Presentation on theme: "Dynacal® Permeation Devices – Part Numbering System"— Presentation transcript:
1Dynacal® Permeation Devices – Part Numbering System
21XX – XXX – XXXX – XXXX – XXXX ContentsUse the button to go through the presentation page by page, or go directly to any topic below by clicking on its title.NextReturns to this pageContentsReturns to the main permeation device indexPerm IndexTopicsWhat is a permeation tube? How does it work?Types of Dynacal® permeation devicesWafer devicesTubular devicesDiffusion vialsHow are part numbers determined?Part number format1 Dynacal2 Type of device – page3 Certification4 Permeation rate determining factorDetermining factor – breakdown for wafer deviceNine most common wafer devices5 Permeant gas designation – page 1 26 Special device designation – page 1 27 Certification, special range or accuracyPart number examples –Special formulas – pageEstimate permeation rate at unknown temperatureTolerance chart – page 1 2Diffusion Vial part number format1XX – XXX – XXXX – XXXX – XXXX1234576
3What is a permeation tube? How does it work? A permeation tube is a sealed permeable membrane containing solid, liquid or liquefiable gases that permeate through the walls of the membrane at a constant rate.The device is maintained at a constant temperature to establish constant vapor pressure inside the device. This results in an equilibrium between liquid/solid and the vapor phase of the chemical compound. The vapor escapes through the walls of the permeable membrane at a constant rate as long as the set point temperature is maintained. A measured flow of an inert gas such as nitrogen, helium, argon etc. is passed through the permeation chamber where the device is housed to capture and mix with the vapor resulting in known volumetric concentration in ppm/ppb. By varying the dilution flow rate one is able to generate a wide range of concentrations using a single device.
5Designed to allow very low permeation rates Wafer devicesA wafer device is a type of permeation device that uses a metal reservoir and a circular TFE or FEP permeable membraneWafer devices have an active length of 4.6 cm and an outer diameter of 1.6 cmDesigned to allow very low permeation ratesAvailable with or without certificationAn example of a wafer type30T4:30 Wall thickness, in thousandths of an inchT TFE (Permeable membrane)4 Diameter of cap bore measured in sixteenths of an inch
6Tubular devicesDynacal tubular devices are primarily made out of different types of PTFE permeable membranes of varying wall thickness. They are available in active lengths of 0.5 to 20 cm long.Each device is custom sized to generate the required mass per unit time to match the concentration range requirements of a specific application.Typical permeation rates range from 5 ng/min to 50,000 ng/min for a single device.Available with or without certification.
7Diffusion vialsA diffusion vial is a Pyrex reservoir attached to a Pyrex stem having a fixed bore size. The reservoir is filled with the liquid or solid material of interest. When maintained at a constant temperature, the material establishes a two phase equilibrium between the solid/liquid and gas phase where the gas diffuses through the bore of the stem. By varying the stem length and the bore size, one is able to vary the permeation rate at a set point temperature.
8How are part numbers determined? There is a logical progression to each part number, once you understand the basic formula. Each number in the sequence represents a specific aspect of the device: for example, the type of tubing, the active length of the tube, or the chemical being used.1XX – XXX – XXXX – XXXX – XXXX1234567
91XX – XXX – XXXX – XXXX – XXXX Part number format1XX – XXX – XXXX – XXXX – XXXX12345671. Dynacal 2. Type of device (ref: Tech Note 1002)3. Certification (ref: Tech Note 1002)4. Permeable area Tubular: Active Length in mm (range: 0.5 cm to 20.0 cm) Wafer: Wall thickness (0.030 – 0.090”)5. Chemical number (ref: Rate Table & Price Sheet)6. Special device designation (may not apply to all devices)7. Certification, special range or special accuracy (i.e.: C, U or S)
101XX – XXX – XXXX – XXXX – XXXX Dynacal®#1 in part number format1XX – XXX – XXXX – XXXX – XXXX1234567The first digit of all Dynacal devices will be designated as “1”.
