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Proprietary and Confidential Direct Plating Neopact Seleo CP Plus.

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Presentation on theme: "Proprietary and Confidential Direct Plating Neopact Seleo CP Plus."— Presentation transcript:

1 Proprietary and Confidential Direct Plating Neopact Seleo CP Plus

2 Proprietary and Confidential Direct Plating Application Guide Segment Application / Build-up Technology Direct Plating Technology Recommended Process HDI, MLB Advanced Materials (PTFE, BT, High Tg FR4, PI, Ceramic…) Organo/Pd Colloid Neopact Standard & Advanced Materials (High Tg FR4, halogen free, …) Conductive Polymer Seleo CP Plus MLB, DS Standard Materials (Low – mid Tg FR4) Conductive Polymer Seleo CP Plus

3 Proprietary and Confidential Automotive Reliability  TCT 500 – 1000 cycles  Thermal shock 3 – 9 x 288°C Functionality  Control systems e.g. engine, braking, climate  Communication / navigation  Entertainment systems Cost  Costs of raw materials  OEM demands for lower cost Environment  RoHS / EU regulations  Recycling regulations  Waste water restrictions Industry Neopact Main Industry Requirements

4 Proprietary and Confidential Neopact Background Market release more than 18 years ago Direct metallization process for flex material and MLB production such as back panels for end- market like automotive and industry High Pd adsorption of conductor on all types of laminates for good conductivity Conductor NeopactPd activator type APd activator type B 400ppm Pd90ppm Pd 250ppm Pd Magnification x

5 Proprietary and Confidential Neopact Features & Benefits Tin- free Pd colloidal activation system Highly versatile, reliable application for different technologies Suitable for ALL base materials (PTFE / Flex) Applicable as vertical and horizontal process Good adhesion of acid copper on surfaces with low roughness All customer requirements fulfilled IPC-TM-650 IPC-A-600F Perfag 3 B Bosch K8 (Automotive) MIL P MIL P D MIL P SN 57030

6 Proprietary and Confidential Temp(°C)Time(min) Process Baths 352 Etch Cleaner based on SPS or Etch Cleaner Securiganth C 505Conditioner Neopact UX 302 Selector Neopact AB or Securiganth Etch Cleaner 201Pre Dip Neopact 505Conductor Neopact 251.5Post Dip Neopact Etch Cleaner Conditioner Selector Pre Dip Conductor Post Dip Acid Cu Plating Neopact Process Sequence – Vertical Process

7 Proprietary and Confidential PIC 170 DuPont Pyralux AP Rogers R4350 Tg > 280ºC Isola DE117 Tg = 170ºC Neopact Typical Results – Base Materials

8 Proprietary and Confidential FR4 Ø 4mil depth 65µm RCC Ø 4mil depth 65µm Neopact Typical Results – BMV

9 Proprietary and Confidential HorizontalVerticalTotal No. of lines Total capacity m² m² m² Europe Japan213 China202 Taiwan101 RoW000 Neopact is a well established production proven process for several applications and end-user markets Status 03/2010 Neopact References

10 Proprietary and Confidential Seleo CP Plus

11 Proprietary and Confidential Direct Plating process (alternative to electroless copper) for MLB and HDI manufacturing Based on a conductive polymer as conductive layer Very GREEN and short process with only 4 active process steps Seleo CP Plus – The Plus for your green conscience What is Seleo CP Plus?

12 Proprietary and Confidential Environmentally friendly  Very short & simple process  Low chemistry usage per m² cut board  Low generation of waste water  Low consumption of fresh water  No usage of harmful chemicals as e.g. formaldehyde, cyanide Economical advantages  No dependence on Pd price  Low space requirement  Reduced investment costs  Low running costs (chemistry / fresh water / waste water) Technical benefits  Selective process with excellent reliability  BMV & direct pattern plating capable  Horizontal & vertical application possible  Robust conductive layer – 2 time holding time possible  Copper particle free production Pd CN – HCHO Why use Seleo CP Plus? Features and Benefits Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

13 Proprietary and Confidential Etch Cleaner Adhesion Promoter Conditioner Polyconduct Metallization (E’lytic Cu) MnO H +  + Mn H 2 O MnO 2 Seleo CP Plus Process Description

14 Proprietary and Confidential Seleo CP Plus reduces the risk of a gap developing in the conductive layer near to inner layers which can occur if non selective direct plating processes are used which require etching to clean innerlayers (e.g. carbon/graphite and some conductive palladium processes) Etching gap In the conductive layer Seleo CP Plus A Truly Selective Process

15 Proprietary and Confidential Calculation Basis: Uniplate Seleo CP (UTS-s, 1.5m/min), Triple Rinses 18.1 m 10.8 m E’less Copper Etch Cleaner (optional) Conditioner Adhesion Promoter Polyconduct Cleaner EtchCleaner Etch Cleaner Pre Dip Activator Reducer E’less Copper Seleo CP Plus 3x 1x + 2x 3x x + 3x 3x Reduced line length 2 less active modules 1 less cascade rinse Horizontal Process Comparison Footprint

