1. Analysis of Thermal Transient Data www.analysistech.com1 Semiconductor Package Synthetic Models Provide: Insight into the thermal performance of various package designs and improvements “Why isn’t the performance of this new package much better than that of the old design?” “Why has the change in die size had such a large effect on package ‘A’ and so little effect on package ‘B’?”

2. Analysis of Thermal Transient Data www.analysistech.com2 Semiconductor Package Synthetic Models Provide: The basis for intelligent selection of alternate package thermal enhancement approaches “Would a heat spreader or heat sink provide greater package enhancement?” “Would a different die attachment provide significant enhancement?”

3. Analysis of Thermal Transient Data www.analysistech.com3 Semiconductor Package Synthetic Models Provide: The basis for estimation of probable results for proposed enhanced package-designs “What is the greatest improvement in thermal performance that can be expected from this new package enhancement?”

4. Analysis of Thermal Transient Data www.analysistech.com4 Semiconductor Package Synthetic Models Provide: Direct simulation of the thermal behavior of devices to non- steady or cyclic powering conditions “What is the thermal impedance of this device for a 50 hertz power waveform?” “What is the peak junction temperature expected during the high-power start-up and initializing cycle?”

5. Analysis of Thermal Transient Data www.analysistech.com5 Mock Empirical Data from Hypothetical Mechanical System

6. Analysis of Thermal Transient Data www.analysistech.com6 Selected Candidate Model for Mechanical System Example Optimal Assignments Based on Response Data: MASS: 0.03 grams SPRING: 10 dynes/cm DAMPER: 0.02 dynes/cm/sec

7. Analysis of Thermal Transient Data www.analysistech.com7 Junction Temperature Step-Response Plotted Using Linear-Time Axis

8. Analysis of Thermal Transient Data www.analysistech.com8 Junction Temperature Step-Response Plotted Using Log-Time Axis

9. Analysis of Thermal Transient Data www.analysistech.com9 Candidate Thermal Model for Semiconductor Packages, Third Order

10. Analysis of Thermal Transient Data www.analysistech.com10 Model Step-Response Expressed as Impedance Versus Log-Time

11. Analysis of Thermal Transient Data www.analysistech.com11 Test Response of Plastic 24 Lead DIP with Overlaid Synthesized Model

12. Analysis of Thermal Transient Data www.analysistech.com12 Test Response of Ceramic 24 Lead DIP with Overlaid Synthesized Model

13. Analysis of Thermal Transient Data www.analysistech.com13 Comparison of Plastic Package vs. Ceramic Package

14. Analysis of Thermal Transient Data www.analysistech.com14 Assumed Segmentation Boundaries

15. Analysis of Thermal Transient Data www.analysistech.com15 Heat Capacity Comparison Estimated Heat Capacities Relative to Synthetic Model Values

16. Analysis of Thermal Transient Data www.analysistech.com16 Test Response of 208 Lead Copper-Slug Package with Overlaid Model (good die attachment, second order model)

17. Analysis of Thermal Transient Data www.analysistech.com17 Conditions Indicative of Model Degeneration: The multiple between two time constants is less than 3 - 4 One constituent resistance or heat capacitance is insignificantly small One time constant is larger than the duration spanned by the test data Solutions for Model Degeneration Reduce the order of the candidate model (number of RC pairs) Expand the test duration

18. Analysis of Thermal Transient Data www.analysistech.com18 Test Response of 208 Lead Copper-Slug Package with Overlaid Model (failed die attachment, third order model)

19. Analysis of Thermal Transient Data www.analysistech.com19 Test Response of 208 Lead Copper-Slug Package with Overlaid Model (failed die attachment, second order model)

20. Analysis of Thermal Transient Data www.analysistech.com20 Comparison of Failed Die Attach to Good Die Attach

21. Analysis of Thermal Transient Data www.analysistech.com21 TO-247 Test Response, Junction-to-Case, Thermocouple Under Tab

22. Analysis of Thermal Transient Data www.analysistech.com22 Junction-to-Case Candidate Model

23. Analysis of Thermal Transient Data www.analysistech.com23 Model Response of Junction & Thermocouple Nodes, Junction-to-Case Model

24. Analysis of Thermal Transient Data www.analysistech.com24 TO-247 Test Response, Junction-to-Case, With Overlaid Synthetic Model (thermocouple on center lead)

25. Analysis of Thermal Transient Data www.analysistech.com25 Junction-to-Case Synthetic Model Overlaid on TO-247 Test Response Data (thermocouple under tab)

26. Analysis of Thermal Transient Data www.analysistech.com26 TO-247 Test Response with Alternate Synthetic Model which Excludes the Bump Anomaly

27. Analysis of Thermal Transient Data www.analysistech.com27 Model Response for Square Waves of Various Periods and Duty Cycles

28. Analysis of Thermal Transient Data www.analysistech.com28 Test Response of Device #1 with Overlaid Model (3 Time Constants, Linear-Log Plot)

29. Analysis of Thermal Transient Data www.analysistech.com29 Test Response of Device #1 with Overlaid Model (3 Time Constants, Log-Log Plot)

30. Analysis of Thermal Transient Data www.analysistech.com30 Test Response of Device #1 with Overlaid Model (4 Time Constants, Linear-Log Plot)

31. Analysis of Thermal Transient Data www.analysistech.com31 Test Response of Device #1 with Overlaid Model (4 Time Constants, Log-Log Plot)

32. Analysis of Thermal Transient Data www.analysistech.com32 Test Response of Device #2 with Overlaid Model (3 Time Constants, Linear-Log Plot)

33. Analysis of Thermal Transient Data www.analysistech.com33 Test Response of Device #2 with Overlaid Model (4 Time Constants, Linear-Log Plot)

34. Analysis of Thermal Transient Data www.analysistech.com34 Test Response of Device #2 with Overlaid Model (4 Time Constants, Log-Log Plot)