater than the competition).
No user code / management required.
Full read/write down to 1.71V. 10

11. ARM Cortex-M4 Processor Microarchitecture
Backwards compatible with ARM Cortex-M3
New features
Single cycle MAC (Up to 32 x > 64)
DSP extensions
Single Precision Floating Point Unit
Freescale IP and Innovation
On-chip cache for instructions and data
Cross-Bar Switch for concurrent multi-master/slave accessing
On-chip DMA for CPU off-load
Low-leakage Wake-up Unit adds flexibility for low power operation
Architected for Digital Signal Processing
Motor Control - advanced algorithms, longer lifespan, power efficiency
Automation - high calculation and algorithm bandwidth at a low cost
Power management – designed for low/battery powered systems
Audio and Video – 5x performance improvement over software, making batteries last longer
Dotted boxes denote optional blocks
Freescale have an architectural license for the ARM Cortex M4 core – allow us to add our own IP around the core –
Cache – 16KB offered on 120MHz+ devices
Cross-bar switch
DMA – up to 32channels (device dependant)
MPU – our MPU is more robust than ARMs – provides memory protection and task isolation for ALL masters on the cross bar 11 11

12. Kinetis Product Family Features
Availability
144 MAPBGA: Nov 2010
Additional packages: every other month thereafter
MCU Family
Encryption (CAU+RNG)
LCD (Segment/Graphics)
NAND Flash Controller
(120MHz, 150MHz only)
Hardware Tamper Detect
144/256 MAPBGA: Q311
USB OTG (FS & HS)
Ethernet (IEEE 1588)
Floating Point Unit
(120MHz, 150MHz only)
DRAM Controller
(256 pin only)
Dual CAN
<80pin packages: Q4 2011
K70 Family
512KB-1MB, pin
Common System IP
32-bit ARM
Cortex-M4 Core
w/ DSP Instructions
Next Generation
Flash Memory
High Reliability,
Fast Access
FlexMemory w/ EEPROM capability
SRAM
Memory Protection Unit
Low Voltage,
Low Power Multiple Operating Modes,
Clock Gating
(1.71V-3.6V with 5V tolerant I/O)
DMA
-40 to 105C
Common Analog IP
16-bit ADCs
Programmable Gain Amplifiers
12-bit DACs
High-speed Comparators
Low-power Touch Sensing
Common Digital IP
CRC
I2C
SAI (I2S)
UARTs/SPIs
Programmable Delay Block
External Bus Interface
Motor Control Timers
eSDHC
RTC
Development Tools
Bundled IDE
w/ Processor Expert
Bundled OS
USB, TCP/IP, Security
Modular Tower H/ware Development System
Application Software Stacks, Peripheral Drivers & App. Libraries
(Motor Control, HMI, USB)
Broad 3rd party ecosystem
K60 Family
256KB-1MB, pin
K50 Family
KB, pin
K40 Family
64-512KB, pin
K30 Family
64-512KB, pin
NOTE: TO SEE A FULL EXPLANATION OF ALL KEY FEATURES/PERIPHERALS & THEIR ASSOCIATED BENEFITFS FOR EACH FAMILY PLEASE LOOK AT THE BEYOND BITS BROCHURE.
NOTE: small animation to highlight availability of families/devices
K10: baseline
K20: + USB
K30: + Seg. LCD
K40: + USB + Seg LCD
K50: + USB + Seg LCD + Eth + CAU + more analog [medical market – available 2011]
K60: + USB + Eth + CAU + Tamper Detect
K70: + USB + Eth + CAU + Tamper Detect + graphics LCD
NOTE: red circles which indicate peripherals on each family
NOTE: common system/analog/digital IP block columns on the right of the slide show features which are COMMON TO ALL FAMILIES BUT NOT COMMON TO EVERY DEVICE IN THE PORTFOLIO –
e.g. MPU is offered on the K10 family but NOT on every device within the K10 family – only on the high end devices (see family matrix slide to follow)
NOTE: family names (K10/20/30…) indicate amount of peripheral integration but does NOT indicate the amount of memory or pin count
e.g. K10 family spans from 32KB/32pin to 1MB/144pin (we can support customers who want minimum features but large memory footprint)
K20 Family
32KB-1MB, pin
K10 Family
32KB-1MB, pin 12

