Presentation is loading. Please wait.

Presentation is loading. Please wait.

1 Proposal to enhance IC manufacturing curriculum by the addition of poly-silicon growth process development D. W. Parent, EE G. L. Young, ChemE J. Lee,

Published by Modified over 8 years ago

Similar presentations

Presentation on theme: "1 Proposal to enhance IC manufacturing curriculum by the addition of poly-silicon growth process development D. W. Parent, EE G. L. Young, ChemE J. Lee,"— Presentation transcript:

1 1 Proposal to enhance IC manufacturing curriculum by the addition of poly-silicon growth process development D. W. Parent, EE G. L. Young, ChemE J. Lee, ME

2 2 Overview

3 3 Proposal (EE) Create instructional materials that have design manufacture and test –EE122 and EE124. analog leaf cell to design Current mirrors, opamps, amplifiers –EE179 Gate array to design digital parts –EE175, Senior Design Analog mixed signal design use a modified form of Gate array and analog leaf cell.

4 4 Proposal (EE/MatE) EE/MatE129 –Change the process line to self aligned poly-silicon gates We can go from 4 mask steps to three, thus reducing the resources to teach the course and provide a more modern environment for students to learn in. EE/MatE167 –Be able to manufacture the Gate Array/Analog Leaf cell in house. (EE 122/124/175/179 become the customers of the students in EE/MatE167)

5 5 Proposal (EE/MatE) ChemE/MatE166 –Develop a curriculum module around poly- silicon growth in a statistics intensive hands on laboratory course MatE260 –Use poly-silicon growth modules to enhance a lecture course.

6 6 Proposal (ME) ME189 –Develop a simple MEMS process that SPC data can be collected and analyzed. Poly-silicon Beam

7 7 Proposal (Outreach) Develop a simple script for high-school aged visitors with the lab –Explain from Java down to Boolean logic and then to circuit manufacturing. Develop simple hands on IC manufacturing modules for HS students. Partner with MESA to bring in high-school visitors to manufacturing lab.

8 8 Current design facilities Hardware: –500MHz logic Analyzer –40 Sun workstations –280 Sunfire server CAD Software –Cadence Design systems –Synopsys –Silvaco

9 9 Current manufacturing facilities

10 10 Summary Analog-Mixed Signal (AMS) designs are very sensitive to manufacturing variations –Students will learn how to deal with these variations by actually doing design/manufacture and testing of AMS parts. The addition of poly silicon growth will enhance our IC manufacturing curriculum. The addition of poly silicon growth will expand our IC manufacturing curriculum to include MEMS.

Download ppt "1 Proposal to enhance IC manufacturing curriculum by the addition of poly-silicon growth process development D. W. Parent, EE G. L. Young, ChemE J. Lee,"

Similar presentations

Embedded Systems Design: A Unified Hardware/Software Introduction 1 Chapter 10: IC Technology.

Embedded Systems Design: A Unified Hardware/Software Introduction 1 Chapter 10: IC Technology.
COE Labs Objectives and Benefits. General Objectives 1.Students’ training using state-of-the-art facilities through course labs 2.Enable world-class research.

COE Labs Objectives and Benefits. General Objectives 1.Students’ training using state-of-the-art facilities through course labs 2.Enable world-class research.
San Jose State University Department of Electrical Engineering Dec 5th, Fall 2005 EE 166 PROJECT Advisor: Prof. David Parent Group Members Radhika Arora,

San Jose State University Department of Electrical Engineering Dec 5th, Fall 2005 EE 166 PROJECT Advisor: Prof. David Parent Group Members Radhika Arora,
ENGIN112 L38: Programmable Logic December 5, 2003 ENGIN 112 Intro to Electrical and Computer Engineering Lecture 38 Programmable Logic.

ENGIN112 L38: Programmable Logic December 5, 2003 ENGIN 112 Intro to Electrical and Computer Engineering Lecture 38 Programmable Logic.
02/02/20091 Logic devices can be classified into two broad categories Fixed Programmable Programmable Logic Device Introduction Lecture Notes – Lab 2.

