1. Direct Plating Neopact Seleo CP Plus

2. Direct Plating Application Guide
Segment
Application / Build-up Technology
Direct Plating Technology
Recommended Process
HDI, MLB
Advanced Materials
(PTFE, BT, High Tg FR4, PI, Ceramic…)
Organo/Pd Colloid
Neopact
Standard & Advanced Materials
(High Tg FR4, halogen free, …)
Conductive Polymer
Seleo CP Plus
MLB, DS
Standard Materials
(Low – mid Tg FR4)

3. Neopact Main Industry Requirements
Reliability
TCT 500 – 1000 cycles
Thermal shock 3 – 9 x 288°C
Functionality
Control systems e.g. engine, braking, climate
Communication / navigation
Entertainment systems
Cost
Costs of raw materials
OEM demands for lower cost
Environment
RoHS / EU regulations
Recycling regulations
Waste water restrictions
Automotive
Industry

4. Neopact Background Conductor Neopact Pd activator type A
Market release more than 18 years ago
Direct metallization process for flex material and MLB production such as back panels for end- market like automotive and industry
High Pd adsorption of conductor on all types of laminates for good conductivity
Conductor Neopact
Pd activator type A
Pd activator type B
400ppm Pd
90ppm Pd
250ppm Pd
Magnification x

5. Neopact Features & Benefits
Tin- free Pd colloidal activation system
Highly versatile, reliable application for different technologies
Suitable for ALL base materials (PTFE / Flex)
Applicable as vertical and horizontal process
Good adhesion of acid copper on surfaces with low roughness
All customer requirements fulfilled
IPC-TM-650
IPC-A-600F
Perfag 3 B
Bosch K8 (Automotive)
MIL P-55110
MIL P D
MIL P-50884
SN 57030

6. Neopact Process Sequence – Vertical Process
Etch Cleaner
Temp
(°C)
Time
(min)
Process Baths 35 2
Etch Cleaner based on SPS or Etch Cleaner Securiganth C 50 5
Conditioner Neopact UX 30
Selector Neopact AB or Securiganth Etch Cleaner 20 1
Pre Dip Neopact
Conductor Neopact 25
1.5
Post Dip Neopact
Conditioner
Selector
Pre Dip
Conductor
Post Dip
Acid Cu Plating

7. Neopact Typical Results – Base Materials
Isola DE117 Tg = 170ºC
DuPont Pyralux AP
Rogers R4350 Tg > 280ºC

8. Neopact Typical Results – BMV
FR4 Ø 4mil depth 65µm
RCC Ø 4mil depth 65µm

9. Neopact References
Horizontal
Vertical
Total
No. of lines 16 28 44
Total capacity m² m² m²
Europe 11 26 37
Japan 2 1 3
China
Taiwan
RoW
Status 03/2010
Neopact is a well established production proven process for several applications and end-user markets

10. Seleo CP Plus

11. Seleo CP Plus – The Plus for your green conscience
What is Seleo CP Plus?
Direct Plating process (alternative to electroless copper) for MLB and HDI manufacturing
Based on a conductive polymer as conductive layer
Very GREEN and short process with only 4 active process steps
Seleo CP Plus – The Plus for your green conscience

12. Why use Seleo CP Plus? Features and Benefits
Environmentally friendly
Very short & simple process
Low chemistry usage per m² cut board
Low generation of waste water
Low consumption of fresh water
No usage of harmful chemicals as e.g. formaldehyde, cyanide
Economical advantages
No dependence on Pd price
Low space requirement
Reduced investment costs
Low running costs (chemistry / fresh water / waste water)
Technical benefits
Selective process with excellent reliability
BMV & direct pattern plating capable
Horizontal & vertical application possible
Robust conductive layer – 2 time holding time possible
Copper particle free production
CN–
HCHO Pd
Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

13. Metallization (E’lytic Cu)
Seleo CP Plus Process Description
Etch Cleaner
Conditioner
Adhesion Promoter
Polyconduct
Metallization (E’lytic Cu)
MnO H+  Mn H2O
MnO2

14. In the conductive layer
Seleo CP Plus A Truly Selective Process
gap
In the conductive layer
Etching
Seleo CP Plus reduces the risk of a gap developing in the conductive layer near to inner layers which can occur if non selective direct plating processes are used which require etching to clean innerlayers (e.g. carbon/graphite and some conductive palladium processes)