13. Kinetis Enablement Bundle
Freescale MQX + MCU
+ Tower System
+ CodeWarrior IDE
Free MQX RTOS
MQX Core PSP & BSP +
Modular, expandable and cost-effective development platform for 8/16/32-bit MCUs and MPUs
Rapid eval and prototyping with maximum HW reuse.
Supported by a diverse range of MCU and peripheral plug-in boards and a growing web community
Eclipse environment
Processor Expert code generation wizard
Build, debug and flash tools
Software analysis
Kernel-aware debug
Host platform support
Full-featured, scalable, proven RTOS
Simplifies HW management, streamlines SW development
Reduces development costs while speeding time to market
3 pillars of the FSL enablement offering that supports Kinetis
Comprehensive solution for embedded control and connectivity
Open source hardware platform for prototyping application development
Visual and automated framework to accelerate development time
One-stop-shop for silicon, IDE & RTOS 13 13 13

14. Freescale Bundled MQX RTOS
Free Scalable, fully-featured and proven RTOS with 32-bit MCUs
Full-featured and powerful
BSPs incorporate tightly integrated RTOS, Middleware (USB, TCP/IP stacks), file system, and I/O drivers
Designed for speed and size efficiency
Market proven
Available on Freescale processors for > 15 years
Used in millions of products including Medical and Heavy Industrial applications
Simple and scalable
As small as ~10KB for smallest implementation, or scale up to support sophisticated networking and threading
Intuitive API & modular architecture enables straight-forward fine-tuning of features
Production source code provided
Similar to other “pay-for” software OS
Software integration headache
$95K
of free
Software
Integrated MQX Solution
Why use an RTOS?
Peripherals are more complex ex: RS232  Ethernet, USB
Solution: Full-Featured MQX RTCS, USB, BSP Drivers, 3rd party and more
Customers need an easier way to manage stacks and software
Solution: Real-time operating system manages the time of a MCU/MPU
Features of an RTOS:
Allows multi-tasking, scheduling of the tasks with priorities
Synchronization of the resource access
Inter-task communication
Time predictable
Interrupt handling
Customers need higher quality of code
Solution: Backed by Freescale Global FAE, TIC, AE and software developers
60% of a team’s resources are spent on software
Solution: MQX allows customers to focus on “Special Sauce” instead of stacks,
drivers etc.
32-bit devices require a higher need for re-use  89% of our customers
say they reuse code from a previous project
Solution: An RTOS allows reuse of application on different processors and boards.
Customers face the challenge of reducing costs while speeding time to market
Solution: Freescale provides complimentary MQX RTOS, USB, TCP/IP, MFS
Stable
Upgradable
Easy to maintain 14

15. The Freescale Tower System
MCU/MPU Module:
Tower controller board
Standalone or in Tower System
A modular development platform for 8/16/32-bit MCUs & MPUs
Quickly combine Tower Modules to build a prototype of your application
Modules sold individually or in kits
Open Source: Build your own Tower Module to integrate your IP
Cost-optimized hardware
Software support from Freescale and Third Parties
Growing community of Third Party hardware support
On-line community:
Primary Elevator
Board Connectors
Secondary Elevator
Peripheral Module:
Up to 3 per system: Serial, Memory, LCD,..
Mix & match with different MCU modules
Support for all
Kinetis MCUs!
Rapidly build a prototype of your end application
TWR-MEM
TWR-LCD
TWR-SENSOR-PAK 15

16. www.towersystem.ru Присоединяйся. Общайся. Воплощай.

17. Присоединяйся. Общайся. Воплощай. http://www.towersystem.ru/forum/

18. 32 bit Power Architecture based MPU18

19. 20 Years of Communications Processing Evolution
AIM Alliance
Started 1991 First silicon 1992
PowerPC® 603e
PowerPC®
75X
Dual-core processor
MPC8641D with e600 Power cores
Dual-core with integrated content processing
MPC8572E with e500 Power core
First PowerQUICC® communications processors
Includes Communications Processor Module (CPM)
PowerQUICC III
e500 Power core
MC68302
68K core
1989
1994
1995
1996
1997
1998
2002
2003
2004
2005
2006
2007
2008
Security integration with PowerQUICC line
GPON processor
Integrated
DSP + Power core
QUICC® MC68360
68K core
PowerQUICC II
603e Power core
PowerQUICC II Pro
e300 Power core
QUICC Engine™
Next-gen CPM / dual RISC engines
Power Architecture™ Host Processors
MPC7xxx
e600 core
In Production