111XX – XXX – XXXX – XXXX – XXXX Type of Device#2 in part number format – general1XX – XXX – XXXX – XXXX – XXXX12345670 Tubular Device High Emission1 Tubular Device Standard Emission2 Tubular Device Low Emission3 Tubular Device Special4 Wafer Device5 Wafer Device Special7 XLT Device Standard Emission8 XLT Device Special
12Type of Device (cont’d 1) #2 in part number format - specific1XX – XXX – XXXX – XXXX – XXXX1234567TubeNumerical representation in P/NTube designationSTD1N/ASTD #1010STD #19T33HEHE #2T56LE2LE #2F56LE #3F59
13Type of Device (cont’d 2) #2 in part number format - specific1XX – XXX – XXXX – XXXX – XXXX1234567TubeNumerical representation in P/NTube designationSilicon3S56NylonN43XLT710, T33XLT #28F56XLT #3F33, 10, T33, F59Reference Technical Note 1002, page 5
14Type of Device (cont’d 3) #2 in part number format - specific1XX – XXX – XXXX – XXXX – XXXX1234567Wafer Device numerical representationValco4N/AValco high capacity5VHValco old styleOSMonitor LabsMLCSI-MELOYMEPhilips 9700PThreaded cap (Beckman)TH (BK)
151XX – XXX – XXXX – XXXX – XXXX Certification#3 in part number format1XX – XXX – XXXX – XXXX – XXXX12345670 Uncertified1 Tubular high range (>500 ng/min)2 Tubular mid range ( ng/min)3 Tubular low range ( ng/min)4 Wafer high range (>100 ng/min)5 Wafer low range ( ng/min)6 Tubular or Wafer ultra low range (5-19 ng/min)7 Special temperatures, ranges, or accuraciesNote1: 1-6 represent certification at 30°C only.Note2: Third digit remains 7 for all temperatures above 30°C for all rates..
16Permeation Rate Determining Factor #4 in part number format1XX – XXX – XXXX – XXXX – XXXX1234567001 to 200 Active tube length in mm (Formula: required rate/per cm rate)Wafer device with “T” waferWafer device with “F” waferWaver device with special wafer- y - Wafer thickness (.0y”)- - z Wafer diameter (z/16”)
17Determining Factor – Breakdown for Wafer Device #4 in part number format - specific1XX – XXX – XXXX – XXXX – XXXX1234567Each device is then represented in the part number by a three digit code.X X Xabc4a Represents the type of tubing. 5 – TFE , 6- FEPb Represents the wall thickness of the tube (range of 3-9)c Represents the diameter of the cap bore in 16th of an inch. (range of 3 or 4)
18Nine Most Common Wafer Devices Part NumberWafer Device TypePerm Rate Ratio14X-534-XXXX30T4 (.03” thick x 4/16” dia T wafer)1.053330T3 (.03” thick x 3/16” dia T wafer)0.6054340T3 (.04” thick x 3/16” dia T wafer)0.4055350T3 (.05” thick x 3/16” dia T wafer)0.2363330F3 (.03” thick x 3/16” dia F wafer)0.1464340F3 (.04” thick x 3/16” dia F wafer)0.1165350F3 (.05” thick x 3/16” dia F wafer)0.0766360F3 (.06” thick x 3/16” dia F wafer)0.0569390F3 (.09” thick x 3/16” dia F wafer)0.03Reference Technical Note 1002, Table 2
19Permeant Gas Designation #5 in part number format1XX – XXX – XXXX – XXXX – XXXX1234567Inorganic compoundsOrgano-metallic compoundsHydrocarbonsHydrocarbons containing oxygenHydrocarbons containing halogenHydrocarbons containing nitrogenHydrocarbons containing sulfurOther organic compounds
20Permeant Gas Designation (cont’d) #5 in part number format - Examples1XX – XXX – XXXX – XXXX – XXXX1234567Chemical or Gas GroupingDesignationChemical or GasInorganic compounds0110Hydrogen SulfideOrgano-metallic compounds0330Dimethyl MercuryHydrocarbons0505Pentane-NHydrocarbons containing oxygen2300FormaldehydeHydrocarbons containing halogen4201DichloromethaneHydrocarbons containing nitrogen5000Methyl AmineHydrocarbons containing sulfur6301Dimethyl DisulfideOther organic compounds7600Carbonyl Sulfide
21Special Device Designation #6 in part number format1XX – XXX – XXXX – XXXX – XXXX1234567Tube TypeTube DesignationSTD #1010STD #19T33HE #2T56LE #2F56LE #3F59CSI-MELOYMESiliconS56NylonN43XLT10, T33XLT #2XLT #3F33, 10, T33, F59
