1. 英特尔物联网芯片解决方案介绍 A New Generation of Possibilities 刘荣 产品经理
英特尔中国区嵌入式与消费电子事业部

2. Legal Notices and Disclaimers
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3. Legal Notices and Disclaimers, (Cont’d.)
Requires an Intel® HD Audio enabled system. Consult your PC manufacturer for more information. Sound quality will depend on equipment and actual implementation. For more information about Intel HD Audio, refer to Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit: Requires a system with a 64-bit enabled processor, chipset, BIOS and software. Performance will vary depending on the specific hardware and software you use. Consult your PC manufacturer for more information. For more information, visit: Viewing stereo 3D content requires 3D glasses and a 3D-capable display. Physical risk factors may be present when viewing 3D material. No computer system can provide absolute security. Requires an enabled Intel® processor, enabled chipset, firmware, software and may require a subscription with a capable service provider (may not be available in all countries). Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof. Consult your Service Provider for availability and functionality. For more information, visit: . Consult your system manufacturer and/or software vendor for more information. Intel® Smart Connect Technology requires a select Intel® processor, Intel® software and BIOS update, Intel® Wireless adapter, and Internet connectivity. Solid-state memory or drive equivalent may be required. Depending on system configuration, your results may vary. Contact your system manufacturer for more information. The original equipment manufacturer must provide TPM functionality, which requires a TPM-supported BIOS. TPM functionality must be initialized and may not be available in all countries. Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, and virtual machine monitor (VMM). Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit: Intel® vPro™ Technology is sophisticated and requires setup and activation. Availability of features and results will depend upon the setup and configuration of your hardware, software and IT environment. To learn more visit: Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase ENERGY STAR is a system-level energy specification, defined by the Environmental Protection Agency, that relies on all system components, such as processor, chipset, power supply, etc.) For more information, visit: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709A requirements, and the PCB/Substrate meet IEC requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Intel Atom, Celeron, Core, Pentium, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2013 Intel Corporation.

4. 2014 英特尔面向物联网应用的处理器
英特尔® 凌动™ 处理器(代码: Bay Trail) 介绍
英特尔® 夸克处理器介绍

5. 英特尔面向智能系统/物联网推出的低功耗系统芯片(SOCs)
智能系统特定的产品需求
High reliability & availability
Differentiated OSs & environments
Extreme ambience characterization
Differentiated features & functions
面向智能系统的供货周期和 支持
7-year supply
Premier & multi-level support
Usage types
Mobile Embedded
General Embedded
Deeply Embedded
Powered by battery in use
Prominent user interface
PC/Tablet-like usage
Low-moderate up-time
Active power supply in use
PC-like usage
Moderate up-time
Active supply, intermittent battery use
High reliability
Non-PC usage
Usually high up-time
智能系统– 应用特点

6. 新一代英特尔® 凌动™ 处理器 新的 Silvermont 微处理器架构 复杂的嵌入式 SoC芯片 能够覆盖多种应用模式的设计灵活性
45nm
14nm
32nm
22nm
Saltwell
Silvermont
Bonnell
TBA
新的 Silvermont 微处理器架构
复杂的嵌入式 SoC芯片
能够覆盖多种应用模式的设计灵活性

7. 面向智能系统的英特尔® 凌动™ 处理器 E3800 系列 (代码Bay Trail)
工业级温度范围(Tj: -40° to 105 ° C)
0.593mm引脚间距，无需 HDI PCB设计
支持嵌入式软件环境
22nm 领先工艺低功耗系统芯片（SoC）
新一代全高清媒体处理
全高清视频加速能力显著增强
同时处理高达13路1080p30流媒体解码（性能由处理器型号决定）
强大的3D图像处理能力
相比前一代英特尔® 凌动™ 处理器, 性能提升高达5倍
进一步增强API 支持
增强安全特性
Intel® AES New Instructions (Intel® AES-NI) 加速加密运算
安全引导
可靠性和效能进一步提升
支持ECC提高可靠性
优化的处理器架构能够更好的实现QoS

8. *文中涉及的其它名称及商标属于各自所有者资产。
新一代英特尔® 凌动™ 处理器 E3800简介
FCBGA 封装: 25 X 27
芯片高度: 1mm
焊球引脚间距: 0.593mm2
Silvermont 微处理器架构
更高的性能，更低的功耗
最多支持四核
两个64位内存通道
可以配置成带ECC保护的单内存 通道
英特尔® 凌动™ 处理器
64位内
存控制器
特定的硬件加速引擎
带四个EU的图形处理引擎
影像信号处理
音频信号处理
安全特性处理
Silvermont
丰富的
I/O接口
媒体和安
全加速引擎
集成丰富的I/O接口
PCI Express*
SATA
USB 及其它
加快上市步伐 高能效 低成本
*文中涉及的其它名称及商标属于各自所有者资产。

