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Z x 725 Sensor Mark 140 x 140 17800 59800 Sensor Coordinates Bump Bond Pad Ø = 12/18 145 2595 FE PAD#2 110 x 210 LM Structure FE Chip Coordinates Bump.

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Presentation on theme: "Z x 725 Sensor Mark 140 x 140 17800 59800 Sensor Coordinates Bump Bond Pad Ø = 12/18 145 2595 FE PAD#2 110 x 210 LM Structure FE Chip Coordinates Bump."— Presentation transcript:

1 z x 725 Sensor Mark 140 x Sensor Coordinates Bump Bond Pad Ø = 12/ FE PAD#2 110 x 210 LM Structure FE Chip Coordinates Bump Bond Pad Row#0, Col#0 Ø = FE Chip#8 Col#0 FE Chip#F Col 17 Seen from Top

2 z x M1 FE PAD#2 110 x 210 LM Structure Sensor FE Chip#8FE Chip#F M2 M3M4 W8WF M3-W8-Z M4-WF-Z M3-WF-Z M3-W8-X M2-W8-X M3-WF-Z Seen from Top

3 Wire Bond to Sensor Mark In the table on the right there are the distances from each of the 4 sensor mark to the first wire-bond pad of the 8 FE chips opposite to the barrel pigtail. The FE chips are: FE#8,…, FE#F. The reference system is the one used in the stave.

4 PITCH M2A M1AM0M1CM2C z Definition of module pitch in Z Sensor Marks


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