20. Freescale – Leader in Embedded Processors
Best performance at a given power for embedded & infrastructure solutions
Continued innovation in hardware architectures
QorIQ Platforms: Broadest scalable family of processors in the market
Evolution from PowerQUICC family
Dual 800 MHz at < 5 Watts
Eight 1.5 GHz/core at 30 Watts
StarCore DSP solutions
Up to 1.0 GHz in 3-6 core configurations with advanced accelerators
Industry leading integration and communication engines
Increasing software investment
Optimized multicore solutions
Hybrid software simulation environment and debug tools
Production-ready software with VortiQa solutions
Fast time to market
Simplified migration to multicore architecture
More flexibility to create a uniquely differentiated product
45nm high-performance technology in production
2-8 Core CPU
QorIQ P4080
PowerQUICC MPC8572
1-2 Core CPU
QorIQ P2020 PowerQUICC MPC837x
4-6 Core DSP
MSC8144 DSP MSC8154 MSC8156 DSP
Service Provider
Enterprise
Consumer Access
Industrial and Aerospace 20

21. How Does Freescale Power Architecture Compare?
More Dhrystone MIPS per MHz:
ARM9 = 1.1 MIPS / MHz
AMCC 405 = 1.4 MIPS/MHz
MIPS 5 Kc = 1.5 MIPS/MHz, 24 Kc = 1.44 MIPS/MHz
AMCC 440 = 1.9 MIPS/MHz
Freescale e300 = 1.9 MIPS/MHz (PQ2, 83xx)
Freescale e500 / e600 = 2.3 MIPS/MHz (85xx, 86xx, QorIQ)
Most scalable integrated processor in the market
Maintain software investment across the entire product line, from low-end consumer products to high-end multicore platforms
More integration
Ethernet, DDR, USB, PCI-Express, SRIO, ATM, HDLC, TDM, SATA, etc.

22. Roadmap: Freescale Processors Built on Power Architecture® Technology
First Generation: 45nm
Next Generation 3x 1x
QorIQ – P5
P5020/P5010
e5500
High Performance
within Embedded
Power Budget of
30W
Higher core frequency
Increasing # of cores
More software friendly architecture, enhanced virtualization support Heterogeneous cores, DSP + Power cores Application accelerators Next process technology
node
QorIQ – P4
P4080/P4040
e500mc
e600 +Soc
Increasing Performance
Performance at
Reasonable Power
Step Function Performance Increase
Decreasing Power
QorIQ – P3
P3041
e500mc
PowerQUICC III
Enhanced Virtualization Support
Value Priced
for Power/Performance
Applications
QorIQ – P2
P2020/P2011
e500v2
PowerQUICC II Pro
QorIQ – P1
P1020/P1021/P1022
e500v2
Power Sensitive
Applications
PowerQUICC II
Increasing Performance
PowerQUICC I
Continuous enhancement of application performance 22 22

23. e5500: QorIQ 64-bit Core Introducing the e5500 core
Next Generation 64-bit core architecture for higher performance, computational intensive applications
64-bit ISA support (Power Architecture v2.06 compliant)
Increased addressable memory space
Scalable up to 2.5 GHz CPU frequency
High performance classic Floating Point Unit (FPU) for industrial applications
Supports IEEE Std. 754™ FPU Double Precision Floating Point
Hybrid 32-bit mode to support legacy software and transition to 64-bit architecture
Register settings allow users to utilize 32-bit mode or 64-bit mode, easing transition to 64-bit architecture
Based on the e500 Architecture with 64-bit ISA
Core frequency up to 2.5 GHz
Up to 64 GB addressable memory space
Supports up to 512KB backside L2 cache
High performance classic FPU