9. 新一代性能提升 计算, 图形处理 高达21倍 Raw 3D 图形处理, 9倍以上3D 图形处理 能耗比性能提升
20X … 6x 5X 4X 3X 2X
高达21倍 Raw 3D 图形处理, 9倍以上3D 图形处理
能耗比性能提升
从PowerVR SGX 升级到英特尔 Gen 图形处理引擎
高达5倍 Raw 3D图形处理, 6倍以上 3D 图形处理
功耗比性能提升
从PowerVR* SGX* 升级到英特尔 Gen 图形处理引擎
高达4倍 Raw CPU 性能 (整数和浮点运算)
高达2倍以上 Raw CPU 性能提升 (整数和浮点运算)
基准: 英特尔® 凌动™ 处理器 D2550 / N2800
基准: 英特尔® 凌动™ E600 系列 2 x1 配置
Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. Results have been Measured by Intel and are provided for informational purposes only.
Any difference in system hardware or software design or configuration may affect actual performance.

10. 选择最佳处理器型号(SKU) Bay Trail-I 系列处理器 Bay Trail-M Bay Trail-D 相关设计驱动元素 英特尔®移动
嵌入式 通常 深度
Bay Trail-I
系列处理器
Bay Trail-M
Bay Trail-D
英特尔®
凌动TM 处理器E3800 系列
英特尔® 赛扬® 处理器 N2930
英特尔® 赛扬® 处理器 J1900
扩展温度范围 (Tjunction : -40°C 到110°C)
ECC 提升可靠性
全功能传统 IO 接口
更好的嵌入式OS/环境支持
面向嵌入式系统的设计原则
工作时间比较长
类似移动电脑的设计，较高的散热设计要求
类似PC的OS/环境支持
设计规格可以扩展到其它类似PC的应用
休眠的时间较长
追求高性能的类似台式机设计
类似PC的OS/环境支持
设计规格可以扩展到其它类似PC的应用
休眠的时间较长
Highly Recommended
Applications may exist
Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

11. 软件支持 Sources for Firmware Delivery
Category
Operating System (targeted for support)
Delivery
Support
Microsoft*
Windows* 8 Non-connected Standby
Intel / Microsoft*
Windows* 7
Windows* Embedded Compact 7
Bsquare*, Adeneo*
Linux*
Tizen* distribution (limited to In-vehicle Infotainment [IVI] customers)
Intel
Android*‡
TBA
Fedora* distribution
Timesys*
Yocto* tool-based embedded Linux* distribution
Yocto Project*
RTOS
Wind River* VxWorks*
Wind River*
Derivative Operating Systems/ Sources
Windows* 7 support enables derivative licenses, e.g. POS7*
Yocto* based Linux* distribution has derivative distribution from Wind River*
Windows* 8 drivers also apply to Windows* 8.1
Sources for Firmware Delivery
American Megatrends* Inc.
Insyde Software*
Phoenix Technologies*
Nanjing Byosoft*
Intel® Firmware Support Package (Intel® FSP)
‡ Android for Intelligent Systems is under planning

12. 从孤立的应用转型为互联的，安全的，可管理的智能系统，从而实现物联网
嵌入式市场应用
从孤立的应用转型为互联的，安全的，可管理的智能系统，从而实现物联网
英特尔凌动处理器E3800系列助力智能系统/物联网应用
新一代高能效微架构
移动嵌入式
便携，电池驱动类型产品
通用嵌入式
类似PC的产品
深度嵌入式
工控及特殊类型产品
差异化的处理器特性/功能
高可靠性，高可用性
Intel Atom E3800 product line is targeted at the Internet of things.
The usages vary significantly - from mundane to complex, from stand alone to connected.
These systems need to managed, need to secured and need versatility.
They have some unique requirements - such as differentiated features, High reliability, Long production cycles, Extreme Ambience to note a few.
At a high-level, based on usage conditions, these solutions can be divided into three categories - General, Mobile and Deeply Embedded.
In the market place you could notice some of these solutions as articulated on this slide.
嵌入式生命周期
数字标牌
多功能打印机
工业控制器
车载信息娱乐
可以实现高度客制化
差异化的操作系统和工作环境支持
安全监控
能源控制
零售业设备 - Point of Sale
军工系统

13. 信息资源 英特尔® 凌动™ 处理器 E3800 产品系列 于2013年10月8日发布 EDC.intel.com 产品主页
ARK.intel.com
Given the short presentation that we had, I am sure there might be many questions. Hence I put together a slide that will get you started with some of the detailed information
方案选择:

14. 英特尔夸克处理器家族 新的英特尔® 处理器家族
英特尔® Quark 处理器内核为英特尔处理器系列中最小的内核
英特尔® Quark SoC X1000 （发布前代码名为Clanton）是该处理器系列中的第一颗产品
低能耗、小内核的英特尔 Quark 处理器产品线将提供高集成的，灵活扩展的产品，助力从设备到云端的数据采集和分析， 推动物联网市场快速增长
Embedded SoC
Embedded μcontroller
Wearable SoC
Innovation Engine
Security Engine
Integrated Sensor Hub