02/02/20091 Logic devices can be classified into two broad categories Fixed Programmable Programmable Logic Device Introduction Lecture Notes – Lab 2.
Ribbon Cutting Ceremony Microelectronics Process Engineering Laboratory College of Engineering September 25, 2003.

Ribbon Cutting Ceremony Microelectronics Process Engineering Laboratory College of Engineering September 25, 2003.
Digital Circuit Simulations Deborah Barnett, Tidehaven High School Tidehaven ISD Dr. Peng Li, Assistant Professor (faculty mentor) Department of Electrical.

Digital Circuit Simulations Deborah Barnett, Tidehaven High School Tidehaven ISD Dr. Peng Li, Assistant Professor (faculty mentor) Department of Electrical.
Assignment II Integrated Circuits Design Ping-Hsiu Lee Reagan High School, Houston I. S. D. Deborah Barnett Tidehaven High School, Tidehaven I. S. D. Faculty.

Assignment II Integrated Circuits Design Ping-Hsiu Lee Reagan High School, Houston I. S. D. Deborah Barnett Tidehaven High School, Tidehaven I. S. D. Faculty.
1/31/20081 Logic devices can be classified into two broad categories Fixed Programmable Programmable Logic Device Introduction Lecture Notes – Lab 2.

1/31/20081 Logic devices can be classified into two broad categories Fixed Programmable Programmable Logic Device Introduction Lecture Notes – Lab 2.
Albert C K Choi Department of Industrial and Systems Engineering

Albert C K Choi Department of Industrial and Systems Engineering
The Challenging (and Fun!) World of Computer Engineering Professor Dave Meyer School of Electrical & Computer Engineering Purdue University.

The Challenging (and Fun!) World of Computer Engineering Professor Dave Meyer School of Electrical & Computer Engineering Purdue University.
1 8 Bit Gray Code Converter Rasha Shaba Hala Shaba Kai Homidi Advisor: David Parent DATE 12/06/04.

1 8 Bit Gray Code Converter Rasha Shaba Hala Shaba Kai Homidi Advisor: David Parent DATE 12/06/04.
LabVIEW Design of Digital Integrated Circuits FPGA IC Implantation.

LabVIEW Design of Digital Integrated Circuits FPGA IC Implantation.
CSCE 613 VLSI design is mostly about CAD/EDA tools Many different tools for VLSI design Developed as a new course, independent of previous version Adopt.

CSCE 613 VLSI design is mostly about CAD/EDA tools Many different tools for VLSI design Developed as a new course, independent of previous version Adopt.
1 Analog Leaf Cell (ALC) Group Advisor: Prof. David Parent Taslima Rahman Mariavanessa Pascua Siu Kuen Leung Kuang-Wai (Kenneth) Tseng Scott Echols 12/02/2005.

1 Analog Leaf Cell (ALC) Group Advisor: Prof. David Parent Taslima Rahman Mariavanessa Pascua Siu Kuen Leung Kuang-Wai (Kenneth) Tseng Scott Echols 12/02/2005.
CS 151 Digital Systems Design Lecture 38 Programmable Logic.

CS 151 Digital Systems Design Lecture 38 Programmable Logic.
Digital Circuit Implementation. Wafers and Chips  Integrated circuit (IC) chips are manufactured on silicon wafers  Transistors are placed on the wafers.

Digital Circuit Implementation. Wafers and Chips  Integrated circuit (IC) chips are manufactured on silicon wafers  Transistors are placed on the wafers.
Lecture # 1 ENG6090 – VLSI Design.

Lecture # 1 ENG6090 – VLSI Design.
Guest Lecture by Ben Magstadt CprE 281: Digital Logic.

Guest Lecture by Ben Magstadt CprE 281: Digital Logic.
Electrical and Computer Engineering UAH ASEE Annual Conference Session 1526 An Integrated Facility for Rapid Prototyping Rhonda Kay Gaede, B. Earl Wells.

Electrical and Computer Engineering UAH ASEE Annual Conference Session 1526 An Integrated Facility for Rapid Prototyping Rhonda Kay Gaede, B. Earl Wells.

Similar presentations

Ads by Google