24. Introducing the MPC830x PowerQUICC II Pro Portfolio
The MPC830x portfolio extends the e300 core-based PowerQUICC II Pro architecture
into cost competitive networking and industrial applications
with increased performance per price/power.
MPC8308 – 266 to 400 MHz
Performance/price optimized MPC8308 combines 16/32-bit DDR2 memory controller with ECC, 2 x Gigabit Ethernet, PCI Express, USB and eSDHC targeting smart metering gateways, wireless media gateways, factory automation and test/measurement equipment. In volume production now.
MPC8306/S – 133 to 266 MHz
MPC8306 integrates QUICC Engine, CAN, USB, SDHC and IEEE® 1588 support ideal for industrial control, factory automation and test/measurement equipment
MPC8306S features QUICC Engine (HDLC/TDM, 10/100) and USB targeting networking equipment such as low-end base station line cards and branch access gateways
MPC8309 – 266 to 400 MHz
Richly featured with 16/32-bit DDR2 memory controller with ECC, QUICC Engine, CAN, USB, SDHC, PCI and IEEE® 1588 support for networking, industrial control, factory automation and test/measurement equipment

25. PowerQUICC II Pro MPC830x Processors Feature-compatible with PowerQUICC I, II, III and QorIQ families
QorIQ: P1 & P2 Platforms
PowerQUICC III: MPC85xx products
PowerQUICC II Pro:
MPC83xx products
Decreasing Power
Power Architecture® Cores
PowerQUICC II:
MPC82xx products
MPC8309
PowerQUICC II Pro:
PowerQUICC I:
MPC8xx products
MPC8308
MPC830x portfolio launch at
FTF India and FTF China
MPC8306
MPC8306S
Features / Performance

26. MPC830x Target Applications
Networking/Telecom
Low-end line cards
Femto base station
Customer premises equipment
Wireless LAN access point
Smart Metering
Smart metering gateway
HAN gateway
Industrial
Programmable logic controllers
Process automation controllers
Intelligent I/O
Operator interface terminals
Drives
Bar-code and ID systems
Gateways, bridges and hubs

27. Smart Energy Metering Gateway Demo
Partner with:
Running DLMS/COSEM Client protocol stack
Demo available:
GSM Sales / AE / FAE
DFAE trainings
MPC8308

28.                             
Power Architecture® Technology’s Growing Market Reach - Single Board Computer Partners Subset of a comprehensive partner ecosystem
COM Express
ATCA Blades
AMC
Compact PCI
PMC’s
ATCA
AMC
COM Express
Compact-PCI
VME
PMC’s
ATX,uATX
Freescale
Curtiss Wright
KONTRON
Emerson Network Power
EuroTech
GE Intelligent Platforms
Interphase
Mercury
RadiSys
TQ Embedded                              28 28 28 28

29. Ecosystem Power Architecturetm Architecture Alliance
World Class Alliances Strategic Technology Collaboration
Development and production systems
in standard industry form factors TM
e200 e300 e500 e600
SOC integrated devices
Embedded power budgets
Networking/security IP
Content Aware Packet Processing
Networking life cycles
Architecture
Alliance
Hardware Hardware Partners
Power Architecturetm TM
Applications Secure Networks
Tools/OS Software Partners
Optimize application specific stacks for continual improvement in network security solutions
Value Partners: enable faster time to market and longer time in market 29 29

30. Freescale MSC815x/MSC825x High Performance StarCore DSPs30

31. Recognizing Performance
Proven DSP Leadership
Recognizing Performance
Winning Customers
Freescale SC3850 DSP core earns highest BDTImark2000™ score to date
20+ design Wins at basestation customers in 2009
8 out of the top 10 basestation customers chose Freescale in 2009
Beat out Texas Instruments in all cases.
Freescale StarCore® SC3850 core technology used in the MSC8156 multicore DSP has garnered leading benchmark results from independent signal-processing technology analysis firm, Berkeley Design Technology, Inc. (BDTI)

32. MSC815x/ MSC825x Family – Value Proposition
The industry’s highest performance programmable DSP families, targeted for the Aerospace & Defense, Medical and Test & Measurement markets
Half the Price of Competition
Half Price - MSC8251 is $75 in 1ku volumes vs. Texas Instruments TMS320C at $145.45
40% lower Price - MSC8256 is $ in 1ku volumes vs. Texas Instruments TMS320C at $210.00
2x Performance of Competition
Freescale MSC8256 has 2x higher core performance over closest DSP competitor
Richest and highest performance DSP I/Os accelerating system performance
Fully Scalable and Flexible
Industry’s most scalable and fully programmable DSP family with 1, 2, 4 and 6 core pin compatibility, solving the customer need to scale from a single-core device to a multicore device.