15. 英特尔夸克系列开发板 Dev Kits 夸克芯片 Ref. board Maker/ Edu Kips Bay Galileo
[internal only]
Yocto
Maker/ Edu
Galileo
Yocto (Arduino)
Industrial
Cross Hill
IDP
夸克芯片
Transport
Clanton Hill
IDP
IOT
Quark Moon Island
IDP
Rev SKU
CRB, internal
Dev Kits

16. 英特尔® 夸克系统芯片 X1000 基于英特尔® Quark 处理器低功耗小内核处理器技术推出的第一颗处理器。
32位、单核、单线程、与英特尔® 奔腾® 处 理器指令集架构（ISA）兼容的中央处理器， 运行速度可达400MHz。
目标市场从智能系统到物联网，包括工业自 动化，能源和通信设备等应用。
封装: 15x15mm, FCBGA, 393 引脚， 0.593mm球间距
OS: Linux(Yocto), Wind River Linux 5.0, Wind River VxWorks

17. 英特尔®夸克参考设计 (FFRDs)

18. 英特尔® 伽利略开发板 Galileo Board with Arduino Compatability
Arduino Compatible Interface (For Educators, Students, and Makers)
6 channel A-to-D Converter
1 SPI port (up to 25MHz)
1 UART
1 I2C
14 GPIOs w prog interrupts
6 PWM
Intel® Quark SoC X1000
400 MHz Quark Core
512KB eSRAM, 16KB L1 cache
256MB DDR3-800
10/100Mb Ethernet Port
USB2.0 Device Port
USB2.0 Host Port (EHCI/OHCI)
RS-232 UART Port, 3.5mm jack
PCIe Gen 2 Full Mini-card slot
Micro SD slot, up to 32GB
8MB NVRAM SPI NOR flash chip
SPI programming port
10 pin JTAG
Physical Characteristics
6 Layer Board
10cm x 7cm
Open Source Hardware and Software:
Arduino Software IDE for the Intel® Galileo Quark SoC X1000
Linux firmware pre-installed with
Full open source driver
Full open source tool chain
Open HW Documentation
BOM/Schematic/Board File/
Datasheet
@ Universities Today
For Sale in November

19. 智能交通参考设计板 Comes WITH enclosure battery mPCIe
Transportation Specific Features
Collision and Rollover Detection via on board Accelerometer
Emergency Call Support with Microphone In and Line Out
Driver Call Button
Driver Alarm Button
4.5V to 28V with Battery Backup
Battery Monitor(s)
Certifications for Transportation use, including CE, FCC, PTCRB)
Physical System Characteristics
Board in Enclosure
Intel® Quark X1000 Core
400 MHz Quark Core
ECC Enabled, Secure Boot
512 MB DDR3-800
Vehicle Interface and Network Connectivity
1 High Speed CAN (up to 1Mbps)
1 Fault Tolerant CAN (up to 125 kbps)
6 Ch 12-bit ADC
Wireless Connectivity
PCIe based Wi-Fi
Bluetooth 4.0
Telit HE910 3G Modem with GPS
Wired Connectivity
2 10/100 Ethernet Ports
1 USB2.0 Device Port
3 USB2.0 Host Port
1 RS-232 UART Port
4GB MicroSD
Comes WITH enclosure
battery
Development Kit Content:
Chassis with CRB installed
Linux image pre-installed
Power supply, Accessories
Documentation
Safety & Carrier Certified
Quark X1000 Software Stack
mPCIe

20. 工控/能源应用参考设计板 (a.k.a. Cross Hill)
Physical System Characteristics
4 Layer Board
10cm x 15cm in enclosure
Intel® Quark X1000 Core
400 MHz Quark Core
ECC Enabled
Secure Boot
Wireless Connectivity
Intel® Centrino 6205 Wi-Fi
Telit HE910 3G with GPS
Zigbee (X-bee & Exigen)
Wired Connectivity
4GB MicroSD
2 10/100 Ethernet Ports
1 USB2.0 Device Port
1 USB2.0 Host Port
1 RS-232 UART Port
Industrial /Energy Specific Features
1 GB DDR3-800
8 channel ADC for sensing raw inputs
1 RS-485 port
Option 3 Energy sensor Modules various voltages ranges and configurations
Certifiations (CE, FCC, PTCRB ..)
Comes WITH enclosure
Development Kit Content:
Chassis with CRB installed
Linux image pre-installed
Power supply, Accessories
Documentation
Quark X1000 Software Stack to be downloaded via web site
Safety & Carrier Certified
SW Licenses

21. 英特尔® 夸克时间表
Jan. 13
Feb. 04
Feb. 11
Feb. 18
Feb. 23
Order Status: Quark (Silicon) and Galileo are available to place the order now;

22. 英特尔2014物联网发展蓝图和策略 产品，工具和生态系统 整体解决方案 更多的机会 零售 节能 环保 工业 食品安全 交通 农业 水利
嵌入式板卡厂 商
渠道及分销商
软件合作伙伴
系统集成商
开发者社区
数字安防 通信 交通
开发工具，软件产品，培训
丰富产品，建立完善生态系统
深耕细作，创新改变人民生活
关注国计民生，和中国社会共发展
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