1. WIRE BOND PROCESS INTRODUCTION

2. CONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction
Wire Bond Process
Material
SPEC
Calculator
DEFECT

3. 封裝簡介
金線 Gold Wire
晶片Die
導線架
Lead fram

4. 封裝流程 Wafer Saw Die Bonding toaster Wire Bonding Die Surface Coating
Wafer Grinding
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
Solder Ball
Placement
BGA
Singulation
Solder
Plating
Dejunk
TRIM
SURFACE
MOUNTPKG
Dejunk
TRIM
Packing
THROUGH
HOLE PKG
Solder
Plating
TRIM/
FORMING

5. Wire Bond 原理 Gold wire Wedge Bond ( 2nd Bond ) Ball Bond ( 1st Bond )
pad
lead

6. B.PRINCIPLE PRESSURE VIBRATION AL2O3 MOISTURE CONTAMINATION GOLD BALL
GLASS Al
SiO2 Si

7. 銲接條件 HARD WELDING Pressure (Force) Amplify & Frequecy
Welding Time (Bond Time)
Welding Tempature (Heater)
THERMAL BONING
Thermal Compressure
Ultrasonic Energy (Power)

8. Bond Head ASSY Low impact force Real time Bonding Force monitoring
High resolution z-axis position with 2.5 micron per step resolution
Fast contact detection
Suppressed Force vibration
Fast Force response
Fast response voice coil wire clamp

9. X Y Table Linear 3 phase AC Servo motor
High power AC Current Amplifier
DSP based control platform
High X-Y positioning accuracy of +/- 1 mm
Resolution of 0.2 mm

10. W/H ASSY changeover · Fully programmable indexer & tracks
· Motorized window clamp with soft close feature
· Output indexer with leadframe jam protection feature
Tool less conversion window clamps and top plate enables fast device

11. MACHINE SPECIFICATIONS (I)
Eagle
Bonding System
Bonding Method Thermosonic (TS)
BQM Mode Constant Current, Voltage, Power and Normal
(Programmable)
Loop Type Normal, Low, Square & J
XY Resolution 0.2 um
Z Resolution (capillary travelling motion)2.5 um
Fine Pitch Capability 35 mm 0.6 mil wire
No. of Bonding Wires up to 1000
Program Storage 1000 programs on Hard Disk
Multimode Transducer System
Programmable profile, control and vibration modes
MACHINE SPECIFICATIONS (I)

12. MACHINE SPECIFICATIONS (II)
Eagle
MACHINE SPECIFICATIONS (II)
Vision System
Pattern Recognition Time 70 ms / point
Pattern Recognition Accuracy  um
Lead Locator Detection 12 ms / lead
(3 leads/frame)
Lead Locator Accuracy um
Post Bond Inspection First Bond, Second Bond
Wire Tracing
Max. Die Level Different 400 – 500 um
Facilities
Voltage 110 VAC (optional 100/120/200/210/
220/230/240 VAC

13. MACHINE SPECIFICATIONS (III)
Eagle
MACHINE SPECIFICATIONS (III)
Material Handling System
Indexing Speed 200 – “ pitch
Indexer Resolution 1um
Leadframe Position Accuracy + 2 mil
Applicable Leadframe W = 17 – 75 bonding area in Y = 65mm
= 17 – 90 bonding area in Y = 54mm
L = 280 mm [Maximum]
T = – 0.8 mm
Applicable Magazine  W = 100 mm (Maximum)
L = 140 – 300 mm
H = 180 mm (Maximum)
Magazine Pitch  2.4 – 10 mm (0.09” – 0.39 “)
Device Changeover < 4 minutes
Package Changeover < 5 minutes
Number of Buffer Magazine 3 (max. 435 mm)

14. Bonding Process

15. The Wire Bond Temp PREHEAT BONDSITE CU L/F200+/-10 200+/-10
AL L/F210+/ /-10
BGA / /-10
TFBGA150+/ /-10
LBGA / /-10
NOT INCLUDE DEDICATE LINE