16 Proprietary and Confidential Environmental Benefits Total Chemistry & Water Consumption Uniplate (UTS-s, 1.5m/min), Triple Rinses 60% less chemistry consumed 28% less fresh water consumed (5.2kg/m²) - 69%- 100% - 31% - 82% - 97% - 90% + 27% - 100% - 93%

17 Proprietary and Confidential Environmental Benefits Total Wastewater Generated Rinses & Active Modules Uniplate (UTS-s, 1.5m/min), Triple Rinses - 75% - 69% - 12%- 97%- 100% + 34% 29% less generated wastewater (5.5kg/m²)

18 Proprietary and Confidential Reliability – SST Solder shock test, up to 9x at 288 º C, passed ! Solder Shock Test & ICD Performance Hole diameter 1.0mm 288°C (ISOLA E-Cu 114) Hole diameter 1.0mm 288°C (acc. IPC-TM-650 # )

19 Proprietary and Confidential Reliability – TCT Ø1.0mm ML 1.7mm (Panasonic R1566) 1000 cycles TCT and soldering Ø1.0mm ML 2.4mm (ISOLA IS 400) 1000 cycles TCT and soldering Temperature Cycle Test 1000 cycles & ICD Performance Temperature cycle test, up to 1000cycles and soldering, passed !

20 Proprietary and Confidential Reliability – IST Interconnect stress test, up to 2000 cycles, passed ! Interconnect Stress Test & ICD Performance Post interconnect (power circuit) Hole diameter 1.0mm 2000 cycles IST (Shengyi S1000)

21 Proprietary and Confidential Reliability Seleo CP Plus Summary SpecificationsBase Material Solder Shock Test (SST) solder float 9x288°C, 10s ISOLA E-CU 114, IS 405 6x288°C, 10s ISOLA E-CU 114, IS 405 6x228°C, 10s PI- Flex 3x288°C, 10s HITACHI CHEMICAL MCL-BE-67G(H) solder dip 8x288°C, 10s SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya Anti- CAF R1766G // PANASONIC R1566W 6x288°C, 10s TUC TU662 // ISOLA IS 402, IS 420 5x288°C, 10s HITACHI CHEMICAL MCL-BE-67G(H) // PANASONIC R1566W // ISOLA FR-370 Turbo, NELCO N , N Temperature Cycle Test (TCT) -40°C (10’) °C (10’) 200 cycles and 3x reflow as pre-cond. ISOLA IS cycles ISOLA IS402, IS cycles and soldering 1x288°C, 10s ISOLA IS400 // PANASONIC R1566W -40°C (15’) °C (15’) 500 cycles SHENGY SYL-S1000, SYL-1141KF, SYL-1170 // MICA-HR01, HR33, 22B, 22B5, HR02 // HITACHI CHEMICAL MCL-BE-67G // Nan Ya Anti- CAF R1766G // PANASONIC R1566W Interconnect Stress Test (IST) 800 cycles3x reflow as pre-cond. ISOLA IS cycles- ISOLA IS cycles- SHENGY SYL-S1000

22 Proprietary and Confidential Customer Experiences Horizontal / Panel Plating 16 layers 3.2mm / 0.65mm AR 1:5 6 layers 1.6mm / 0.9mm AR 1: mm / 0.11mm AR 1:18 layers 8 1.6mm / 0.2mm AR 1:8 Seleo CP Plus and smooth leveling down the hole 4 layers 1.6mm / 1.1mm AR 1:1.5

23 Proprietary and Confidential Customer Experiences Horizontal / Full Pattern Plating Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO 6 layers 1.6mm / 0.35mm AR 1:4.6 6 layers 1.6mm/0.7mm AR 1: layers 1.6mm / 0.3mm AR 1:5.3 detail 4 layers 1.6mm / 0.3mm AR 1:5.3 Compatible with Direct Imaging

24 Proprietary and Confidential Customer Experiences Horizontal / Mechanical Drilled BV µ 250µm / 250µm 400µm / 500µm 1.0mm / 1.2mm 90µm / 100µm 300µm / 300µm Panel & Pattern Plating

25 Proprietary and Confidential Customer Experiences Horizontal / Laser Drilled BMV Large Window 2 A/dm², 10 minutes, 4µm Copper 100 / 75 µm µm 1.0 / 1.2mm 100 / 75µm 100 / 75 µm Inpulse 2HF 100 / 75µm

26 Proprietary and Confidential Customer Experiences Horizontal Qualification Results 4 layer 6 layer 8 layer 10 layer 12 layer 1 week, 3 shifts panels ~1915 p./day 4335 m² ~620 m²/day Thickness: 1.0  2.4 mm Drill dia: 0.25  ~4.0 mm Aspect ratio: 1:10 MLB: 2  12 layer Basematerial: Tg 130  Tg 170