22Special Device Designation (cont’d) #6 in part number format1XX – XXX – XXXX – XXXX – XXXX1234567Wafer DeviceSpecial DesignationValco High CapacityVHMonitor Lab 8500MLMonitor Labs 8850MLRAPhilips 9700PThreaded Cap (Beckman)TH (BK)SpecialsOS, VH, LW
23Certification, Special Range or Accuracy #7 in part number format1XX – XXX – XXXX – XXXX – XXXX1234567C Certified followed by temperature in °C. (i.e.: C30 or C45)U Uncertified followed by temperature in °C. (i.e.: U30 or U50)S Special certification, special range or special accuracy
241XX – XXX – XXXX – XXXX – XXXX Part Number Example #1Sulfur Dioxide standard permeation tube, with the rate of 5000 ng/min, certified at 35°C.C351. 1 Dynacal2. 1 Tubular Device – Standard Emission tube3. 7 Special temperatures, ranges, or accuracies (customer request unit to be certified at a temperature other than 30°C)Active tube length in mm (8.3 cm). Active length is calculated using active length formulaChemical compound designation for Sulfur dioxide6. N/A for this part number7. C35 Certified at 35°C1XX – XXX – XXXX – XXXX – XXXX1234567
251XX – XXX – XXXX – XXXX – XXXX Part Number Example #2Sulfur dioxide, low emission permeation tube, with the rate of 450 ng/min , certified at 30°C.F56-C301. 1 Dynacal2. 2 Tubular Device – Low Emission3. 2 Tubular mid range ( ng/min)Active tube length in mm (1.3 cm)Sulfur dioxide numeric representation6. F56 LE #2, Low Emission Tube7. C30 Certified at 30°C1XX – XXX – XXXX – XXXX – XXXX1234567
261XX – XXX – XXXX – XXXX – XXXX Part Number Example #3Nitrogen oxide wafer device, Valco Style, certified at 40°CC401. 1 Dynacal2. 4 Wafer device3. 7 Special temperatures, ranges, or accuraciesT3 (.05” thick x 3/16” dia T wafer)Nitrogen dioxide numeric representation6. N/A for this part7. C40 Certified at 40°C1XX – XXX – XXXX – XXXX – XXXX1234567
27Special FormulasActive Length (mm) = Required Rate (ng/min) /Per cm Rate (answer will be in cm)Total Rate (ng/min) = Active Length x Per cm RateTubular DevicesFor rates:>500 ng/min Accuracy = +/- 2%ng/min Accuracy = +/- 2% or +/- 5 ng/min Whichever is greaterng/min Accuracy = Rate x 5% or +/- 2 ng/min Whichever is greater5-19 ng/min Accuracy = +/- 10%
28Special Formulas (cont’d) Wafer DevicesFor rates:>100 ng/min Accuracy = Rate x 5%ng/min Accuracy = Rate x 5% or +/- 2 ng/min Whichever is greater5-19 ng/min Accuracy = Rate x 10%
29Special Formulas to find the following: P Permeation rate (ng/min)F Flow rate (cc/min or 1pm)C Concentration (ppm or ppb)K Molar constant = 24.46/molecular wt. of compoundP = (F x C) / KF = (P x K) / CC = (P x K) / F
30Estimate permeation rate at unknown temperature log P1 = log P0 + α(T1-T0)Log = Base 10P1 = Perm rate (ng/min) at new temperature (ºC)P0 = Perm rate (ng/min) at known temperature (ºC)T1 = New temperature (ºC)T0 = Known temperature (ºC)α = Temperature coefficientNote: Before exposing device to higher temperatures, end user must consult VICI Metronics to obtain information on maximum temperature settings.
31Tolerance ChartDevice OD Rate Range Act Length (cm) (+/-) (cm)HE 0.98 >100 +/- 15% 0.5 to to 100 +/- 25% 5 to 19 +/- 50%STD/STD # >100 +/- 10% 0.5 to to 100 +/- 25% 5 to 19 +/- 50%STD # >100 +/- 15% 0.5 to to 100 +/- 25% 5 to 19 +/- 50%LE (Capsule) 0.98 >100 +/- 25% 1 or to 100 +/- 50%LE # >100 +/- 10% 0.5 to to 100 +/- 20% 5 to 19 +/- 50%
32Tolerance Chart (cont’d) Device OD Rate Range Act Length (cm) (+/-) (cm)LE # >100 +/- 15% 0.5 to to 100 +/- 20% 5 to 19 +/- 50%Silicon 0.98 >100 +/- 15% 0.5 to to 100 +/- 25% 5 to 19 +/- 50%Nylon 0.98 >100 +/- 15% 0.5 to to 100 +/- 25% 5 to 19 +/- 50%All Wafer to 100 +/- 25% 4.6Devices 5 to 19 +/- 50%
33Diffusion Vial Part Number Format 19X - XXXX – XXX/X - S123451. 19 = Diffusion Vial2. Bore size3. Chemical number4. Certification designation5. Special designation