16. Free air ball is captured in the chamfer
pad
lead

17. Free air ball is captured in the chamfer
SEARCH HEIGHT
pad
lead

18. Free air ball is captured in the chamfer
SEARCH SPEED1
pad
SEARCH TOL 1
lead

19. Free air ball is captured in the chamfer
SEARCH SPEED1
pad
SEARCH TOL 1
lead

20. Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
pad
lead

21. Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
pad
lead

22. Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
pad
lead

23. Formation of a first bond
SEARCH SPEED1
SEARCH TOL 1
pad
lead

24. Formation of a first bond
IMPACT FORCE
SEARCH SPEED1
SEARCH TOL 1
pad
lead

25. Formation of a first bond Contact
PRESSURE
Ultra
Sonic
Vibration
pad
heat
lead

26. Formation of a first bond Base
PRESSURE
Ultra
Sonic
Vibration
pad
heat
lead

27. Capillary rises to loop height position
pad
lead

28. Capillary rises to loop height position
pad
lead

29. Capillary rises to loop height position
pad
lead

30. Capillary rises to loop height position
pad
lead

31. Capillary rises to loop height position
pad
lead

32. Capillary rises to loop height positionRH
pad
lead

33. Formation of a loop
RD (Reverse Distance)
pad
lead

34. Formation of a loop
pad
lead

35. pad
lead

36. WIRE CLAMP ‘CLOSE’
Calculated
Wire Length
pad
lead

37. Calculated
Wire Length
pad
lead

38. SEARCH DELAY
pad
lead

39. TRAJECTORY
pad
lead

40. TRAJECTORY
pad
lead

41. TRAJECTORY
pad
lead

42. TRAJECTORY
pad
lead

43. TRAJECTORY
pad
lead

44. TRAJECTORY
pad
lead

45. TRAJECTORY
pad
lead

46. TRAJECTORY
pad
lead

47. TRAJECTORY
pad
lead

48. TRAJECTORY
pad
lead

49. 2nd Search Height
Search Speed 2
Search Tol 2
pad
lead

50. Search Speed 2
Search Tol 2
pad
lead

51. Search Speed 2
Search Tol 2
pad
lead

52. Formation of a second bond
pad
heat
lead

53. Formation of a second bond Contact
pad
heat
heat
lead

54. Formation of a second bond Base
pad
heat
heat
lead

55. pad
lead

56. pad
lead

57. pad
lead

58. Tail length
pad
lead

59. pad
lead

60. pad
lead

61. Disconnection of the tail
pad
lead

62. Disconnection of the tail
pad
lead

63. Formation of a new free air ball
pad
lead

64. Material
Leadfram
Capillary
Gold Wire

65. Leadfram (I)

66. Leadfram ( II )

67. CAPILLARY (I) Capillary Manufacturer (SPT, GAISER, PECO, TOTO…)
Capillary Data
( Tip , Hole , CD , FA&OR , IC )

68. CAPILLARY (II)

69. How To Design Your Capillary
CAPILLARY (III)
How To Design Your Capillary
TIP ..…… Pad Pitch
Pad pitch x 1.3 ~ TIP
Hole ..…. .Wire Diameter
Wire diameter + 0.3~0.5 = H
CD………Pad size/open/1st Ball
CD ~ 0.6 = 1st Bond Ball size
FA & OR….Pad pitch(um) FA
> ,4
~90/ ,8,11
< ,15
IC type …… loop type

70. Gold Wire Gold Wire Manufacturer (Nippon , SUMTOMO , TANAKA…. )
Gold Wire Data
( Wire Diameter , Type , )

71. SPEC Pad Open & Bond Pad Pitch Ball Size Ball Thickness Loop height
Wire Pull
Ball short
Crater Test

72. BPO&BPP 單位: um or Mil BPO :是指Pad內層X方向及Y方向的size,一般是取最小值為 我們的data
BPO :是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推;或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPP
Bond Pad Pitch
Bond Pad Open
Bond Pad Open

73. Ball Size & Ball Thickness
單位: um，Mil
量測倍率: 50X
Ball Thickness 計算公式
60 um BPP ≧ 1/2 WD=50%
60 um BPP ≦ 1/2 WD=40%~50%
Ball Size
Ball Thickness
Ball Size

74. Loop Heigh
單位: um，Mil
量測倍率: 20X
Loop Height 線長

75. Wire Pull 1 Lifted Bond (Rejected)
2 Break at neck (Refer wire-pull spec)
3 Break at wire ( Refer wire-pull spec)
4 Break at stitch (Refer stitch-pull spec)
5 Lifted weld (Rejected)

