1. Optical Leak Testing The next generation of hermetic package testing NorCom Systems Inc Norristown, PA www.NorcomSystemsInc.com

2. Company History Established in 1982 World Leader in NDT, Engineering and Services with Holography and Shearography Delivered over 200 systems to 14 countries Approved by Pratt & Whitney, Boeing Aircraft, Northrop-Grumman, NASA, Lockheed Martin, Raytheon Aircraft Co. FAA Approved Repair Station LT6R187J

3. NDT Instruments, Systems and Services Aerospace Vehicles & Engines Naval Structures Electronics Tires

4. Established in 2000 to: Focus on 4 main areas: fiber optic industry quartz crystal oscillators frequency control devices display devices Develop future products and applications Concentrate on the Micro- and Opto- electronics industry for leak testing hermetically sealed packages.

5. Hermetic Leak Test Methods Helium Mass Spectrometry ( Fine) Radioisotope testing (Fine) Bubble Leak testing (Gross) Dye Penetrant (Gross) (Destructive) Residual Gas Analysis (Destructive) Optical Leak testing (Gross & Fine)

6. Range of Leak Sensitivity (Component Level) Bubble Helium Krypton Optical Leak Test True Leak Rate (deceasing ) Max. Required Sensitivity: 2x10E-8 cc-atm/sec. Mil Std. 883F TM 1014 Gross Leak -6 Fine Leak Only Optical Leak Testing covers the full required test range in one method.

7. Optical Leak Testing Optical Leak Testing is the most accurate, repeatable leak test technology available today for the Semiconductor, Hybrid and Opto-electronics industries. Optical Leak testing provides: 1.Automated, In-line, full matrix leak testing to dramatically improve productivity. 2.Ability to leak test SMC soldered to PCBs. 3.Full range leak test: Gross & Fine Leak

9. Package Pressure Pp Prior to Chamber pressurization internal and external chamber pressure are essentially equal Chamber Pressure Pc Package lid is flat

10. Chamber Pressure Pc Package Pressure Pp As Chamber Pressure (Pc) is applied the package lid is deflected due to the higher relative external package pressure Package lid is deformed and out of plane

11. Chamber Pressure Pc Package Pressure Pp With constant chamber pressure applied to a none leaking package the lid will remain out of plane Package lid is deformed and out of plane

12. Package Pressure Pp With constant chamber pressure applied A gross leaking package will return to the Pre-pressurized plane Chamber Pressure Pc Package lid is flat

13. The NorCom 2020 Optical Leak Test System

14. Hermetic devices are Leak Tested on the same Boat all the way through Manufacturing. Above: parts in boat Right: loaded into Test Cell

15. Lids of leaking devices move. Lids of non-leaking devices do not move during hold- time. With chamber at constant pressure. Digital Holography Lid Deformation Measurement

17. True Leak Rate Measurement Achieved by: 1. Differentiating between lid deflection due to changes in chamber pressure P c (t) and lid deflection due to change in internal package pressure P p (t). 2. Modulating the Helium pressure sinusoidally around the working pressure causes P c (t) and P p (t) to be linearly independent.

18. Example: Mini-DIL OE package Leak rate of 5.6 x 10e-7 cc-atm/sec. measured with Helium Mass spectroscopy, pig tail removed. (Average of 4 runs with an order of magnitude variation in results) Optical leak Test parameters: Chamber working Pressure, Pw = 3.86 atm Test Time, t = 556 seconds Package Volume, V= 0.1cc

19. During the 556 sec test time, the observed lid was exactly that predicted by the model.

20. Internal Package Pressure change, P p was determined to be 3.76 x 10e-2 atm. Using eq. 4, yields a Measured Leak Rate of 2.53x 10e-6 atm-cc/sec, which is then converted to the True Leak Rate by dividing by the Chamber Working Pressure of 3.68 atm. resulting in a leak rate for this Mini-DIL of: 6.88 x 10e-7 cc-atm/sec This compares very favorably with the average leak rate of 5.6 x 10e-7 cc-atm/sec leak rate determined with helium Mass. Spec.

21. Leak Test Applications for the Optical Leak Test Method Board Mounted Components Vacuum Packaged MEMS Devices Helium Absorbing Materials Fiber Optic Pig Tails Optical Surfaces OLED Devices

22. Testing a full matrix of pig tailed butterfly packages.

23. Tray with 10 Hermetic Fiber Optic Devices 0.015 in. Welded Lids Metal Package

24. Automatic Test Analysis with a set Accept/Reject threshold shows 6 leaking and 4 hermetic packages. Test Results

25. Board Level Leak Testing Discrete hermetic devices that pass MIL STD 883E may failure during or after board assembly. These devices, on assembled circuit cards can not be leak tested, except with Optical Leak Testing. Missile circuit module.

26. Launch of Atlas AV-001 August 21, 2002  Booster Remote Control Unit (BRCU) manufactured by for Lockheed Martin Astronautics by BAE SYSTEMS Controls.  Hermetic SMC components cracked during solder operation.  NorCom 2020 was modified to allow leak testing of the circuit card assemblies.  Flight hardware tested, repaired and reverified with NorCom 2020

27. Why is Optical Leak Testing Important? Simultaneous Gross and Fine leak test. Real-time Data provides Process Control for lid sealing. Test Devices intolerant of temperatures above 90ºC. Leak test packages with helium absorbing/emitting materials and features: fiber optic pigtails, ceramics Leak test board mounted and even conformal coated components. Automate leak test operations, reduce cost and improve product reliability. Optical Leak Testing dramatically increases manufacturing productivity and quality by providing in-line, full matrix product testing.

28. NorCom 2020 Optical Leak Testing Applications Optoelectronic Devices Semiconductor Microwave Automotive Hi Rel Hybrids MEMS OLED Displays Board Mounted Surface Mount Devices

29. For More Information Contact: NorCom Systems Inc. 1055 W. Germantown Pike Norristown, PA 19403 Tel. (610) 592-0167 www.NorComSystemsInc.com