33. Increased Scalability and Flexibility for Robust Product Lines
Single core
fully programmable DSP
Multicore
fully programmable DSP
Aerospace & Defense
Medical
Test & Measurement

34. Target Markets
FSL will have block diagrams of all the above End Equipments on the Freescale Webpage in 2Q10 34

35. Distribution Competition
Main Messages: We are ½ Price of Competitive Solutions with more features Scalable Solution with 1,2,4,6 DSP core pin for pin compatible options 35

36. ARM based Application MCU family i.Mx36

37. i.MX: Leadership in Multimedia
Performance
1 GHz+ ARM processors with optimized architecture
Graphics & video acceleration up to 1080p
Low Power
Advanced power management techniques
Multiple low power modes
Low Cost
Rich connectivity including Ethernet & CAN
Mixed-signal integration
Software & Ecosystem
Open OS support
Reference boards & System on Module solutions
Time to Market
IP re-use
Application portability
Connected Devices
Display Centric
Auto Infotainment
Industrial
Home
Mobile
Enabling a rich user experience with smart processing solutions for the connected world. 37

38. i.MX Solution: Key Attributes
Solution Value
Most Complete Software Solutions
Easiest supplier to work with
Highest level of quality & reliability
Has most value for price
i.MX Support
Regular SDK releases with codecs
Mainline Linux support
Android support
Online information available
Trained FAE and DFAEs
Auto & Industrial tier devices
Product longevity program
Integrated features
Reference platforms

39. General Embedded - Target Markets
Industrial
Feature
Benefit
Integration and Connectivity – Ethernet, CAN, SDIO, DDR2, USB PHY, Camera I/F
Reduced system cost and complexity, greater product feature scalability
LCD Controller and Touchscreen
Can drive high resolution, high color LCD’s for information display and user interaction
Graphics
Hardware accelerated graphics rendering for feature-rich UI
Security
Robust, tamper-resistant devices for secure applications
Industrial qualification and product longevity
Supports the full life of the product in the field
WinCE and Linux BSP’s
Reuse software across i.MX platforms
Optimized performance and power consumption
Fanless automation, increased battery life for portable equipment
HMI (Factory Automation & Building Control)
Medical
Smart Energy Meters
Point Of Sale
Need to review the features/benefits
Secure ePOS Terminals
Data Acquisition (Scanners)
Fixed and Handheld Printers 39 39

40. General Embedded - Target Markets
Consumer
Feature
Benefit
Integration and Connectivity – Ethernet, CAN, SDIO, Touchscreen Controller, DDR2, USB PHY, Camera I/F
Reduced system cost and complexity, greater product feature scalability
LCD Controller and Touchscreen
Can drive high resolution, high color LCD’s for information display and user interaction
Graphics
Hardware accelerated graphics rendering for feature-rich UI
Video Codecs
High resolution video encode/decode in a single-chip solution
Multimedia Codecs
Proven codecs for quicker time to market, included in processor price
Security
Robust, tamper-resistant devices for secure applications
WinCE and Linux BSP’s
Reuse software across i.MX platforms
Optimized performance and power consumption
Increased battery life for portable equipment
Smartbook, MID
Smart Phones
PND
PMP
Home and Office
Need to review the features/benefits
HMI (Appliances, Printers)
Media Phones / VOIP
Portable Medical
Portable Media Players
PC/Audio Accessories 40 40

41. Automotive - Target Markets
Integration– Ethernet, CAN, MLB, USB, SD
Reduce system cost and complexity
LCD Controller and Touch-screen
Provides consumer with a simple to use interface to control the product
Graphics and Video Accelerators
Allows for interactive and appealing rich user experience
Linux and WinCE BSPs and Multimedia Codecs
Proven drivers and codecs enables quicker time to market
Enablement
Strong 3rd party ecosystem
Auto Infrastructure and Culture
Quality Assurance Infrastructure that meets expectations of Tier1s and OEM.
A culture of Zero Defects from product definition, design and test to eliminate field returns
Product Longevity: aligned with the longer design and production lifetime of automotive
Presence with OEM and Tier 1 Suppliers
Recognized as key supplier by automotive leaders – trusted supplier
Audio / Video Connectivity
Navigation
Telematics
Display-based Clusters 41