15. Horizontal Process Comparison Footprint
E’less Copper
Seleo CP Plus
18.1 m
10.8 m
Etch Cleaner (optional)
Conditioner
Adhesion Promoter
Polyconduct 1 2 3 4 5 6
Cleaner 1 2 3 4 3x 3x
1x + 3x
Etch Cleaner 3x
Pre Dip
Activator 3x
Reducer
Reduced line length
2 less active modules
1 less cascade rinse 3x
E’less Copper
1x + 2x
Calculation Basis: Uniplate Seleo CP (UTS-s, 1.5m/min), Triple Rinses

16. Environmental Benefits Total Chemistry & Water Consumption
Uniplate (UTS-s, 1.5m/min), Triple Rinses
+ 27%
60% less chemistry consumed
28% less fresh water consumed (5.2kg/m²)
- 69%
- 100%
- 31%
- 82%
- 97%
- 90%
- 93%
- 100%
- 100%

17. Uniplate (UTS-s, 1.5m/min), Triple Rinses
Environmental Benefits Total Wastewater Generated Rinses & Active Modules
Uniplate (UTS-s, 1.5m/min), Triple Rinses
+ 34%
- 69%
29% less generated wastewater (5.5kg/m²)
- 12%
- 97%
- 100%
- 75%

18. Solder shock test, up to 9x at 288ºC, passed !
Reliability – SST
Solder Shock Test & ICD Performance
Hole diameter 1.0mm
288°C (acc. IPC-TM-650 # )
No ICDs!
Hole diameter 1.0mm
288°C (ISOLA E-Cu 114)
No ICDs!
Solder shock test, up to 9x at 288ºC, passed !

19. No ICDs! No ICDs! Reliability – TCT
Temperature Cycle Test 1000 cycles & ICD Performance
No ICDs!
No ICDs!
1.0mm ML 2.4mm (ISOLA IS 400)
1000 cycles TCT and soldering
1.0mm ML 1.7mm (Panasonic R1566)
1000 cycles TCT and soldering
Temperature cycle test, up to 1000cycles and soldering, passed !

20. No ICDs! Reliability – IST Interconnect Stress Test & ICD Performance
Post interconnect (power circuit)
No ICDs!
Hole diameter 1.0mm
2000 cycles IST (Shengyi S1000)
Interconnect stress test, up to 2000 cycles, passed !

21. Reliability Seleo CP Plus Summary
Specifications
Base Material
Solder Shock Test (SST)
solder float
9x288°C, 10s
ISOLA E-CU 114, IS 405
6x288°C, 10s
6x228°C, 10s
PI- Flex
3x288°C, 10s
HITACHI CHEMICAL MCL-BE-67G(H)
solder dip
8x288°C, 10s
SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya Anti-CAF R1766G // PANASONIC R1566W
TUC TU662 // ISOLA IS 402 , IS 420
5x288°C, 10s
HITACHI CHEMICAL MCL-BE-67G(H) // PANASONIC R1566W // ISOLA FR-370 Turbo, NELCO N , N4000-6
Temperature Cycle Test (TCT)
-40°C (10’) °C (10’)
200 cycles and 3x reflow as pre-cond.
ISOLA IS402
500 cycles
ISOLA IS402, IS405
1000 cycles and soldering 1x288°C, 10s
ISOLA IS400 // PANASONIC R1566W
-40°C (15’) °C (15’)
Interconnect Stress Test (IST)
800 cycles
3x reflow as pre-cond.
1000 cycles -
2000 cycles
SHENGY SYL-S1000

22. Customer Experiences Horizontal / Panel Plating
16 layers 3.2mm / 0.65mm AR 1:5
6 layers 1.6mm / 0.9mm AR 1:1.8
2.0mm / 0.11mm AR 1:18 8
layers
1.6mm / 0.2mm AR 1:8
4 layers 1.6mm / 1.1mm AR 1:1.5
Seleo CP Plus and smooth leveling down the hole

23. Customer Experiences Horizontal / Full Pattern Plating
6 layers 1.6mm / 0.35mm AR 1:4.6
6 layers 1.6mm/0.7mm AR 1:2.3
10 layers 1.6mm / 0.3mm AR 1:5.3
detail
4 layers 1.6mm / 0.3mm AR 1:5.3
Compatible with Direct Imaging
Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

