1. Ivan Pogrebnyak Supervisors: Paramonov, Drake, Proudfoot ATLAS, MSU, Argonne Tile week upgrade session June 10, 2015 TileCal requirements for ELMB upgrade

2. TileCal low voltage distribution system 2 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 200V DC from USA15 LVPS +10V ELMB Motherboard ELMB Mini-drawer main board POL Regs Daughter Board Mini-drawer main board POL Regs Daughter Board Mini-drawer main board POL Regs Daughter Board Mini-drawer main board POL Regs Daughter Board https://indico.cern.ch/event/394814/

3. ELMB monitored LVPS values in current implementation 3 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 CurrentsVoltagesTemperatures Brick input ×8 Water ×2 Brick output ×8 Brick ×2 ×8 Brick sense line ×5 Total: 55 values per LVPS https://indico.cern.ch/event/394814/

4. The main issue: Identifying point of failure We'd like to know what type of failure caused a trip −200 VDC from USA15 to LVPS −LVPS internal brick failure −Main board, i.e. brick load, e.g. short circuit Not having to do repairs by trial and error will save a lot of money, time, and effort LVPS is much easier to access then the rest of the drawer −If only the power supply failed, it can be replaced without opening the detector 4 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 https://indico.cern.ch/event/394814/

5. LVPS trip monitoring concept Failure of 200 VDC input from USA15 can be easily identified by simply measuring LVPS input voltage No discriminating information about failure type can be obtained from measuring LVPS output voltage Distinguishing between brick internal failure and a trip caused by the load requires analysis of transient behavior of output current −A short circuit in the load will result in a sharp increase of output current −Other trip types will exhibit decreasing current transient without the initial rise The monitoring device (ELMB) must take multiple measurements during the current transient 5 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 https://indico.cern.ch/event/394814/

6. LVPS trip due to load short circuit A test of transients was done with a +5V MB brick at Argonne Current transients exhibit a characteristic rise to overcurrent value Voltage simply decays with the time constant determined by brick output capacitance 6 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 Current during load short circuitVoltage during a trip https://indico.cern.ch/event/394814/

7. Current ELMB version limitations At Argonne, we considered many options for ELMB upgrade The current ELMB cannot be feasibly improved −No pin compatible faster ADC −Any solution with replacing ADC on the current board will be costly and will reduce reliability −Several ELMB component are no longer produced A new ELMB version must be designed 7 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 ComponentLimitation CS5523CS5523 ADCNominal maximum digitization rate of 600 Hz 32S12C32S12C 32.768 kHz ADC crystalLimits the ADC maximum digitization rate to 101 Hz HCPL0731HCPL0731 optocoupler between the analog and digital stages Limits the ADC maximum digitization rate to 30 Hz https://indico.cern.ch/event/394814/

8. New ELMB requirements Fast sampling rate: 10 kSPS to 1 MSPS In situ failure identification (will require on-board memory) Push notifications to DCS, alarms on failure (trip) Retain independent power 12 bit ADC will be sufficient Radiation tolerance and resistance to SEU should not be a problem with modern small feature size components If the new ELMB will be possible to produce before Phase-II upgrade, CANbus and Mother Board compatibility will be required 8 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 https://indico.cern.ch/event/394814/

9. New ELMB design ELMB++ group already exists, but no development started yet, need sub-detector input References: Stefan Schlenker ( https://indico.cern.ch/event/388112/ ) https://indico.cern.ch/event/388112/ TileCal is currently the only sub-detector actively involved in defining requirements for ELMB++ A lot of room for improvement using modern technology FPGA (instead of microprocessor) based solution is promising g-2 experiment is designing a monitoring system based on ADS8363, a 16-bit 1MSPS 8 parallel channel ADC −Approximately the same size as ELMB −Radiation tolerant 9 Ivan Pogrebnyak. Tile week upgrade session. June 10, 2015 https://indico.cern.ch/event/394814/