42. i.MX General Embedded Roadmap
Open VG 1.1
OpenGL ES 2.0
Security
i.MX515
Associated PMIC:
MC13892
1080p Video Decode
720p Video Encode
Cortex A8
OpenGL ES 2.0
OpenVG 1.1
i.MX533
i.MX357
HD720p Video Decode
D1 Video Encode
i.MX513
Cortex A8, 800MHz
DDR2/DDR3 400,
CAN x2, MLB
PATA, SATA 1.5Gbps
Associated PMIC:
MC13783
Open VG 1.1
i.MX353
i.MX31
OpenGL ES 1.1 3D
Cortex A8, 800MHz
Ethernet, DDR2, USB Phy
i.MX512
ARM1136, 532 MHz
Ethernet, DDR2
USB Phy x 2, CAN x 2
i.MX508
ARM11
i.MX31L
ARM1136, 400 MHz
USB (High Speed)
Video Encode VGA
Associated PMIC:
MC13892, TBD
Security
i.MX258
i.MX286+
1588 Ethernet x 2, L2 Switch
i.MX287
Associated PMIC:
MC34704B
i.MX27
Touchscreen
CAN x 2
i.MX257
i.MX283+ CAN x 2
i.MX286
D1 Video Encode
ARM9
i.MX283
i.MX27L
ARM926, 450MHz
Integrated PM
1588 Ethernet
DDR2
USB Phy x 2
LCD
ARM926, 400MHz
Ethernet, mDDR
i.MX253
i.MX233
ARM926, 400MHz
Ethernet, DDR2
USB Phy x 2
ARM926, 450MHz
Touchscreen
Integrated PM, Audio
2009
2010
2011
In Development 42 42

43. i.MX Linux and Windows Embedded CE BSPs
Features
Out-of-the-box integrated Linux/Windows Embedded CE environment – tools + kernel + drivers
Extensively tested, hardened and validated
Optimized for target platforms
Accelerated Codecs support
Common code base across different i.MX SoCs
Packages
Boot loader binaries and source files
Source and patches for kernel and file system
Source code for unit tests of the drivers
Linux Target Image Builder (LTIB) and WinCE standard build system
Proprietary 3rd party components in binary code format
Prebuilt Binaries
Tool chain for ARM9/ARM11/ARM12 (Linux – Open source/Codesourcery, Windows Embedded CE – Microsoft)
BSP Documentation (Reference manual, User’s Guide, release notes) 43 43 43 43 43 43

44. Comprehensive Partner Ecosystem
Evaluation Boards, Systems, Design Services/Houses, Benchmarking
Logic PD, Digi, Icytecture, Phytec, Eurotech, Karo, iWave, Atmark, Kyoto, Cogent, IAR, Adeneo, Bsquare, Intrinsyc, Mentor Graphics, MPC Data, Ruizhi, Shenzhen Morn-Star Technology, Honmax, Foxda, Amax, Perception Digital, Synchromesh, Futuremark, Allgo, Karo
ICE, Compliers, Debuggers, Build Tools
Operating Systems
Adeneo, Express Logic, Green Hills, Mentor Graphics, Micrium, Segger Systems, Quadros, Microsoft, QNX, Wind River, Monta Vista, Timesys, Ubuntu,
ARM, Green Hills, IAR, Kyoto, Lauterbach, Macraigor, Mentor Graphics, Signum, Wind River, Code Sourcery, Microcross, Segger
Middleware
Need to get Timesys logo. Need to verify if any of these others are considered value or free. Should we change the category names?
Logic PD, Digi, Icytecture, Phytec, Eurotech, Karo, iWave, Atmark, Kyoto, Cogent, IAR, Adeneo, Bsquare, Intrinsyc, Mentor Graphics, MPC Data, Synchromesh, Futuremark 44

45. Product Longevity Program45

46. Freescale Offers Product Longevity Program
The embedded market needs long-term product support
Freescale is pleased to introduce a formal product longevity program for the market segments we serve
For the automotive and medical segments, Freescale will make a broad range of program devices available for a minimum of 15 years
For all other market segments in which Freescale participates, Freescale will make a broad range of devices available for a minimum of 10 years
Life cycles begin at the time of launch
A list of participating Freescale products is available at: 46 46