24. Customer Experiences Horizontal / Mechanical Drilled BV
90µm / 100µm
1.0mm / 1.2mm
400µm / 500µm
90µm / 100µm
300µm / 300µm
250µm / 250µm
Panel & Pattern Plating

25. Customer Experiences Horizontal / Laser Drilled BMV
Large Window
100 / 75 µm m
100 / 75 µm
1.0 / 1.2mm
Inpulse 2HF
2 A/dm
, 10 minutes , 4
100 / 75µm
100 / 75µm
100 / 75 m
m Copper
100 / 75µm

26. Customer Experiences Horizontal Qualification Results
4 layer
6 layer
8 layer
10 layer
1 week, 3 shifts
13380 panels ~1915 p./day
4335 m² ~620 m²/day
12 layer
Thickness:  2.4 mm
Drill dia:  ~4.0 mm
Aspect ratio: 1:10
MLB:  12 layer
Basematerial: Tg 130  Tg 170

27. Customer Experiences Base Material Compatibility
All material tested or produced with standard Seleo CP Plus process parameter

28. Customer Reference Horizontal Lines Seleo CP Plus (1)
Country
End Market
Acid Copper
Conversion/Start Up
/2008
Czech Republic
Prototyping, Industrial/Medical, Defensive
Pattern Plating, Copper Strike
Competitor
/2008
Hungary
Consumer, Communications, Computing
Pattern Plating
Seleo CP
/2009
Italy
Consumer. Industrial/ Medical, IC Packaging, Communications, Automotive
/2009
China
Communications, Automotive
Copper Strike
/2009
Israel
Industrial/ Medical
/2009
Consumer, Communications, Industrial/Medical, Defense/Aerospace, Computing, Automotive
/2009
Germany
/2010
Communications, Computing, Consumer, Automotive
Semi Panel Plating
Compact CP
/2011
Industrial/Medical, Automotive, Defense/Aerospace, Communications, Consumer, IC Packaging
/2011
Spain
Industrial/ Medical, Consumer, Automotive
Seleo CP Rebuilding

29. Customer Reference Horizontal Lines Seleo CP Plus (2)
Country
End Market
Acid Copper
Conversion/Start Up
/2011
Italy
Communications, Computing, Consumer, Automotive
Pattern Plating
New Line / Competitor
/2011
Germany
Industrial/ Medical
Pattern Plating, Copper Strike
New line UTS-XL / Competitor
/2011
Consumer, Communications, Computing, Automotive, Industrial/Medical, Defense/Aerospace
Copper Strike
Seleo CP
/2012
China
Semi Panel Plating
CP Rebuilding
/2012
Communications, Industrial/Medical, Consumer
Competitor
/2012
Brazil
Industrial/Medical, Automotive, Defense
/2013
Compact CP
/2013
India
Automotive, Industrial/Medical
Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

30. Customer Reference Vertical Lines Seleo CP Plus (1)
Country
End Market
Acid Copper
Conversion/Start Up
/2008
Slovakia
Prototyping, Industrial/Medical
Copper Strike
New Line PPT / Competitor UK
Seleo CP
Canada
Industrial/Medical, Consumer, Communications
Pattern Plating
/2011
Brazil
Automotive, Consumer, Computing, Communications
Competitor
/2011
Automotive, Communications, Computing, Industrial/Medical, Aerospace
/2011
Communications, Automotive, Industrial/Medical
/2011
Automotive, Communications, Computing
/2011
Communications, Computing, Industrial/Medical

31. Customer Reference Vertical Lines Seleo CP Plus (2)
Country
End Market
Acid Copper
Conversion/Start Up
/2012
Brazil
Communications, Computing, Industrial
Pattern Plating
Competitor
/2012
/2012
Czech Republic
Industrial
Panel Plating
New Line PPT
/2013
Industrial, Automotive, Computing, Consumer
New Line Competitor
/2013
Automotive, Industrial
/2013

32. OEM Reference

33. Thank you for your attention!
For more information contact :
Jaime Peraza Ordaz
PMM Atotech Europe
Mobile:
Cyril Champion Product Marketing Manager Europe PTH-PP Mobil :
Tobias Sponholz
Global Assistant Product Manager BTT PTH Mobile: +49 (0)