27 Proprietary and Confidential Customer Experiences Base Material Compatibility All material tested or produced with standard Seleo CP Plus process parameter

28 Proprietary and Confidential Customer Reference Horizontal Lines Seleo CP Plus (1) CustomerCountryEnd MarketAcid CopperConversion/Start Up 1 04/2008 Czech Republic Prototyping, Industrial/Medical, Defensive Pattern Plating, Copper Strike Competitor 2 07/2008 Hungary Consumer, Communications, Computing Pattern PlatingSeleo CP 3 04/2009 Italy Consumer. Industrial/ Medical, IC Packaging, Communications, Automotive Pattern PlatingCompetitor 4 04/2009 China Communications, Automotive Copper StrikeSeleo CP 5 05/2009 Israel Industrial/ Medical Pattern Plating, Copper Strike Seleo CP 6 05/2009 Italy Consumer, Communications, Industrial/Medical, Defense/Aerospace, Computing, Automotive Copper StrikeCompetitor 7 06/2009 Germany Industrial/ Medical Pattern PlatingCompetitor 8 10/2010 China Communications, Computing, Consumer, Automotive Semi Panel Plating Compact CP 9 03/2011 Italy Industrial/Medical, Automotive, Defense/Aerospace, Communications, Consumer, IC Packaging Copper StrikeCompact CP 10 04/2011 Spain Industrial/ Medical, Consumer, Automotive Pattern PlatingSeleo CP Rebuilding

29 Proprietary and Confidential Customer Reference Horizontal Lines Seleo CP Plus (2) CustomerCountryEnd MarketAcid CopperConversion/Start Up 11 09/2011 Italy Communications, Computing, Consumer, Automotive Pattern PlatingNew Line / Competitor 12 10/2011 Germany Industrial/ Medical Pattern Plating, Copper Strike New line UTS-XL / Competitor 13 11/2011 Germany Consumer, Communications, Computing, Automotive, Industrial/Medical, Defense/Aerospace Copper StrikeSeleo CP 14 03/2012 China Communications, Computing, Consumer, Automotive Semi Panel Plating CP Rebuilding 15 07/2012 Italy Communications, Industrial/Medical, Consumer Pattern PlatingCompetitor 16 09/2012 Brazil Industrial/Medical, Automotive, Defense Pattern PlatingNew Line / Competitor 17 03/2013 China Communications, Computing, Consumer, Automotive Semi Panel Plating Compact CP 18 03/2013 India Automotive, Industrial/Medical Copper StrikeSeleo CP Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

30 Proprietary and Confidential Customer Reference Vertical Lines Seleo CP Plus (1) CustomerCountryEnd MarketAcid CopperConversion/Start Up 1 06/2008 Slovakia Prototyping, Industrial/Medical Copper StrikeNew Line PPT / Competitor UK Prototyping, Industrial/Medical Copper StrikeSeleo CP Canada Industrial/Medical, Consumer, Communications Pattern PlatingSeleo CP Canada Industrial/Medical, Consumer, Communications Pattern PlatingSeleo CP Canada Industrial/Medical, Consumer, Communications Pattern PlatingSeleo CP 6 02/2011 Brazil Automotive, Consumer, Computing, Communications Pattern PlatingCompetitor 7 04/2011 Brazil Automotive, Communications, Computing, Industrial/Medical, Aerospace Pattern PlatingCompetitor 8 04/2011 Brazil Communications, Automotive, Industrial/Medical Pattern PlatingCompetitor 9 10/2011 Brazil Automotive, Communications, Computing Pattern PlatingCompetitor 10 11/2011 Brazil Communications, Computing, Industrial/Medical Pattern PlatingCompetitor

31 Proprietary and Confidential Customer Reference Vertical Lines Seleo CP Plus (2) CustomerCountryEnd MarketAcid CopperConversion/Start Up 11 03/2012 Brazil Communications, Computing, Industrial Pattern PlatingCompetitor 12 03/2012 Brazil Communications, Computing, Industrial Pattern PlatingCompetitor 13 11/2012 Czech Republic Industrial Panel PlatingNew Line PPT 14 01/2013 Brazil Industrial, Automotive, Computing, Consumer Pattern Plating New Line Competitor 15 02/2013 Brazil Automotive, Industrial Pattern PlatingCompetitor 16 02/2013 Brazil Industrial, Automotive, Computing, Consumer Pattern PlatingCompetitor

32 Proprietary and Confidential OEM Reference

33 Thank you for your attention! F or more information contact : Jaime Peraza Ordaz PMM Atotech Europe Mobile: Tobias Sponholz Global Assistant Product Manager BTT PTH Mobile: +49 (0) Cyril Champion Product Marketing Manager Europe PTH-PP Mobil :


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