47. Freescale Offers Product Longevity Program47 47 47

48. Семинары «Проектируй с Freescale»
30 ноября 2010 г., Москва
Семинары «Проектируй с Freescale»

49. Технические семинары Что такое Designing with Freescale?
Семинары Designing with Freescale — это тренинги под руководством инструктора, нацеленные на ускоренное обучение инженеров-проектрировщиков разработкам инновационных продуктов c использованием технологий Freescale.
Эти однодневные технические тренинги включают в себя сессии по решениям для
Автомобилестроения
Потребительских приложений
Промышленности
Передовых систем
Сетевых технологий
Заинтересовались?
Зайдите на сайт и зарегистрируйтесь!
Место проведения: Москва, гостиница Holiday Inn Сокольники
ул. Русаковская, д. 24, сбор участников в 8:30

50. Программа семинара 30 ноября 2010 г.
Программа семинара ноября 2010 г.
Вторник
Охотный ряд
Чистые пруды
Красные ворота
8:30 – 9:00
РЕГИСТРАЦИЯ
9:00 – 9:30
ПРИВЕТСТВЕННАЯ РЕЧЬ И ВЫСТАВКА ПАРТНЕРОВ (КРЫМСКИЙ ВАЛ).
9:30 – 10:00
ПРИВЕТСТВЕННЫЙ ЧАЙ И КОФЕ.
10:00 – 11:00
Новое семейство 32-разрядных микроконтроллеров Kinetis на ядре ARM® Cortex™-M4 (лекция + демонстрация).
Высокопроизводительные решения Freescale: процессоры на базе Power Architecture® и цифровые сигнальные процессоры StarCore (лекция).
Разработка приложений с использованием решений Freescale для беспроводной технологии ZigBee® (практикум).
11:00 – 11:15
КОФЕ-БРЕЙК И ВЫСТАВКА ПАРТНЕРОВ.
11:15 – 12:15
12:15 – 13:15
Объективное восприятие мира: датчики Xtrinsic от Freescale (презентация).
Партнерская сессия: компания ENEA.
13:15 – 14:00
14:00 – 15:00
Обзор семейства процессоров i.MX на основе архитектуры ARM® (лекция + демонстрация).
Начинаем работать с процессорами Freescale на базе Power Architecture® (практикум).
Ускоряем создание готового устройства с помощью модульной системы разработки Tower и ОСРВ MQX™(практикум).
15:00 – 16:00
16:00 – 16:15
16:15 – 17:15
Партнерская сессия: компания Microsoft.
Партнерская сессия: компания Mentor Graphics.
17:15 – 19:00
ФОЙЕ: ФУРШЕТ И ВЫСТАВКА ПАРТНЕРОВ.
Легенда
Промышленность
Сетевые технологии

52. Product Portfolio Core Markets Industrial Consumer Automotive
Select Sub-Segments
Industrial
Smart Meters,
Smart Grids
Home Portable
Medical
Appliance
Control
Factory Automation
& Drives
Consumer
Smart Books
eBooks
RF Remote
Controls
Sensors for
Phones & Games
Core Markets
Automotive
Networking
Security
Appliances
Driver
Infotainment
Printers &
Gateways
Chassis
& Safety
Basestations & Controllers
Powertrain & Hybrid
Routers & Switches
Body & Security 52 52 52 52 52

53. Thin Film Storage with FlexMemory Technology
Freescale’s next-generation microcontrollers will offer exceptional low-power capability, performance and flexibility through our 90nm thin film storage (TFS) flash process with FlexMemory technology.
Thin Film Storage: split-gate non-volatile memory
Low power: significantly reduced run and standby currents vs. existing 90nm flash technologies
Scalable: competitive for both low and high density arrays
Reliable: unique nanocrystal technology provides unparalleled reliability
Efficiency: % fewer added masks compared to competing 90nm flash technologies, fast program/erase operations and high area-efficiency
FlexMemory: integrated enhanced EEPROM capability
Robust: extreme high endurance byte write/erase EEPROM with exceptional flexibility and performance
Configurable: user programmable as EEPROM and/or additional flash memory
Easy: seamless EEPROM read/write operations 53 53 53 53 53