76. Ball Short 單位: gram or g/mil² Ball Shear 計算公式
Intermetallic（IMC）有75%的共晶,SHEAR STRENGTH 標準為＞6.0g/mil²。
SHEAR STRENGTH＝Ball Shear/Area (g/mil²)
Ball Shear = x; Ball Size = y; Area = π(y/2) ²
x/π(y/2) ² = z g/mil²

77. Shear Failure Modes 12 12 (A) Unsheared
(D) Ball bond-bonding pad interface separation (typical Au to Al)
Wire
Full ball attached to wire-except for regions of intermetallic voiding
Bond shoulder
Shearing ram
Ball separated at bonding pad- Ball interface-residual intermetallic (and sometimes portion of unalloyed ball and metal) on pad in bond interaction area
Interfacial contact ball bond weld area
Ball bond
Bonding pad C C h
Ball bond L C C L
Bonding pad
Test specimen
Test specimen
Specimen clamp
Specimen clamp
(B) Wire (ball top and/or side) shear
(E) Bond pad lifts
Shearing ram
Wire
Residual pad on ball ball-pad interface remains intact
Minor fragment of ball attached to wire
Interfacial contact ball bond weld area
Ball sheared too high (off line, etc.)only a portion of shoulder and ball top removed
Pad metallization separates from underlying surface
Ball bond C C C
Bonding pad C L L
Bonding pad
Test specimen
Test specimen
Specimen clamp
Specimen clamp
(C) Below center line shear, ball sheared through (typically Au to Au)
(F) Cratering
Shearing ram
Residual pad and substrate attached to ball,ball-pad interface remains intact
Major portion of ball attached to wire
Bonding pad lifts, taking portion of underlying substrate material with it
Ball bond
Interfacial contact- ball bond weld area intact C C
Ball bond L C C L
Bonding pad
Bonding pad
Test specimen
Test specimen
Specimen clamp
Specimen clamp 12 12

78. Crater Test

79. Calculate (I) (Total Actual Production Times – Total Repair Time )
UP Time =
Total Actual Production Time
Total Repair Time
DOWN TIME RATE=
Total Actual Production Times
Total Operator Actual Repair Time
MTTS (MEAN TIME TO STOP ) =
Total Operator Repair Frequency Stoppages
Total Actual Production Times – Total Operator Repair Time
MTBS (MEAN TIME BETWEEN STOP)=
Total Operator Repair Frequency Stoppages
Total Technical Actual Repair Times
MTTA (MEAN TIME TO ASSISTANCE ) =
Total Technical Repair Frequency Stoppages

80. Calculate (II)
Total Actual Production Times – Total Technican Repair Times
MTBA (Mean Time Between Assistance) =
Total Technical Repair Frequency Stoppages
Total Actual Production Times – Total Technician Repair Time
MTBF(Mean Time Between Failure)=
Total Change Parts Repair Frequency Stoppage
規格寬度
規格上限 - 規格下限
CP ( 製程能力指標) = =
製程寬度
6 σ( 公差)
(上限 or 下限 ) - 平均值
CPK =
三個公差

81. Quality 正常品 Material Problem 1st Bond issue
(Peeling , Ball Lift , Off Center)
2nd Bond issue
(滑針，縫點脫，short tail )
Looping Fail
(wire snake wire，sweep wire
loop base bent )

82. 正常品

83. Material Problem

84. Bonding Ball Inspection
Ball Detection
With Ball
Wire
Pad Size
Missing Ball
Wire Broken

85. Bonding Ball Inspection (cont.)
Ball Measurement
Pad Center
Ball Center
Ball Size
Ball Placement (X,Y)
Ball Off Pad

86. 1st Bond Fail ( I )
Peeling

87. 1st Bond Fail (II)
Ball Lift
Ball Lift

88. 1st Bond Fail ( III )
Neck Crack

89. 1st Bond Fail (IV)
Off Center Ball
Off Center

90. 1st Bond Fail (V)
Smash Ball
Smash Ball

91. Bonding Weld Inspection
Weld Detection
Lead
With Weld
Wire
Capillary Mark
Missing Weld
Wire Broken

92. 2nd Bond Fail ( I ) 滑針

93. 2nd Bond Fail ( II )
縫點脫落
縫點脫落

94. Looping Fail(Wire Short I)
Wire Sweep
Wire Short

95. Looping Fail(Wire Short II)
Loop Base Bend
Wire Short

96. Looping Fail(Wire Short III)
Excessive Loop
Wire Short

97. THE END